Texas Instruments Other Function uPs,uCs & Peripheral ICs 611

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	RAM Words	Width	Data EEPROM Size	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	PWM Channels	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
TMS320DM6467ZUTD7	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		3.3 mm	32768	19 mm		DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM365ZCED30	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm	8192	13 mm			32		30	260	13 mm		CMOS		1.35 V		Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified	e1
OMAP3503DCUS72	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V				1.1,1.2,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.71 V	90 Cel		0 Cel			BOTTOM		1.4 mm		16 mm					NOT SPECIFIED	NOT SPECIFIED	16 mm		CMOS		1.8 V		Graphics Processors		.8 mm		S-PBGA-B423		Not Qualified
OMAP3503DCUSA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V				1.1,1.2,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.71 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		16 mm					30	260	16 mm		CMOS		1.8 V		Graphics Processors		.8 mm		S-PBGA-B423	4	Not Qualified	e1
OMAP3515DCBBA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V				1.1,1.2,1.8,1.8/3	GRID ARRAY	BGA515,28X28,16	1.71 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		.9 mm		12 mm					30	260	12 mm		CMOS		1.8 V		Graphics Processors		.5 mm		S-PBGA-B515	3	Not Qualified	e1
OMAP3515DCBC	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V				1.1,1.8,3.3	GRID ARRAY	BGA515,21X21,25	1.71 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		.9 mm		12 mm					30	260	12 mm		CMOS		1.8 V		Graphics Processors		.5 mm		S-PBGA-B515	3	Not Qualified	e1
OMAP3515DCUS	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V				1.1,1.8,3.3	GRID ARRAY	BGA423,24X24,25	1.71 V	90 Cel		0 Cel			BOTTOM		1.4 mm		16 mm					NOT SPECIFIED	NOT SPECIFIED	16 mm		CMOS		1.8 V		Graphics Processors		.65 mm		S-PBGA-B423		Not Qualified
SN74LVT8996IPWREP	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	2.7 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.2 mm		4.4 mm			0		30	260	7.8 mm		BICMOS		3.3 V		Other Microprocessor ICs		.65 mm		R-PDSO-G24	1	Not Qualified	e4
TMS320DM355ZCEA135	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm	32768	13 mm					30	260	13 mm		CMOS		1.3 V		Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
SM320DM6446AZWTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm	20480	16 mm		ITS ALSO OPERATES AT 1.8/3.3 V SUPPLY	48	27 MHz	30	260	16 mm		CMOS		1.2 V		Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	e1
TIR1000IPWG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V				3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25	2.7 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.2 mm		3 mm		CAN ALSO OPERATE AT 5V SUPPLY			30	260	4.4 mm		CMOS		3 V		Serial IO/Communication Controllers	UART	.65 mm		R-PDSO-G8	1	Not Qualified	e4
TIR1000IPWRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V				3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25	2.7 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.2 mm		3 mm		CAN ALSO OPERATE AT 5V SUPPLY			30	260	4.4 mm		CMOS		3 V		Serial IO/Communication Controllers	UART	.65 mm		R-PDSO-G8	1	Not Qualified	e4
TIR1000PSRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V					SMALL OUTLINE		2.7 V	70 Cel		0 Cel	NICKEL PALLADIUM GOLD		DUAL		2 mm		5.3 mm		CAN ALSO OPERATE AT 5V SUPPLY			30	260	6.2 mm		CMOS		3 V				1.27 mm		R-PDSO-G8	1	Not Qualified	e4
66AK2G12ABY100	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.56 mm		21 mm					30	260	21 mm		CMOS		1 V				.8 mm		S-PBGA-B625	3		e1
66AK2G12ABY60	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.56 mm		21 mm					30	260	21 mm		CMOS		.9 V				.8 mm		S-PBGA-B625	3		e1
66AK2G12ABYA100E	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.56 mm		21 mm					30	260	21 mm		CMOS		1 V				.8 mm		S-PBGA-B625	3		e1
66AK2G12ABYA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.56 mm		21 mm					30	260	21 mm		CMOS		1 V				.8 mm		S-PBGA-B625	3		e1
66AK2G12ABYA60E	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.56 mm		21 mm					30	260	21 mm		CMOS		.9 V				.8 mm		S-PBGA-B625	3		e1
