BGA Other Function uPs,uCs & Peripheral ICs 568

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	Maximum Seated Height	Width	Additional Features	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code
XCVM1502-2MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM					CMOS	.8 V		S-PBGA-B1760
XCVM1802-2LSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1760,42X42,36	.676 V	110 Cel	0 Cel	BOTTOM	3.89 mm	40 mm		40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVM1802-2MSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.89 mm	40 mm		40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1302-1LLIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVM1302-1LSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	100 Cel	0 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVM1302-1MLIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVM1302-1MSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	100 Cel	0 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVM1402-1MSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	100 Cel	0 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVM1302-1MSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVM1302-2LSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	0 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVM1302-2MLEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	0 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVM1302-2MSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVM1402-1LSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	100 Cel	0 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVM1402-1MLIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVM1402-2LSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	0 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVM1402-2MLIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVM1402-2MSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	0 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVM1802-2LLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel	BOTTOM	3.89 mm	40 mm		40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVM1802-2HSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY	BGA1760,42X42,36	.854 V	110 Cel	-40 Cel	BOTTOM	3.89 mm	40 mm		40 mm	CMOS	.88 V	.92 mm	S-PBGA-B1760
XCVM1402-2HSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY	BGA1596,40X40,36	.854 V	110 Cel	-40 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.88 V	.92 mm	S-PBGA-B1596
XCVM1502-1LSINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm		35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1502-1MSINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm		35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1502-2LSENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	3.83 mm	35 mm		35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1502-1MLINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm		35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1502-2MSENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	3.83 mm	35 mm		35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1302-2HSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY	BGA1596,40X40,36	.854 V	110 Cel	-40 Cel	BOTTOM	3.75 mm	37.5 mm		37.5 mm	CMOS	.88 V	.92 mm	S-PBGA-B1596
XCVM1502-2LLENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	3.83 mm	35 mm		35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1502-2MLINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm		35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1502-2MSINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm		35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1502-1LLINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm		35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1502-1LSENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	100 Cel	0 Cel	BOTTOM	3.83 mm	35 mm		35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1502-1MSENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	100 Cel	0 Cel	BOTTOM	3.83 mm	35 mm		35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1502-2MLENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	3.83 mm	35 mm		35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
MPFS250TS-FCG1152I	Microchip Technology	PROGRAMMABLE SoC	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	-40 Cel	BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY	35 mm	CMOS	1 V	1 mm	S-PBGA-B1152
MPFS250T-1FCG1152E	Microchip Technology	PROGRAMMABLE SoC	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	0 Cel	BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY	35 mm	CMOS	1 V	1 mm	S-PBGA-B1152
MPFS250T-1FCG1152I	Microchip Technology	PROGRAMMABLE SoC	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	-40 Cel	BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY	35 mm	CMOS	1 V	1 mm	S-PBGA-B1152
MPFS250T-FCG1152E	Microchip Technology	PROGRAMMABLE SoC	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	0 Cel	BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY	35 mm	CMOS	1 V	1 mm	S-PBGA-B1152
MPFS250T-FCG1152I	Microchip Technology	PROGRAMMABLE SoC	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	-40 Cel	BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY	35 mm	CMOS	1 V	1 mm	S-PBGA-B1152
MPFS250TLS-FCG1152I	Microchip Technology	PROGRAMMABLE SoC	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	-40 Cel	BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY	35 mm	CMOS	1 V	1 mm	S-PBGA-B1152
OSD3358-1G-ISM	Octavo Systems	SoC	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA256,16X16,50		85 Cel	-40 Cel	BOTTOM	2.58 mm	21 mm		21 mm	CMOS	1.1 V	1.27 mm	S-PBGA-B256

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.