INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 792

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
MCIMX6G2CVK05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm			40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MCIMX6G3CVK05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm			40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MCIMX6Q7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3	e1
MCIMX6X1CVO08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm	24MHZ NOMINAL FREQUENCY AVAILABLE		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	e1
MCIMX6X3CVK08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	14 mm	24MHZ NOMINAL FREQUENCY AVAILABLE		40	260	14 mm	CMOS	1.8 V		.65 mm	S-PBGA-B400	3	e1
MCIMX6X4CVM08AC	NXP Semiconductors	SoC	INDUSTRIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	19 mm			40	260	19 mm	CMOS			.8 mm	S-PBGA-B529	3	e1
66AK2G12ABYA100E	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm			30	260	21 mm	CMOS	1 V		.8 mm	S-PBGA-B625	3	e1
66AK2G12ABYA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm			30	260	21 mm	CMOS	1 V		.8 mm	S-PBGA-B625	3	e1
66AK2G12ABYA60E	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm			30	260	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B625	3	e1
66AK2G12ABYA60	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm			30	260	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B625	3	e1
DLPC230TZDQRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	AEC-Q100	GRID ARRAY		1.045 V	105 Cel	-40 Cel		BOTTOM	2.352 mm	23 mm					23 mm	CMOS	1.1 V		1 mm	S-PBGA-B324
MIMXRT1052CVL5A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	10 mm	24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE				10 mm	CMOS			.65 mm	S-PBGA-B196
MIMXRT1052CVL5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	10 mm	24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE		40	260	10 mm	CMOS			.65 mm	S-PBGA-B196	3	e1
AX8052F151-2-TX30	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.28,20	2.2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm	5 mm				260	7 mm	CMOS	3 V		.5 mm	R-PQCC-N40	1	e4
AX8052F151-3-TX30	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.28,20	2.2 V	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	1 mm	5 mm			30	260	7 mm	CMOS	3 V		.5 mm	R-PQCC-N40	1
MIMXRT1021CAF4A	NXP Semiconductors	SoC	INDUSTRIAL														TIN						40	260							3	e3
MIMXRT1061CVJ5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm	12 mm			40	260	12 mm	CMOS			.8 mm	S-PBGA-B196	3	e2
MIMXRT1062CVJ5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm	12 mm			40	260	12 mm	CMOS			.8 mm	S-PBGA-B196	3	e2
MIMXRT1062CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm			40	260	10 mm	CMOS			.65 mm	S-PBGA-B196	3	e1
MIMXRT1051CVJ5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm	12 mm			40	260	12 mm	CMOS			.8 mm	S-PBGA-B196	3	e2
MCIMX280CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V		40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX281AVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	AEC-Q100	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V		40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX283CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V		40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX285AVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	AEC-Q100	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V		40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX286CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V		40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX287CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V		40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
A7102CLTK2/T0BC2AJ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	90 Cel	-40 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY				4 mm	CMOS	1.8 V		.8 mm	S-PDSO-N8
A7102CLTK2/T0BC2XJ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	90 Cel	-40 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY				4 mm	CMOS	1.8 V		.8 mm	S-PDSO-N8
ATWINC1500B-MU-Y	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm		48 MHz			5 mm	CMOS	3.3 V		.4 mm	S-PQCC-N40		e3
ATWINC1510B-MU-Y	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm		48 MHz			5 mm	CMOS	3.3 V		.4 mm	S-PQCC-N40		e3
ADUCM330WFSBCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	18 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.24SQ,20	3.6 V	115 Cel	-40 Cel		QUAD	1 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm	CMOS		SPI	.5 mm	S-XQCC-N32
ATECC608A-TFLXTLSS	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm					4.9 mm	CMOS			1.27 mm	R-PDSO-G8		e4
CEC1712H-S2-I/SX	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,25	1.71 V	85 Cel	-40 Cel		BOTTOM	.8 mm	7 mm	3.3V NOM SUPPLY ALSO AVAILABLE				7 mm	CMOS	1.8 V	I2C, QSPI, UART	.65 mm	S-PBGA-B84
AM4376BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3	e1
AM4376BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
AM4376BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3	e1
AM4376BZDND30	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	.912 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	.95 V		.65 mm	S-PBGA-B491	3	e1
AM4376BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
AM4377BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
AM4377BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3	e1
AM4377BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
AM4378BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3	e1
AM4378BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
AM4378BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3	e1
AM4378BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
AM4379BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3	e1
AM4379BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
STWBCTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			105 Cel	-40 Cel		QUAD	1 mm	5 mm					5 mm	CMOS	5 V		.5 mm	S-XQCC-N32

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.