Lattice Semiconductor Field Programmable Gate Arrays (FPGA) 652

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LFE5U-45F-6BG256C	Lattice Semiconductor	FPGA																						Tin/Silver/Copper			3				e1	30 s		260 °C (500 °F)
LFE5U-45F-6BG256I	Lattice Semiconductor	FPGA																						Tin Silver Copper			3				e1	30 s		260 °C (500 °F)
LFE5U-45F-7BG256C	Lattice Semiconductor	FPGA																						Tin Silver Copper			3				e1	30 s		260 °C (500 °F)
LFE5U-45F-7BG256I	Lattice Semiconductor	FPGA																						Tin Silver Copper			3				e1	30 s		260 °C (500 °F)
LFE5U-45F-8BG256C	Lattice Semiconductor	FPGA																						Tin Silver Copper			3				e1	30 s		260 °C (500 °F)
LFE5U-45F-8BG256I	Lattice Semiconductor	FPGA																						Tin Silver Copper			3				e1	30 s		260 °C (500 °F)
LCMXO3D-4300HC-6SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		4300	Yes	3.465 V	537		58	2.5	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20	2.375 V	.5 mm	85 °C (185 °F)	6.7 ns	537 CLBS	0 °C (32 °F)		Quad	S-XQCC-N72		.9 mm	10 mm	Also Operates at 3.3 V nominal supply			58		10 mm
LCMXO3D-4300HC-6SG72I	Lattice Semiconductor	FPGA	Industrial	No Lead	72	HVQCCN	Square		4300	Yes	3.465 V	537		58	2.5	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20	2.375 V	.5 mm	100 °C (212 °F)	6.7 ns	537 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N72		.9 mm	10 mm	Also Operates at 3.3 V nominal supply			58		10 mm
LCMXO3D-4300ZC-2BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	4300	Yes	3.465 V	537		206	2.5	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	2.375 V	.8 mm	100 °C (212 °F)	7 ns	537 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm	Also Operates at 3.3 V nominal supply			206		14 mm
LCMXO3D-9400HC-5BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206	2.5	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	2.375 V	.8 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm	Also Operates at 3.3 V nominal supply			206		14 mm
LCMXO3D-9400HC-5BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		335	2.5	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	2.375 V	.8 mm	85 °C (185 °F)	7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm	Also Operates at 3.3 V nominal supply			335		17 mm
LCMXO3D-9400HC-5BG400I	Lattice Semiconductor	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		335	2.5	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	2.375 V	.8 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm	Also Operates at 3.3 V nominal supply			335		17 mm
LCMXO3D-9400HC-5BG484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		383	2.5	Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32	2.375 V	.8 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.7 mm	19 mm	Also Operates at 3.3 V nominal supply			383		19 mm
LCMXO3D-9400HC-5SG72I	Lattice Semiconductor	FPGA	Industrial	No Lead	72	HVQCCN	Square		9400	Yes	3.465 V	1175		58	2.5	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20	2.375 V	.5 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N72		.9 mm	10 mm	Also Operates at 3.3 V nominal supply			58		10 mm
LCMXO3D-9400HC-6BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206	2.5	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	2.375 V	.8 mm	100 °C (212 °F)	6.7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm	Also Operates at 3.3 V nominal supply			206		14 mm
LCMXO3D-9400HC-6BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		335	2.5	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	2.375 V	.8 mm	85 °C (185 °F)	6.7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm	Also Operates at 3.3 V nominal supply			335		17 mm
LCMXO3D-9400HC-6BG484C	Lattice Semiconductor	FPGA	Other	Ball	484	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		383	2.5	Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32	2.375 V	.8 mm	85 °C (185 °F)	6.7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		1.7 mm	19 mm	Also Operates at 3.3 V nominal supply			383		19 mm
LCMXO3D-9400HC-6BG484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		383	2.5	Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32	2.375 V	.8 mm	100 °C (212 °F)	6.7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.7 mm	19 mm	Also Operates at 3.3 V nominal supply			383		19 mm
LCMXO3D-9400HC-6SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		9400	Yes	3.465 V	1175		58	2.5	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20	2.375 V	.5 mm	85 °C (185 °F)	6.7 ns	1175 CLBS	0 °C (32 °F)		Quad	S-XQCC-N72		.9 mm	10 mm	Also Operates at 3.3 V nominal supply			58		10 mm
LCMXO3D-9400ZC-2BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206	2.5	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	2.375 V	.8 mm	85 °C (185 °F)	7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm	Also Operates at 3.3 V nominal supply			206		14 mm
LCMXO3D-9400ZC-2BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		335	2.5	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	2.375 V	.8 mm	85 °C (185 °F)	7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm	Also Operates at 3.3 V nominal supply			335		17 mm