66AK2G12ABYA60	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.56 mm		21 mm					30	260	21 mm		CMOS		.9 V				.8 mm		S-PBGA-B625	3		e1
DLPC230TZDQRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	AEC-Q100				GRID ARRAY		1.045 V	105 Cel		-40 Cel			BOTTOM		2.352 mm		23 mm							23 mm		CMOS		1.1 V				1 mm		S-PBGA-B324
AWR1443FQIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100				GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.17 mm		10.4 mm					30	260	10.4 mm	589824	CMOS		1.2 V				.65 mm		S-PBGA-B161	3		e1
AWR1443FQIGABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100				GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.2 mm		10.4 mm					30	260	10.4 mm	589824	CMOS		1.2 V				.65 mm		S-PBGA-B161	3		e1
DLPC2607ZVB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.95 V	85 Cel		-30 Cel	TIN SILVER COPPER		BOTTOM										260			CMOS		1 V						S-PBGA-B176	3		e1
DLPC6401ZFF	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	419	BGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY		1.116 V	55 Cel		0 Cel			BOTTOM		2.36 mm		23 mm							23 mm		CMOS		1.2 V				1 mm		S-PBGA-B419
CC3200MODR1M2AMOBT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V		NO			CHIP CARRIER		2.3 V	70 Cel		-20 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm		17.5 mm	0		0		30	260	20.5 mm		CMOS	4-Ch 12-Bit	3.3 V	NO		I2C; SPI; UART	1.27 mm		R-XBCC-B63	3		e4	25
DLPC900ZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V					GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel		0 Cel			BOTTOM		2.42 mm		27 mm			16	20 MHz			27 mm		CMOS		1.15 V			I2C; SPI; UART; USB	1 mm		S-PBGA-B516				9
AM4376BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.325 V				.65 mm		S-PBGA-B491	3		e1
AM4376BZDN100	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.325 V				.65 mm		S-PBGA-B491	3		e1
AM4376BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.26 V				.65 mm		S-PBGA-B491	3		e1
AM4376BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.26 V				.65 mm		S-PBGA-B491	3		e1
AM4376BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.325 V				.65 mm		S-PBGA-B491	3		e1
AM4376BZDND30	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	.912 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		.95 V				.65 mm		S-PBGA-B491	3		e1
AM4376BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.26 V				.65 mm		S-PBGA-B491	3		e1
AM4377BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.26 V				.65 mm		S-PBGA-B491	3		e1
AM4377BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.325 V				.65 mm		S-PBGA-B491	3		e1
AM4377BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.26 V				.65 mm		S-PBGA-B491	3		e1
AM4378BZDN100	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.325 V				.65 mm		S-PBGA-B491	3		e1
AM4378BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.26 V				.65 mm		S-PBGA-B491	3		e1
AM4378BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.325 V				.65 mm		S-PBGA-B491	3		e1
AM4378BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.26 V				.65 mm		S-PBGA-B491	3		e1
AM4378BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.325 V				.65 mm		S-PBGA-B491	3		e1
AM4378BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.26 V				.65 mm		S-PBGA-B491	3		e1
AM4379BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.325 V				.65 mm		S-PBGA-B491	3		e1
AM4379BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS		1.26 V				.65 mm		S-PBGA-B491	3		e1
CC3000MODT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	46		RECTANGULAR	UNSPECIFIED	YES	4.8 V					MICROELECTRONIC ASSEMBLY		2.7 V	70 Cel		-20 Cel			QUAD		2 mm		13.5 mm		SEATED HGT-NOM					16.3 mm		CMOS		3.6 V						R-XQMA-N46
CC1310F32RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm		5 mm					30	260	5 mm	28672	CMOS		3.3 V				.5 mm		S-PQCC-N32	3		e4
CC1310F64RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm		7 mm					30	260	7 mm	28672	CMOS		3.3 V				.5 mm		S-PQCC-N48	3		e4
MSP430F67621AIPNR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	4	12 mm			0		30	260	12 mm	4096	CMOS		3.3 V			I2C; SPI; UART	.5 mm		S-PQFP-G80	3		e4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.