INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 792

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
STWBC	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			105 Cel		-40 Cel			QUAD	1 mm		5 mm						5 mm		CMOS	5 V		.5 mm	S-XQCC-N32
CC1310F32RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		5 mm				30	260	5 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N32	3	e4
CC1310F64RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		7 mm				30	260	7 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N48	3	e4
ADUCM330WDCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	18 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.6 V	115 Cel		-40 Cel			QUAD	1 mm		6 mm						6 mm		CMOS			.5 mm	S-XQCC-N32
ADUCM331WDCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	18 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.6 V	115 Cel		-40 Cel			QUAD	1 mm		6 mm						6 mm		CMOS			.5 mm	S-XQCC-N32
CMX7341Q3	Cml Microcircuits	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel			QUAD	1 mm		6 mm						6 mm		CMOS	3.3 V		.5 mm	S-XQCC-N48
MSP430F67621AIPNR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	4	12 mm		0		30	260	12 mm	4096	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G80	3	e4
MSP430F67621AIPN	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	4	12 mm		0		30	260	12 mm	4096	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G80	3	e4
MSP430F67621AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	4	14 mm		0		30	260	14 mm	4096	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	e4
MSP430F67621AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	4	14 mm		0		30	260	14 mm	4096	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	e4
MSP430F67641AIPNR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	8	12 mm		0		30	260	12 mm	8192	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G80	3	e4
MSP430F67641AIPN	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	8	12 mm		0		30	260	12 mm	8192	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G80	3	e4
MSP430F67641AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	8	14 mm		0		30	260	14 mm	8192	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	e4
MSP430F67641AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	8	14 mm		0		30	260	14 mm	8192	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	e4
66AK2L06XCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	GRID ARRAY, FINE PITCH		.95 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.55 mm		25 mm				30	245	25 mm		CMOS	1.05 V		.8 mm	S-PBGA-B900	4	e1
66AK2L06XCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	GRID ARRAY, FINE PITCH		.95 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.55 mm		25 mm				30	245	25 mm		CMOS	1.05 V		.8 mm	S-PBGA-B900	4	e1
SP1ML-915	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	16		RECTANGULAR	UNSPECIFIED	NO	3.6 V	MICROELECTRONIC ASSEMBLY		1.8 V	85 Cel		-40 Cel			DUAL	2.5 mm		13.4 mm				NOT SPECIFIED	NOT SPECIFIED	14 mm		CMOS	3 V		1.5 mm	R-XDMA-N16
CC1310F32RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		7 mm				NOT SPECIFIED	260	7 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N48	3	e4
CC1310F32RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		5 mm				NOT SPECIFIED	260	5 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N32	3	e4
CC1310F32RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		4 mm				NOT SPECIFIED	260	4 mm	28672	CMOS	3.3 V		.4 mm	S-PQCC-N32	3	e4
CC1310F64RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		7 mm				NOT SPECIFIED	260	7 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N48	3	e4
CC1310F64RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		5 mm				NOT SPECIFIED	260	5 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N32	3	e4
CC1310F64RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		4 mm				NOT SPECIFIED	260	4 mm	28672	CMOS	3.3 V		.4 mm	S-PQCC-N32	3	e4
MSP430F6749IPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		14 mm		0	25 MHz	30	260	14 mm		CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	e4
MCIMX6DP7CVT8AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm				40	260	21 mm		CMOS	1.4 V		.8 mm	S-PBGA-B624	3	e1
MCIMX6QP7CVT8AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm				40	260	21 mm		CMOS	1.4 V		.8 mm	S-PBGA-B624	3	e1
EM341-RTR	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.18 V	85 Cel		-40 Cel	MATTE TIN		QUAD	.9 mm		7 mm				40	260	7 mm		CMOS	1.25 V		.5 mm	S-PQCC-N48	2	e3
MCIMX6G1CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel	Tin/Silver (Sn/Ag)		BOTTOM	1.32 mm		14 mm				40	260	14 mm		CMOS			.8 mm	S-PBGA-B289	3	e2
MCIMX6G2CVK05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel			BOTTOM	1.23 mm		9 mm				40	260	9 mm		CMOS			.5 mm	S-PBGA-B272	3
MCIMX6G2CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel			BOTTOM	1.32 mm		14 mm				40	260	14 mm		CMOS			.8 mm	S-PBGA-B289	3
MCIMX6G3CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.15 V	105 Cel		-40 Cel			BOTTOM	1.32 mm		14 mm				40	260	14 mm		CMOS			.8 mm	S-PBGA-B289	3
XCZU11EG-1FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245			CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU11EG-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245			CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU11EG-1FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245			CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU11EG-1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245			CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU11EG-2FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245			CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU11EG-2FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245			CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU11EG-2FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245			CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU11EG-2FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							30	245			CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU11EG-L1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS	.72 V			R-PBGA-B1156	4	e1
XCZU11EG-L1FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS	.72 V			R-PBGA-B1760	4	e1
XCZU11EG-L1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS	.72 V			R-PBGA-B1517	4	e1
XCZU15EG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							30	245			CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU15EG-1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245			CMOS	.85 V			R-PBGA-B900	4	e1
XCZU15EG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							30	245			CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU15EG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245			CMOS	.85 V			R-PBGA-B900	4	e1
XCZU15EG-L1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS	.72 V			R-PBGA-B1156	4	e1
XCZU15EG-L1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS	.72 V			R-PBGA-B900	4	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.