BGA Other Function uPs,uCs & Peripheral ICs 568

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code	No. of I/O Lines
XCZU49DR-1FFVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU49DR-1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM								CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU49DR-1FSVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU49DR-1FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU49DR-2FFVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU49DR-2FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU49DR-2FSVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU49DR-2FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU49DR-L1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.72 V			R-PBGA-B1760	4	e1
XCZU49DR-L1FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.72 V			R-PBGA-B1760	4	e1
XCZU49DR-L2FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.72 V			R-PBGA-B1760	4	e1
XC7Z045-1FBG676CES	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	2.54 mm	27 mm					27 mm	CMOS	1 V		1 mm	S-PBGA-B676
DLPC900AZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel	0 Cel		BOTTOM	2.42 mm	27 mm	16	20 MHz			27 mm	CMOS	1.15 V	I2C; SPI; UART; USB	1 mm	S-PBGA-B516			9
10AS057K2F40E1HG	Intel	SoC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1517,39X39,40		100 Cel	0 Cel		BOTTOM	3.5 mm	40 mm					40 mm	TSMC			1 mm	S-PBGA-B1517
XAZU7EV-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.97 mm	31 mm	0		30	245	31 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4	e1
XAZU7EV-1FBVB900Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA900,30X30,40		125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.97 mm	31 mm	0		30	245	31 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4	e1
WP32C2W6NFEI-400B2	Microchip Technology	MICROPROCESSOR CIRCUIT		BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA896(UNSPEC)				TIN SILVER COPPER	BOTTOM								CMOS				S-PBGA-B896		e1
XCVM1402-2LLEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	0 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.7 V		.92 mm	S-PBGA-B1596
XCVM1402-2MLEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.8 V		.92 mm	S-PBGA-B1596
XCVM1402-2MSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.8 V		.92 mm	S-PBGA-B1596
XCVM1502-1LLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM								CMOS	.7 V			S-PBGA-B1760
XCVM1502-1LSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM								CMOS	.7 V			S-PBGA-B1760
XCVM1502-2LSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM								CMOS	.7 V			S-PBGA-B1760
XCVM1502-2MLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM								CMOS	.8 V			S-PBGA-B1760
XCVM1802-1LSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel		BOTTOM	3.89 mm	40 mm					40 mm	CMOS	.7 V		.92 mm	S-PBGA-B1760
XCVM1802-1MSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.89 mm	40 mm					40 mm	CMOS	.8 V		.92 mm	S-PBGA-B1760
XCVM1802-2MSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	3.89 mm	40 mm					40 mm	CMOS	.8 V		.92 mm	S-PBGA-B1760
XCVM1402-1LSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.7 V		.92 mm	S-PBGA-B1596
XCVM1402-1MSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.8 V		.92 mm	S-PBGA-B1596
XCVM1502-2LLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM								CMOS	.7 V			S-PBGA-B1760
XCVM1802-1LLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel		BOTTOM	3.89 mm	40 mm					40 mm	CMOS	.7 V		.92 mm	S-PBGA-B1760
XCVM1802-2MLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	3.89 mm	40 mm					40 mm	CMOS	.8 V		.92 mm	S-PBGA-B1760
XCVM1802-2MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.89 mm	40 mm					40 mm	CMOS	.8 V		.92 mm	S-PBGA-B1760
XCVM1302-1LSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.7 V		.92 mm	S-PBGA-B1596
XCVM1502-1MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM								CMOS	.8 V			S-PBGA-B1760
XCVM1502-1MSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM								CMOS	.8 V			S-PBGA-B1760
XCVM1502-2MSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM								CMOS	.8 V			S-PBGA-B1760
XCVM1502-2MSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM								CMOS	.8 V			S-PBGA-B1760
XCVM1802-1LSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1760,42X42,36	.676 V	100 Cel	0 Cel		BOTTOM	3.89 mm	40 mm					40 mm	CMOS	.7 V		.92 mm	S-PBGA-B1760
XCVM1802-1MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.89 mm	40 mm					40 mm	CMOS	.8 V		.92 mm	S-PBGA-B1760
XCVM1802-1MSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1760,42X42,36	.775 V	100 Cel	0 Cel		BOTTOM	3.89 mm	40 mm					40 mm	CMOS	.8 V		.92 mm	S-PBGA-B1760
XCVM1802-2LLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1760,42X42,36	.676 V	110 Cel	0 Cel		BOTTOM	3.89 mm	40 mm					40 mm	CMOS	.7 V		.92 mm	S-PBGA-B1760
XCVM1302-2LLEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	0 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.7 V		.92 mm	S-PBGA-B1596
XCVM1302-2MLIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.8 V		.92 mm	S-PBGA-B1596
XCVM1302-2MSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.8 V		.92 mm	S-PBGA-B1596
XCVM1402-1LLIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.7 V		.92 mm	S-PBGA-B1596
XCVM1502-1LSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM								CMOS	.7 V			S-PBGA-B1760
XCVM1502-1MSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM								CMOS	.8 V			S-PBGA-B1760

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.