BGA Other Function uPs,uCs & Peripheral ICs 568

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code	No. of I/O Lines
TCI6630K2LCMS	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V			S-PBGA-B900	4		e1
TCI6630K2LDCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V			S-PBGA-B900	4		e1
TCI6630K2LDCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V			S-PBGA-B900	4		e1
TCI6630K2LSCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V			S-PBGA-B900	4		e1
TCI6630K2LSCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V			S-PBGA-B900	4		e1
TCI6630K2LXCMS2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V			S-PBGA-B900	4		e1
TCI6630K2LXCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V			S-PBGA-B900	4		e1
TCI6630K2LXCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V			S-PBGA-B900	4		e1
TCI6630K2LXCMS	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V			S-PBGA-B900	4		e1
DLPC230TZDQRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	AEC-Q100	GRID ARRAY		1.045 V	105 Cel	-40 Cel		BOTTOM	2.352 mm	23 mm						23 mm	CMOS	1.1 V		1 mm	S-PBGA-B324
DLPC6401ZFF	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	419	BGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY		1.116 V	55 Cel	0 Cel		BOTTOM	2.36 mm	23 mm						23 mm	CMOS	1.2 V		1 mm	S-PBGA-B419
DLPC900ZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel	0 Cel		BOTTOM	2.42 mm	27 mm		16	20 MHz			27 mm	CMOS	1.15 V	I2C; SPI; UART; USB	1 mm	S-PBGA-B516				9
XC7Z030-1SBG485C	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA485,22X22,32	.95 V	85 Cel	0 Cel		BOTTOM	2.44 mm	19 mm						19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z030-1SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	2.44 mm	19 mm						19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z030-2SBG485E	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	0 Cel		BOTTOM	2.44 mm	19 mm						19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z030-2SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	2.44 mm	19 mm						19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z030-3SBG485E	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	0 Cel		BOTTOM	2.44 mm	19 mm						19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z030-L2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	23 mm						23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XC7Z030-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-L2SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	2.44 mm	19 mm						19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z035-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	2.54 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	3.24 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-1FFG900C	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel	0 Cel		BOTTOM	3.35 mm	31 mm						31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-1FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	31 mm						31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	2.54 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-2FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel		BOTTOM	3.35 mm	31 mm						31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-2FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	31 mm						31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-3FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	2.54 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-3FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel		BOTTOM	3.35 mm	31 mm						31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-L2FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	31 mm						31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z045-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-L2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z100-L2FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.1 mm	35 mm						35 mm	CMOS	1 V		1 mm	S-PBGA-B1156
XC7Z100-L2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B900
DLPC410ZYR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V	85 Cel	0 Cel		BOTTOM	3 mm	27 mm				NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS	1 V		1 mm	S-PBGA-B676
CYTMA525-49FNI25ZZT	Cypress Semiconductor	MICROPROCESSOR CIRCUIT		BALL	49	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY		1.71 V				BOTTOM			IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY						CMOS				R-PBGA-B49
DRA746APGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES		AEC-Q100	GRID ARRAY					TIN SILVER COPPER	BOTTOM						30	250		CMOS				X-PBGA-B760	3	1500 rpm	e1
XA7Z030-1FBV484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	GRID ARRAY			125 Cel	-40 Cel		BOTTOM									CMOS				S-PBGA-B484

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.