SQUARE Other Function uPs,uCs & Peripheral ICs 1,672

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
ADSP-SC584CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm	500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584KBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm	500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm	500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC587BBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm	500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC587KBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm	500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC589BBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm	500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC589KBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm	500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ATWILC1000B-MU-Y	Microchip Technology	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm				5 mm	CMOS	1.1 V		.4 mm	S-XQCC-N40
XCZU2CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XCZU2EG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XCZU3CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XCZU3EG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XCZU4CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XCZU5CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
EFR32FG1P131F256GM48-C0R	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm				7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
EFR32FG1P131F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm				7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
EFR32FG1V131F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm				7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
MPXY8510DK016T1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG		1.8 V	125 Cel	-40 Cel		QUAD	2.3 mm	9 mm		NOT SPECIFIED	NOT SPECIFIED	9 mm	CMOS	3 V		.65 mm	S-XQCC-N32
MPXY8600DK6T1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG		1.8 V	125 Cel	-40 Cel		QUAD	2.3 mm	9 mm		NOT SPECIFIED	NOT SPECIFIED	9 mm	CMOS	3 V		.65 mm	S-XQCC-N32
MCIMX6Y2DVM09AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX6Y7DVM09AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
XAZU2EG-1SBVA484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	19 mm		30	250	19 mm	CMOS	.85 V		.8 mm	S-PBGA-B484	3	e1
XAZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm		30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3	e1
XAZU2EG-1SFVA625Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm		30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3	e1
XAZU2EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU2EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU2EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm		30	250	21 mm	CMOS	.72 V		.8 mm	S-PBGA-B625	3	e1
XAZU2EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.72 V		.8 mm	S-PBGA-B784	4	e1
XAZU3EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm		30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3	e1
XAZU3EG-1SFVA625Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm		30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3	e1
XAZU3EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU3EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU3EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm		30	250	21 mm	CMOS	.72 V		.8 mm	S-PBGA-B625	3	e1
XAZU3EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.72 V		.8 mm	S-PBGA-B784	4	e1
XAZU4EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU4EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.72 V		.8 mm	S-PBGA-B784	4	e1
XAZU5EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU5EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.72 V		.8 mm	S-PBGA-B784	4	e1
XC7Z007S-1CLG225C	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	85 Cel	0 Cel		BOTTOM	1.5 mm	13 mm				13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z007S-1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.5 mm	13 mm				13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z007S-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel	0 Cel		BOTTOM	1.6 mm	17 mm				17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z007S-2CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	0 Cel		BOTTOM	1.5 mm	13 mm				13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z007S-2CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.5 mm	13 mm				13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z007S-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel		BOTTOM	1.6 mm	17 mm				17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z007S-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	17 mm				17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z012S-1CLG485C	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	85 Cel	0 Cel		BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z012S-1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B485

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.