LCMXO3D-9400ZC-2SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		9400	Yes	3.465 V	1175		58	2.5	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20	2.375 V	.5 mm	85 °C (185 °F)	7 ns	1175 CLBS	0 °C (32 °F)		Quad	S-XQCC-N72		.9 mm	10 mm	Also Operates at 3.3 V nominal supply			58		10 mm
LCMXO3D-9400ZC-2SG72I	Lattice Semiconductor	FPGA	Industrial	No Lead	72	HVQCCN	Square		9400	Yes	3.465 V	1175		58	2.5	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20	2.375 V	.5 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N72		.9 mm	10 mm	Also Operates at 3.3 V nominal supply			58		10 mm
LCMXO3D-9400ZC-3BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206	2.5	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	2.375 V	.8 mm	100 °C (212 °F)	6.7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm	Also Operates at 3.3 V nominal supply			206		14 mm
LCMXO3D-9400ZC-3SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		9400	Yes	3.465 V	1175		58	2.5	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20	2.375 V	.5 mm	85 °C (185 °F)	6.7 ns	1175 CLBS	0 °C (32 °F)		Quad	S-XQCC-N72		.9 mm	10 mm	Also Operates at 3.3 V nominal supply			58		10 mm
LIFCL-17-7BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm			30 s	48	260 °C (500 °F)	14 mm
LIFCL-17-7BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm			30 s	48	260 °C (500 °F)	14 mm
LIFCL-17-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm			30 s	48	260 °C (500 °F)	6 mm
LIFCL-17-7SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		17000	Yes	1.05 V			22	1	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20	.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Quad	S-XQCC-N72	3	.9 mm	10 mm			30 s	22	260 °C (500 °F)	10 mm
LIFCL-17-8BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm			30 s	48	260 °C (500 °F)	14 mm
LIFCL-17-8BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm			30 s	48	260 °C (500 °F)	14 mm
LIFCL-17-8MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm			30 s	48	260 °C (500 °F)	6 mm
LIFCL-17-8SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		17000	Yes	1.05 V			22	1	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20	.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Quad	S-XQCC-N72	3	.9 mm	10 mm			30 s	22	260 °C (500 °F)	10 mm
LIFCL-17-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm			30 s	48	260 °C (500 °F)	6 mm
LIFCL-17-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm			30 s	48	260 °C (500 °F)	6 mm
LIFCL-17-9SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		17000	Yes	1.05 V			22	1	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20	.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Quad	S-XQCC-N72	3	.9 mm	10 mm			30 s	22	260 °C (500 °F)	10 mm
LIFCL-40-7BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm			30 s	74	260 °C (500 °F)	14 mm
LIFCL-40-7BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm			30 s	74	260 °C (500 °F)	14 mm
LIFCL-40-7BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.7 mm	17 mm			30 s	74	260 °C (500 °F)	17 mm
LIFCL-40-7MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	48	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm			30 s	48	260 °C (500 °F)	6 mm
LIFCL-40-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	48	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm			30 s	48	260 °C (500 °F)	6 mm
LIFCL-40-7MG289C	Lattice Semiconductor	FPGA	Other	Ball	289	TFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1	Grid Array, Thin Profile, Fine Pitch	BGA289,17X17,20	.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B289		1.2 mm	9.5 mm				74		9.5 mm
LIFCL-40-7MG289I	Lattice Semiconductor	FPGA	Industrial	Ball	289	TFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1	Grid Array, Thin Profile, Fine Pitch	BGA289,17X17,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B289		1.2 mm	9.5 mm				74		9.5 mm
LIFCL-40-7SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		39000	Yes	1.05 V	9750	FDSOI	22	1	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20	.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Quad	S-XQCC-N72		.9 mm	10 mm				22		10 mm
LIFCL-40-8BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.7 mm	17 mm			30 s	74	260 °C (500 °F)	17 mm
LIFCL-40-8MG289C	Lattice Semiconductor	FPGA	Other	Ball	289	TFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1	Grid Array, Thin Profile, Fine Pitch	BGA289,17X17,20	.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B289		1.2 mm	9.5 mm				74		9.5 mm
LIFCL-40-8MG289I	Lattice Semiconductor	FPGA	Industrial	Ball	289	TFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1	Grid Array, Thin Profile, Fine Pitch	BGA289,17X17,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B289		1.2 mm	9.5 mm				74		9.5 mm
LIFCL-40-9BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm			30 s	74	260 °C (500 °F)	14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.