Texas Instruments Other Function uPs,uCs & Peripheral ICs 611

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

DM355SDZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

DM355SDZCE270

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

DM355SDZCEA216

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355CZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355CZCEA21

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355DZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355DZCE270

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355DZCEA21

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMX320DM355ZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

BOTTOM

1.3 mm

32768

13 mm

NOT SPECIFIED

NOT SPECIFIED

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

Not Qualified

TMX320DM355ZCE270

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

BOTTOM

1.3 mm

32768

13 mm

NOT SPECIFIED

NOT SPECIFIED

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

Not Qualified

SM32DM355GCEM216EP

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

125 Cel

-55 Cel

TIN LEAD

BOTTOM

1.3 mm

8192

13 mm

32

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

e0

TMS320DM6441AZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

48

30

260

16 mm

CMOS

1.05 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

TMS320DM6446BZWTA

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

TCI6630K2LCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LCMS

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LDCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LDCMSA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LSCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LSCMSA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LXCMS2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LXCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LXCMSA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LXCMS

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

MSP430F67491IPEUR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

14 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

30

260

20 mm

CMOS

3.3 V

.5 mm

R-PQFP-G128

3

e4

MSP430F67491IPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

32

14 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

0

30

260

20 mm

32768

CMOS

3.3 V

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

e4

MSP430F67491IPZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

14 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

30

260

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

3

e4

NN325TRHARQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1 mm

6 mm

0

16 MHz

30

260

6 mm

1024

CMOS

2.7 V

I2C; SPI; UART

.5 mm

S-PQCC-N40

3

e4

TMS320DM6446AZWTA

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

TMS320DM6446AZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

P82B715DG4

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

12 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

1.75 mm

3.9 mm

VCCB(Min)(V) is 3, VCCB(Max)(V) is 12

0

.4 MHz

NOT SPECIFIED

260

4.9 mm

BIPOLAR

5 V

I2C

1.27 mm

R-PDSO-G8

1

Not Qualified

e4

P82B715PE4

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

12 V

IN-LINE

4.5 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

5.08 mm

7.62 mm

VCCB(Min)(V) is 3, VCCB(Max)(V) is 12

0

.4 MHz

NOT SPECIFIED

260

9.81 mm

BIPOLAR

5 V

I2C

2.54 mm

R-PDIP-T8

1

Not Qualified

e4

TMS320DM6443AZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

TIR1000PWRG4

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.3 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

2.7 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

1.2 mm

3 mm

CAN ALSO OPERATE AT 5V SUPPLY

30

260

4.4 mm

CMOS

3 V

Serial IO/Communication Controllers

UART

.65 mm

R-PDSO-G8

1

Not Qualified

e4

TMS320DM335ZCE135

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

32768

13 mm

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM335ZCE270

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

32

30

260

13 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B337

3

Not Qualified

e1

DM368ZCEDZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.28 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

30

260

13 mm

CMOS

1.35 V

.65 mm

S-PBGA-B338

3

e1

DM368ZCEZ

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.28 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

30

260

13 mm

CMOS

1.35 V

.65 mm

S-PBGA-B338

3

e1

DM6446ANB6C2127VC

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

DM6446AZWTKEDACOM

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

DM6446GB6C0121MV

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

DM8147SCIS0

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

684

HBGA

SQUARE

PLASTIC/EPOXY

YES

3.47 V

GRID ARRAY, HEAT SINK/SLUG

3.14 V

90 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.06 mm

23 mm

IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY

48

NOT SPECIFIED

250

23 mm

CMOS

3.3 V

ETHERNET; I2C; SPI; UART; USB

.8 mm

S-PBGA-B684

4

1000 rpm

e1

OMAPL132EZWT2

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

200 rpm

e1

OMAPL132EZWTA2E

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

200 rpm

e1

OMAPL132EZWTA2R

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

200 rpm

e1

OMAPL132EZWTA2

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

200 rpm

e1

OMAPL138BZWTRB

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ASLO OPERATES IN 0.95V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.3 V

.8 mm

S-PBGA-B361

3

e1

OMAPL138CZWTA3RW

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

OMAPL138EZCE3

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

13 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B361

3

456 rpm

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.