INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 792

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	DAC Channels	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
ADSP-SC584BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel			-40 Cel			BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3
STWBC-WATR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	105 Cel			-40 Cel			QUAD		1 mm			5 mm							NOT SPECIFIED	NOT SPECIFIED	5 mm			CMOS		3.3 V							.5 mm		S-XQCC-N32
STWBC-WA	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	105 Cel			-40 Cel			QUAD		1 mm			5 mm							NOT SPECIFIED	NOT SPECIFIED	5 mm			CMOS		3.3 V							.5 mm		S-XQCC-N32
AM5716AABCDA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3			e1
AM5716AABCDEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3			e1
AM5716AABCXA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3			e1
AM5716AABCXEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3			e1
AM5716AABCX	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3			e1
AM5718AABCXA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3	1500 rpm		e1
ADSP-21583BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-21583CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-21584BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-21584CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC582BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC582CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC583BBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC583BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC583CBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC583CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC584BBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel			-40 Cel			BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC584CBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel			-40 Cel			BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC584CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel			-40 Cel			BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC587BBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel			-40 Cel			BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC589BBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel			-40 Cel			BOTTOM		1.5 mm			19 mm						500 MHz	30	260	19 mm			CMOS		1.1 V						SPI; UART	.8 mm		S-PBGA-B349	3
JN5169-001-M03-2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	27		RECTANGULAR	UNSPECIFIED		YES	3.6 V				MICROELECTRONIC ASSEMBLY		2 V	85 Cel			-40 Cel			UNSPECIFIED					16 mm									21 mm			CMOS		3.3 V							1.27 mm		R-XXMA-N27
CC3220MODSM2MOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	NO	YES	3.6 V	8	0	NO	CHIP CARRIER		2.3 V	85 Cel	CORTEX-M4	0	-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	1024000	256	17.5 mm	0		YES	TIMER(4), WDT	0		30	260	20.5 mm	4	262144	CMOS	4-Ch 12-Bit	3.3 V	2	NO	2	I2C, I2S, SD, SPI, UART	FLASH		1.27 mm	FIXED POINT	R-XBCC-B63	3	2400 rpm	YES	e4	8	25
XAZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.43 mm			21 mm							30	250	21 mm			CMOS		.85 V							.8 mm		S-PBGA-B625	3			e1
XAZU2EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm							30	250	23 mm			CMOS		.85 V							.8 mm		S-PBGA-B784	4			e1
XAZU2EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.43 mm			21 mm							30	250	21 mm			CMOS		.72 V							.8 mm		S-PBGA-B625	3			e1
XAZU2EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm							30	250	23 mm			CMOS		.72 V							.8 mm		S-PBGA-B784	4			e1
XAZU3EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.43 mm			21 mm							30	250	21 mm			CMOS		.85 V							.8 mm		S-PBGA-B625	3			e1
XAZU3EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm							30	250	23 mm			CMOS		.85 V							.8 mm		S-PBGA-B784	4			e1
XAZU3EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.43 mm			21 mm							30	250	21 mm			CMOS		.72 V							.8 mm		S-PBGA-B625	3			e1
XAZU3EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm							30	250	23 mm			CMOS		.72 V							.8 mm		S-PBGA-B784	4			e1
XAZU4EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm							30	250	23 mm			CMOS		.72 V							.8 mm		S-PBGA-B784	4			e1
XAZU5EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm							30	250	23 mm			CMOS		.85 V							.8 mm		S-PBGA-B784	4			e1
XAZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm							30	250	23 mm			CMOS		.72 V							.8 mm		S-PBGA-B784	4			e1
AX-SFUS-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel			-40 Cel	NICKEL GOLD PALLADIUM		QUAD		1 mm			5 mm							30	260	7 mm			CMOS		3 V							.5 mm		R-XQCC-N40	1
AX-SFUS-API-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel			-40 Cel	NICKEL GOLD PALLADIUM		QUAD		1 mm			5 mm							30	260	7 mm			CMOS		3 V							.5 mm		R-XQCC-N40	1
MCIMX6Y2CVM05AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel			-40 Cel			BOTTOM		1.32 mm			14 mm							40	260	14 mm			CMOS									.8 mm		S-PBGA-B289
MCIMX6Y2CVM08AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.325 V	105 Cel			-40 Cel			BOTTOM		1.32 mm			14 mm							40	260	14 mm			CMOS									.8 mm		S-PBGA-B289
NRF52810-QFAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel			-40 Cel			QUAD		.95 mm			6 mm							NOT SPECIFIED	NOT SPECIFIED	6 mm			CMOS		3 V							.4 mm		S-XQCC-N48
MCIMX6S7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE					40	260	21 mm			CMOS									.8 mm		S-PBGA-B624	3			e1
MCIMX6U7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE					40	260	21 mm			CMOS									.8 mm		S-PBGA-B624	3			e1
CC1312R1F3RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			7 mm		DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF					30	260	7 mm		81920	CMOS		3 V							.5 mm		S-PQCC-N48	3			e4		30
LS1043AXN7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V				GRID ARRAY, FINE PITCH		.87 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm			21 mm		ALSO OPERATES AT 1V SUPPLY NOM					30	250	21 mm			CMOS		.9 V							.8 mm		S-PBGA-B621	3			e1
LS1023AXE8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V				GRID ARRAY, FINE PITCH		.97 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm			23 mm		ALSO OPERATES AT 1V SUPPLY NOM					30	250	23 mm			CMOS		1 V							.8 mm		S-PBGA-B780	3			e1
LS1043AXE8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V				GRID ARRAY, FINE PITCH		.87 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm			23 mm		ALSO OPERATES AT 1V SUPPLY NOM					30	250	23 mm			CMOS		.9 V							.8 mm		S-PBGA-B780	3			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.