SQUARE Other Function uPs,uCs & Peripheral ICs 1,672

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code
MCIMX6G1CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel	Tin/Silver (Sn/Ag)		BOTTOM	1.32 mm	14 mm				40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3		e2
MCIMX6G2CVK05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel			BOTTOM	1.23 mm	9 mm				40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MCIMX6G2CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel			BOTTOM	1.32 mm	14 mm				40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX6G3CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.15 V	105 Cel	-40 Cel			BOTTOM	1.32 mm	14 mm				40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
XA7Z030-1FBV484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	GRID ARRAY			125 Cel	-40 Cel			BOTTOM									CMOS				S-PBGA-B484
MCIMX7D3DVK10SC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.045 V	95 Cel	0 Cel			BOTTOM	1.1 mm	12 mm				40	260	12 mm	CMOS	1.1 V		.4 mm	S-PBGA-B488	3
MCIMX7D3EVK10SC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.045 V	105 Cel	-20 Cel			BOTTOM	1.1 mm	12 mm				40	260	12 mm	CMOS	1.1 V		.4 mm	S-PBGA-B488	3
MCIMX7D7DVM10SC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,30	1.045 V	95 Cel	0 Cel			BOTTOM	1.4 mm	19 mm				40	260	19 mm	CMOS	1.1 V		.75 mm	S-PBGA-B541	3
DRA744BJGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1000 rpm	e1
DRA744BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1000 rpm	e1
DRA745BLGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1176 rpm	e1
DRA745BLGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1176 rpm	e1
DRA746BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1500 rpm	e1
DRA746BPGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1500 rpm	e1
DRA750BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm		48	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1000 rpm	e1
DRA752BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm				30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
DRA752BPGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm				30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
DRA756BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1500 rpm	e1
XCZU2CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU2CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU2CG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU2CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)			30	250		CMOS	.72 V			S-PBGA-B784	4		e1
XCZU2EG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU2EG-3SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM						30	250		CMOS	.9 V			S-PBGA-B484	4		e1
XCZU3CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU3CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU3CG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU3CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)			30	250		CMOS	.72 V			S-PBGA-B784	4		e1
XCZU3EG-3SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM						30	250		CMOS	.9 V			S-PBGA-B784	4		e1
XCZU4CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU4CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU4CG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU4CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)			30	250		CMOS	.72 V			S-PBGA-B784	4		e1
XCZU4CG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)			30	250		CMOS	.72 V			S-PBGA-B784	4		e1
XCZU4EG-3SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.9 V			S-PBGA-B784	4		e1
XCZU5CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU5CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU5CG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU5CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)			30	250		CMOS	.72 V			S-PBGA-B784	4		e1
XCZU5CG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)			30	250		CMOS	.72 V			S-PBGA-B784	4		e1
XCZU5EG-3SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.927 V		GRID ARRAY	BGA784,28X28,32	.873 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm	23 mm				30	250	23 mm	CMOS	.9 V		.8 mm	S-PBGA-B784	4		e1
XCZU5EV-3SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250		CMOS	.9 V			S-PBGA-B784	4		e1
UCD3138128APFCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.2 mm	12 mm		0	2 MHz	30	260	12 mm	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G80	3		e4
UCD3138128APFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.2 mm	12 mm		0	2 MHz	30	260	12 mm	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G80	3		e4
EFR32MG1B132F256GM32-C0	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel	-40 Cel			QUAD	.9 mm	5 mm						5 mm	CMOS	3.3 V		.5 mm	S-XQCC-N32
EFR32MG1V132F256GM32-C0	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel	-40 Cel			QUAD	.9 mm	5 mm						5 mm	CMOS	3.3 V		.5 mm	S-XQCC-N32
LS1043ASE7MNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	2.07 mm	21 mm				30	250	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621	3		e1
AM4372BZDN60	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.144 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.056 V	90 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	17 mm				30	260	17 mm	CMOS	1.1 V		.65 mm	S-PBGA-B491	3		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.