INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 792

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MSP430F6778AIPZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

524288

16

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

14 mm

16384

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

25 rpm

e4

8

62

MSP430F6778AIPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

524288

16

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

14 mm

16384

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

25 rpm

e4

8

62

MSP430F6779AIPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

524288

32

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

20 mm

32768

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

25 rpm

e4

8

90

MSP430F6779AIPZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

524288

32

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

14 mm

32768

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

25 rpm

e4

8

62

MSP430F6779AIPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

524288

32

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

14 mm

32768

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

25 rpm

e4

8

62

MTCH6102-I/SS

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

TS 16949

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

1.8 V

85 Cel

-40 Cel

MATTE TIN

DUAL

2 mm

5.3 mm

40

260

10.2 mm

CMOS

3 V

.65 mm

R-PDSO-G28

2

e3

MSP430F67451IPEUR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

14 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

30

260

20 mm

CMOS

3.3 V

.5 mm

R-PQFP-G128

3

e4

MSP430F67461IPEUR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

14 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

30

260

20 mm

CMOS

3.3 V

.5 mm

R-PQFP-G128

3

e4

MSP430F67481IPEUR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

14 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

30

260

20 mm

CMOS

3.3 V

.5 mm

R-PQFP-G128

3

e4

ADN2855ACPZ

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1 mm

5 mm

30

260

5 mm

CMOS

3.3 V

.5 mm

S-XQCC-N32

3

Not Qualified

e3

CY8CPLC20-28PVXI

Cypress Semiconductor

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

-40 Cel

MATTE TIN

DUAL

2 mm

5.3 mm

20

260

10.2 mm

CMOS

14 mA

5 V

Other Microprocessor ICs

.65 mm

R-PDSO-G28

3

Not Qualified

e3

CY8C21434-24LKXIT

Cypress Semiconductor

PROGRAMMABLE SoC

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

4.75 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

5 mm

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

40

260

5 mm

CMOS

5 V

Microcontrollers

.5 mm

S-XQCC-N32

3

Not Qualified

e4

CY8C21434-24LKXI

Cypress Semiconductor

PROGRAMMABLE SoC

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

4.75 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

5 mm

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

40

260

5 mm

CMOS

5 V

Microcontrollers

.5 mm

S-XQCC-N32

3

Not Qualified

e4

SN74LVT8980ADWRG4

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

3/3.3

SMALL OUTLINE

SOP24,.4

2.7 V

85 Cel

LVT

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

2.65 mm

7.5 mm

8

NOT SPECIFIED

260

15.4 mm

CMOS

7 mA

3 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G24

1

Not Qualified

e4

C8051F062-GQ

Silicon Labs

SoC

INDUSTRIAL

3

TIN

40

260

Microcontrollers

3

Not Qualified

e3

TMS320DM6467CZUTAV

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CZUTD7

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

DS2460S

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

3/5

SMALL OUTLINE

SOP8,.25

2.7 V

85 Cel

-40 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

245

4.9 mm

CMOS

.5 mA

Other Microprocessor ICs

1.27 mm

R-PDSO-G8

Not Qualified

e0

TMS320DM365ZCE21

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

32

30

260

13 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

TMS320DM365ZCE30

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

32

1.35,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.28 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

32

30

260

13 mm

CMOS

1.35 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

TMS320DM365ZCEF

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

32

30

260

13 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

TMS320DM6467TZUTD1

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

DM355SDZCEA216

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355CZCEA21

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355DZCEA21

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM6446BZWTA

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

P82B715TD,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

12 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.75 mm

3.9 mm

30

260

4.9 mm

BIPOLAR

5 V

1.27 mm

R-PDSO-G8

1

Not Qualified

e4

TDA8007BHL/C2,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

2.7 V

85 Cel

-40 Cel

SILVER

QUAD

1.6 mm

7 mm

7 mm

CMOS

315 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

1

Not Qualified

e4

TDA8007BHL/C3,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

2.7 V

85 Cel

-40 Cel

Tin (Sn)

QUAD

1.6 mm

7 mm

30

260

7 mm

CMOS

315 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

1

Not Qualified

e3

MSP430F67491IPEUR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

14 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

30

260

20 mm

CMOS

3.3 V

.5 mm

R-PQFP-G128

3

e4

MSP430F67491IPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

32

14 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

0

30

260

20 mm

32768

CMOS

3.3 V

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

e4

MSP430F67491IPZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

14 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

30

260

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

3

e4

NN325TRHARQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1 mm

6 mm

0

16 MHz

30

260

6 mm

1024

CMOS

2.7 V

I2C; SPI; UART

.5 mm

S-PQCC-N40

3

e4

TMS320DM6446AZWTA

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

P82B715DG4

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

12 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

1.75 mm

3.9 mm

VCCB(Min)(V) is 3, VCCB(Max)(V) is 12

0

.4 MHz

NOT SPECIFIED

260

4.9 mm

BIPOLAR

5 V

I2C

1.27 mm

R-PDSO-G8

1

Not Qualified

e4

P82B715PE4

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

12 V

IN-LINE

4.5 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

5.08 mm

7.62 mm

VCCB(Min)(V) is 3, VCCB(Max)(V) is 12

0

.4 MHz

NOT SPECIFIED

260

9.81 mm

BIPOLAR

5 V

I2C

2.54 mm

R-PDIP-T8

1

Not Qualified

e4

AT43USB326-AU

Atmel

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

5

FLATPACK

QFP48,.35SQ,20

85 Cel

-40 Cel

QUAD

40 mA

5 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

Not Qualified

MCP25020-I/P

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

TS 16949

8

3/5

IN-LINE

DIP14,.3

2.7 V

85 Cel

-40 Cel

MATTE TIN

DUAL

4.318 mm

7.62 mm

19.05 mm

CMOS

5 V

Parallel IO Port

2.54 mm

R-PDIP-T14

Not Qualified

e3

MCP25020-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

260

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MCP25025-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MCP25025T-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MCP25050-I/P

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

TS 16949

8

3/5

IN-LINE

DIP14,.3

2.7 V

85 Cel

-40 Cel

MATTE TIN

DUAL

4.318 mm

7.62 mm

260

19.05 mm

CMOS

5 V

Parallel IO Port

2.54 mm

R-PDIP-T14

Not Qualified

e3

MCP25055-I/P

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

TS 16949

8

3/5

IN-LINE

DIP14,.3

2.7 V

85 Cel

-40 Cel

MATTE TIN

DUAL

4.318 mm

7.62 mm

19.05 mm

CMOS

5 V

Parallel IO Port

2.54 mm

R-PDIP-T14

Not Qualified

e3

MCP25055-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MCP25055T-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

DM368ZCEDZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.28 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

30

260

13 mm

CMOS

1.35 V

.65 mm

S-PBGA-B338

3

e1

OMAPL132EZWTA2E

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

200 rpm

e1

OMAPL132EZWTA2R

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

200 rpm

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.