BGA Other Function uPs,uCs & Peripheral ICs 568

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XOMAPL137AZKB3	Texas Instruments		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES			1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40		70 Cel	0 Cel			BOTTOM								Other Microprocessor ICs	1 mm	S-PBGA-B256		Not Qualified
XC7Z030-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-1FBG484C	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	85 Cel	0 Cel			BOTTOM	2.54 mm	23 mm			23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XC7Z030-1FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	23 mm			23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XC7Z030-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-2FBG484E	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	23 mm			23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XC7Z030-2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	23 mm			23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XC7Z030-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-3FBG484E	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	23 mm			23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XC7Z030-3FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-1FFG900C	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z045-1FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z045-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-2FFG900E	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z045-2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z045-3FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676	4		e1
XC7Z045-3FFG900E	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z100-1FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.1 mm	35 mm			35 mm	CMOS	1 V		1 mm	S-PBGA-B1156
XC7Z100-1FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z100-2FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.1 mm	35 mm			35 mm	CMOS	1 V		1 mm	S-PBGA-B1156
XC7Z100-2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B900
TCI6636K2HDAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER		BOTTOM	3.75 mm	40 mm	30	245	40 mm	CMOS	1 V		1 mm	S-PBGA-B1517	4		e1
TCI6636K2HDAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER		BOTTOM	3.75 mm	40 mm	30	245	40 mm	CMOS	1 V		1 mm	S-PBGA-B1517	4		e1
TCI6636K2HDAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER		BOTTOM	3.75 mm	40 mm	30	245	40 mm	CMOS	1 V		1 mm	S-PBGA-B1517	4		e1
TCI6636K2HDAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER		BOTTOM	3.75 mm	40 mm	30	245	40 mm	CMOS	1 V		1 mm	S-PBGA-B1517	4		e1
TCI6638K2KDAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER		BOTTOM	3.75 mm	40 mm	30	245	40 mm	CMOS	1 V		1 mm	S-PBGA-B1517	4		e1
TCI6638K2KDAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER		BOTTOM	3.75 mm	40 mm	30	245	40 mm	CMOS	1 V		1 mm	S-PBGA-B1517	4		e1
TCI6638K2KDAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER		BOTTOM	3.75 mm	40 mm	30	245	40 mm	CMOS	1 V		1 mm	S-PBGA-B1517	4		e1
TCI6638K2KDAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER		BOTTOM	3.75 mm	40 mm	30	245	40 mm	CMOS	1 V		1 mm	S-PBGA-B1517	4		e1
M82710-14	Mindspeed Technologies	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES				GRID ARRAY			110 Cel	-25 Cel			BOTTOM						CMOS				R-PBGA-B484
80312	Intel	MICROPROCESSOR CIRCUIT		BALL	540	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY		3 V					BOTTOM	4.1 mm	42.5 mm			42.5 mm	CMOS	3.3 V		1.27 mm	S-PBGA-B540		Not Qualified
XA7Z030-1FBG484I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY	BGA484,22X22,40				Tin/Silver/Copper (Sn/Ag/Cu)	N	BOTTOM	2.54 mm	23 mm	30	250	23 mm	CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B484	4	Not Qualified	e1
XA7Z030-1FBG484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY	BGA484,22X22,40		125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	N	BOTTOM	2.54 mm	23 mm	30	250	23 mm	CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B484	4	Not Qualified	e1
TCI6630K2LCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V			GRID ARRAY		.902 V			TIN SILVER COPPER		BOTTOM			30	245		CMOS	.95 V			S-PBGA-B900	4		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.