SQUARE Other Function uPs,uCs & Peripheral ICs 1,672

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code
AM4372BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3		e1
AM4372BZDNA60	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.144 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.1 V		.65 mm	S-PBGA-B491	3		e1
AM4372BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3		e1
MCIMX6Y0CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel			BOTTOM	1.32 mm	14 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX6Y0DVM05AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel			BOTTOM	1.32 mm	14 mm			40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX6Y1CVK05AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	105 Cel	-40 Cel			BOTTOM	1.23 mm	9 mm			40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MCIMX6Y1CVM05AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.32 mm	14 mm			40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3		e1
MCIMX6Y1DVK05AA	NXP Semiconductors	SoC	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel			BOTTOM	1.23 mm	9 mm			40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MCIMX6Y1DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel			BOTTOM	1.32 mm	14 mm			40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX6Y2DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel			BOTTOM	1.32 mm	14 mm			40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX6Y7DVK05AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel			BOTTOM	1.23 mm	9 mm			40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MEC1418-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	.8 mm	9 mm					9 mm	CMOS	3 V		.65 mm	S-PBGA-B144			e1
MKW21Z256VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER		1.71 V	105 Cel	-40 Cel	NICKEL GOLD		QUAD					40	260		CMOS	3.3 V			S-XQCC-N48	3		e4
MKW31Z512VHT4R	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER		1.71 V	105 Cel	-40 Cel	NICKEL GOLD		QUAD					40	260		CMOS	3.3 V			S-XQCC-N48	3		e4
MKW41Z256VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER		1.71 V	105 Cel	-40 Cel	NICKEL GOLD		QUAD					40	260		CMOS	3.3 V			S-XQCC-N48	3		e4
MKW41Z512VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER		1.71 V	105 Cel	-40 Cel	NICKEL GOLD		QUAD					40	260		CMOS	3.3 V			S-XQCC-N48	3		e4
UCD3138ARJAR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	YES	QUAD	1 mm	6 mm			30	260	6 mm	CMOS	3.3 V		.5 mm	S-PQCC-N40	2		e4
UCD3138ARJAT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	YES	QUAD	1 mm	6 mm			30	260	6 mm	CMOS	3.3 V		.5 mm	S-PQCC-N40	2		e4
ADSP-SC584BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel			BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
EFR32MG1V132F256GM32-C0R	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel	-40 Cel			QUAD	.9 mm	5 mm					5 mm	CMOS	3.3 V		.5 mm	S-XQCC-N32
STWBC-WATR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	105 Cel	-40 Cel			QUAD	1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm	CMOS	3.3 V		.5 mm	S-XQCC-N32
STWBC-WA	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	105 Cel	-40 Cel			QUAD	1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm	CMOS	3.3 V		.5 mm	S-XQCC-N32
FT245BL-REEL	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	FLATPACK, LOW PROFILE		4.35 V	70 Cel	0 Cel	MATTE TIN		QUAD	1.6 mm	7 mm			30	260	7 mm	CMOS	5 V		.8 mm	S-PQFP-G32	3		e3
AM5716AABCDA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
AM5716AABCDEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
AM5716AABCD	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
AM5716AABCXA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
AM5716AABCXEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
AM5716AABCX	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
AM5718AABCXA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3	1500 rpm	e1
AM5718AABCX	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3	1500 rpm	e1
ADSP-21583BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-21583CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-21583KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-21584BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-21584CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-21584KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC582BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC582CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC582KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC583BBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC583BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC583CBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC583CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC583KBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC583KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC584BBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel			BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584CBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel			BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.