INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 792

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
OMAPL132EZWTA2	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY				30	260	16 mm		CMOS	1.2 V			.8 mm		S-PBGA-B361	3		200 rpm	e1
OMAPL138CZWTA3RW	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm					30	260	16 mm		CMOS	1.2 V			.8 mm		S-PBGA-B361	3			e1
OMAPL138EZCEA3E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY				30	260	13 mm		CMOS	1.3 V			.65 mm		S-PBGA-B361	3			e1
OMAPL138EZCEA3R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS	1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZCEA3	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS	1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZCED4E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS	1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZWTA3E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS	1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZWTA3	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS	1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZWTA4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY				30	260	16 mm		CMOS	1.3 V			.8 mm		S-PBGA-B361	3			e1
OMAPL138EZWTD4E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS	1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
SN74LVT8986PM	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	2.7 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		10 mm			0		30	260	10 mm		BICMOS	3 V	Other Microprocessor ICs		.5 mm		S-PQFP-G64	3	Not Qualified		e4
HPA01215RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		6 mm		TIMER(4)			30	260	6 mm	8192	CMOS	3 V			.5 mm		S-PQCC-N40	3			e4	23
HPA01216RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		6 mm		TIMER(4)			30	260	6 mm	8192	CMOS	3 V			.5 mm		S-PQCC-N40	3			e4	23
TMS320F28PLC83PNTR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V			FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		12 mm					30	260	12 mm		CMOS	3.3 V			.5 mm		S-PQFP-G80	3			e4
TMS320F28PLC83PNT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V			FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		12 mm					30	260	12 mm		CMOS	3.3 V			.5 mm		S-PQFP-G80	3			e4
TMS320F28PLC84PNTR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V			FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		12 mm					30	260	12 mm		CMOS	3.3 V			.5 mm		S-PQFP-G80	3			e4
TMS320F28PLC84PNT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V			FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		12 mm					30	260	12 mm		CMOS	3.3 V			.5 mm		S-PQFP-G80	3			e4
DM355SZCEA135	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm					30	260	13 mm		CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
DM355SZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm					30	260	13 mm		CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM355ZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm					30	260	13 mm		CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM6467ZUTAV	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY				30	245	19 mm		CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM6467ZUTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel		BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY				30	245	19 mm		CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified
TMS320DM6467ZUTD7	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY				30	245	19 mm		CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM365ZCED30	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V	32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm			32		30	260	13 mm		CMOS	1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
OMAP3503DCUSA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V		1.1,1.2,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.71 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm					30	260	16 mm		CMOS	1.8 V	Graphics Processors		.8 mm		S-PBGA-B423	4	Not Qualified		e1
OMAP3515DCBBA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.2,1.8,1.8/3	GRID ARRAY	BGA515,28X28,16	1.71 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.9 mm		12 mm					30	260	12 mm		CMOS	1.8 V	Graphics Processors		.5 mm		S-PBGA-B515	3	Not Qualified		e1
SN74LVT8996IPWREP	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	2.7 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm		4.4 mm			0		30	260	7.8 mm		BICMOS	3.3 V	Other Microprocessor ICs		.65 mm		R-PDSO-G24	1	Not Qualified		e4
AD6620ASZ-REEL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel	-40 Cel	MATTE TIN	QUAD	3.4 mm		14 mm					40	260	14 mm		CMOS	3.3 V	DSP Peripherals		.65 mm		S-PQFP-G80	3	Not Qualified		e3
AD6620ASZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel	-40 Cel	MATTE TIN	QUAD	3.4 mm		14 mm						260	14 mm		CMOS	3.3 V	DSP Peripherals		.65 mm		S-PQFP-G80	3	Not Qualified		e3
CY8C21323-24LFXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	4.75 V	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	1 mm		4 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY				20	260	4 mm		CMOS	5 V	Microcontrollers		.5 mm		S-XQCC-N24	3	Not Qualified		e3
CY8C21434-24LFXIT	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.93 mm		5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY				40	260	5 mm		CMOS	5 V	Microcontrollers		.5 mm		S-XQCC-N32	3	Not Qualified		e4
CY8C21434-24LFXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.93 mm		5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY				40	260	5 mm		CMOS	5 V	Microcontrollers		.5 mm		S-XQCC-N32	3	Not Qualified		e4
TMS320DM355ZCEA135	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm					30	260	13 mm		CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
SM320DM6446AZWTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	20480	16 mm	ITS ALSO OPERATES AT 1.8/3.3 V SUPPLY		48	27 MHz	30	260	16 mm		CMOS	1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
TIR1000IPWG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25	2.7 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm		3 mm	CAN ALSO OPERATE AT 5V SUPPLY				30	260	4.4 mm		CMOS	3 V	Serial IO/Communication Controllers	UART	.65 mm		R-PDSO-G8	1	Not Qualified		e4
TIR1000IPWRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25	2.7 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm		3 mm	CAN ALSO OPERATE AT 5V SUPPLY				30	260	4.4 mm		CMOS	3 V	Serial IO/Communication Controllers	UART	.65 mm		R-PDSO-G8	1	Not Qualified		e4
STA2058EXATR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS	3.3 V			.8 mm		S-PBGA-B144		Not Qualified
STA2058EXA	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS	3.3 V			.8 mm		S-PBGA-B144		Not Qualified
STA2058EXTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS	3.3 V			.8 mm		S-PBGA-B144		Not Qualified
STA2058EX	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		10 mm					30	260	10 mm		CMOS	3.3 V			.8 mm		S-PBGA-B144	3	Not Qualified		e1
STA2058	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V			FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		10 mm					30	260	10 mm		CMOS	3.3 V			.5 mm		S-PQFP-G64	3	Not Qualified		e4
STMPE16M31QTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.95 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.65 V	85 Cel	-40 Cel	MATTE TIN	QUAD	.9 mm		4 mm					40	260	4 mm		CMOS	1.8 V			.4 mm		S-XQCC-N32	3	Not Qualified		e3
STMPE24M31QTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.95 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.65 V	85 Cel	-40 Cel	MATTE TIN	QUAD	.9 mm		5 mm					30	260	5 mm		CMOS	1.8 V			.4 mm		S-XQCC-N40	3	Not Qualified		e3
HCTL-2017	Broadcom	MICROPROCESSOR CIRCUIT	INDUSTRIAL	PIN/PEG	16		RECTANGULAR	UNSPECIFIED	NO	5.5 V			MICROELECTRONIC ASSEMBLY		4.5 V	85 Cel	-40 Cel	MATTE TIN	DUAL									260			CMOS	5 V					R-XDMA-P16		Not Qualified		e3
FT245RQ-TRAY	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.3 V	85 Cel	-40 Cel		QUAD	1 mm		5 mm					40	260	5 mm		CMOS				.5 mm		S-XQCC-N32	3	Not Qualified
LS1088AXE7Q1A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm					30	250	23 mm		CMOS	1.025 V			.8 mm		S-PBGA-B780	3			e1
MCIMX6D7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O				40	260	21 mm		CMOS	1.4 V			.8 mm		S-PBGA-B624	3			e1
MCIMX6DP7CVT8AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm					40	260	21 mm		CMOS	1.4 V			.8 mm		S-PBGA-B624	3			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.