Lattice Semiconductor Field Programmable Gate Arrays (FPGA) 652

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LFD2NX-40-7BG196C	Lattice Semiconductor	FPGA	Other	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	92	1			.95 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B196			12 mm			92		12 mm
LFD2NX-17-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1	30 s	23	260 °C (500 °F)	6 mm
LFD2NX-17-8MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1	30 s	23	260 °C (500 °F)	6 mm
LFD2NX-17-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1	30 s	23	260 °C (500 °F)	6 mm
LFD2NX-17-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1	30 s	23	260 °C (500 °F)	6 mm
LFD2NX-40-8MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1	30 s	23	260 °C (500 °F)	6 mm
LFD2NX-40-8BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	e1	30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-8BG196C	Lattice Semiconductor	FPGA	Other	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	92	1			.95 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B196			12 mm			92		12 mm
LFD2NX-40-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1	30 s	23	260 °C (500 °F)	6 mm
LFD2NX-40-8BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	e1	30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-9BG196I	Lattice Semiconductor	FPGA	Industrial	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	92	1			.95 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B196			12 mm			92		12 mm
LFD2NX-40-7BG196I	Lattice Semiconductor	FPGA	Industrial	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	92	1			.95 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B196			12 mm			92		12 mm
LFD2NX-40-7BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	e1	30 s	111	260 °C (500 °F)	14 mm
LIF-MDF6000-6KMG80I	Lattice Semiconductor	FPGA	Industrial	Ball	80	TFBGA	Square	Plastic/Epoxy	5936	Yes	1.26 V	742		37	1.2	Grid Array, Thin Profile, Fine Pitch	BGA80,10X10,26	1.14 V	.65 mm	100 °C (212 °F)	742 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B80		1.2 mm	7 mm			37		7 mm
LIF-MDF6000-6UMG64I	Lattice Semiconductor	FPGA	Industrial	Ball	64	VFBGA	Square	Plastic/Epoxy	5936	Yes	1.26 V	742		29	1.2	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	1.14 V	.4 mm	100 °C (212 °F)	742 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B64		1 mm	3.5 mm			29		3.5 mm
LIFCL-40-7MG121A	Lattice Semiconductor	FPGA	Automotive	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	48	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm		30 s	48	260 °C (500 °F)	6 mm
LIFCL-40-7BG256A	Lattice Semiconductor	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm		30 s	74	260 °C (500 °F)	14 mm
LCMXO2-4000ZE-1UWG81ITR1K	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	3.6 V			63	1.2	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	1.14 V	.4 mm	85 °C (185 °F)		-40 °C (-40 °F)		Bottom	R-PBGA-B81		.567 mm	3.693 mm			63		3.797 mm
LFMXO5-25-8BBG256C	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	160	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm			160		14 mm
LFMXO5-25-9BBG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	160	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm			160		14 mm
LFMXO5-25-9BBG400I	Lattice Semiconductor	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	252	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm			252		17 mm
LFMXO5-25-7BBG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	160	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm			160		14 mm
LFMXO5-25-7BBG400C	Lattice Semiconductor	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	252	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm			252		17 mm
LFMXO5-25-7BBG256C	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	160	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm			160		14 mm
LFMXO5-25-8BBG400C	Lattice Semiconductor	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	252	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm			252		17 mm
LFMXO5-25-8BBG400I	Lattice Semiconductor	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	252	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm			252		17 mm
LFMXO5-25-9BBG400C	Lattice Semiconductor	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	252	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm			252		17 mm
LAV-AT-300E-2LBG484I	Lattice Semiconductor	FPGA

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.