Texas Instruments Other Function uPs,uCs & Peripheral ICs 611

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	DAC Channels	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
AM5716AABCDA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V					GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3			e1
AM5716AABCDEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V					GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3			e1
AM5716AABCD	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V					GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3			e1
AM5716AABCXA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V					GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3			e1
AM5716AABCXEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V					GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3			e1
AM5716AABCX	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V					GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3			e1
AM5718AABCXA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V					GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3	1500 rpm		e1
AM5718AABCX	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V					GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3	1500 rpm		e1
CC3220MODSM2MOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	NO	YES	3.6 V	8		0	NO	CHIP CARRIER		2.3 V	85 Cel	CORTEX-M4	0	-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	1024000	256	17.5 mm	0		YES	TIMER(4), WDT	0		30	260	20.5 mm	4	262144	CMOS	4-Ch 12-Bit	3.3 V	2	NO	2	I2C, I2S, SD, SPI, UART	FLASH		1.27 mm	FIXED POINT	R-XBCC-B63	3	2400 rpm	YES	e4	8	25
TCI6636K2HDDAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.95 V					TIN SILVER COPPER		BOTTOM		3.75 mm			40 mm							30	245	40 mm			CMOS		1 V							1 mm		S-PBGA-B1517	4			e1
TCI6636K2HDXAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.95 V					TIN SILVER COPPER		BOTTOM		3.75 mm			40 mm							30	245	40 mm			CMOS		1 V							1 mm		S-PBGA-B1517	4			e1
TCI6636K2HDXAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.95 V					TIN SILVER COPPER		BOTTOM		3.75 mm			40 mm							30	245	40 mm			CMOS		1 V							1 mm		S-PBGA-B1517	4			e1
TCI6636K2HDXAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.95 V					TIN SILVER COPPER		BOTTOM		3.75 mm			40 mm							30	245	40 mm			CMOS		1 V							1 mm		S-PBGA-B1517	4			e1
TCI6636K2HDXAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.95 V					TIN SILVER COPPER		BOTTOM		3.75 mm			40 mm							30	245	40 mm			CMOS		1 V							1 mm		S-PBGA-B1517	4			e1
DRA781BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					48	32 MHz	30	250	15 mm			CMOS		1.06 V						CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DRA781BRGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					48	32 MHz	30	250	15 mm			CMOS		1.06 V						CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DRA782BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					48	32 MHz	30	250	15 mm			CMOS		1.06 V						CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DRA782BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					48	32 MHz	30	250	15 mm			CMOS		1.06 V						CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DRA783BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					48	32 MHz	30	250	15 mm			CMOS		1.06 V						CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DRA786BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					48	32 MHz	30	250	15 mm			CMOS		1.06 V						CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DRA786BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					48	32 MHz	30	250	15 mm			CMOS		1.06 V						CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DRA787BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					48	32 MHz	30	250	15 mm			CMOS		1.06 V						CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DRA787BRGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					48	32 MHz	30	250	15 mm			CMOS		1.06 V						CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DM505LRBABFR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					32	32 MHz	30	250	15 mm			CMOS		1.06 V						I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DM505LRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					32	32 MHz	30	250	15 mm			CMOS		1.06 V						I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DM505MRBABFR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					32	32 MHz	30	250	15 mm			CMOS		1.06 V						I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DM505MRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					32	32 MHz	30	250	15 mm			CMOS		1.06 V						I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DRA780BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					48	32 MHz	30	250	15 mm			CMOS		1.06 V						CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DRA780BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY		1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					48	32 MHz	30	250	15 mm			CMOS		1.06 V						CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
TCI6636K2HDSAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.95 V	100 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		3.75 mm			40 mm							30	245	40 mm			CMOS		1 V							1 mm		S-PBGA-B1517	4			e1
AM5716AABCXEQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3			e1
AM5716AABCXQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3			e1
AM5718AABCXEQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3	1500 rpm		e1
AM5718AABCXQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS		1.15 V							.8 mm		S-PBGA-B760	3	1500 rpm		e1
CC1312R1F3RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			7 mm		DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF					30	260	7 mm		81920	CMOS		3 V							.5 mm		S-PQCC-N48	3			e4		30
DLPC3437CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY		YES	1.155 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel			-30 Cel	TIN SILVER COPPER		BOTTOM		1 mm			13 mm							30	260	13 mm			CMOS		1.1 V							.8 mm		S-PBGA-B201	3			e1
AWR1642ABIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.17 mm			10.4 mm							30	260	10.4 mm		1572864	CMOS		1.2 V							.65 mm		S-PBGA-B161	3			e1
AWR1642ABISABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.17 mm			10.4 mm							30	260	10.4 mm		1572864	CMOS		1.2 V							.65 mm		S-PBGA-B161	3			e1
AWR1642ABISABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.17 mm			10.4 mm							NOT SPECIFIED	260	10.4 mm		1572864	CMOS		1.2 V							.65 mm		S-PBGA-B161	3			e1
DLPC230TZDQQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES	1.155 V		AEC-Q100			GRID ARRAY		1.045 V	105 Cel			-40 Cel			BOTTOM		2.352 mm			23 mm									23 mm			CMOS		1.1 V							1 mm		S-PBGA-B324
DLPC3434CZVB	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY		YES						GRID ARRAY, VERY THIN PROFILE, FINE PITCH							Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1 mm			7 mm							30	260	7 mm			CMOS									.4 mm		S-PBGA-B176	3			e1
66AK2G12ABYT100	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.56 mm			21 mm							30	260	21 mm			CMOS		1 V							.8 mm		S-PBGA-B625	3			e1
DLPC900AZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V					GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel			0 Cel			BOTTOM		2.42 mm			27 mm					16	20 MHz			27 mm			CMOS		1.15 V						I2C; SPI; UART; USB	1 mm		S-PBGA-B516						9
DRA784BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					32	32 MHz	30	250	15 mm			CMOS		1.06 V						I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
DRA784BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					32	32 MHz	30	250	15 mm			CMOS		1.06 V						I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
DRA785BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					32	32 MHz	30	250	15 mm			CMOS		1.06 V						I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
DRA785BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					32	32 MHz	30	250	15 mm			CMOS		1.06 V						I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
DRA788BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm					32	32 MHz	30	250	15 mm			CMOS		1.06 V						I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.