Lattice Semiconductor Field Programmable Gate Arrays (FPGA) 652

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LCMXO3L-4300E-6MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	4300	Yes	1.26 V	540		100		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1			100	260 °C (500 °F)	6 mm
LCMXO3L-4300E-6MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	540				1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm			e1				260 °C (500 °F)	9 mm
LCMXO3L-4300E-6MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	4300	Yes	1.26 V	540		206		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm			e1			206	260 °C (500 °F)	9 mm
LCMXO3L-4300E-6MG324C	Lattice Semiconductor	FPGA	Other	Ball	324	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	540				1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
LCMXO3L-4300E-6MG324I	Lattice Semiconductor	FPGA		Ball	324	VFBGA	Square	Plastic/Epoxy	4300	Yes	1.26 V	540		268		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1 mm	10 mm			e1		30 s	268	260 °C (500 °F)	10 mm
LCMXO3L-640E-5MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	80				1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1				260 °C (500 °F)	6 mm
LCMXO3L-640E-5MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	640	Yes	1.26 V	80		100		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1			100	260 °C (500 °F)	6 mm
LCMXO3L-640E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	80				1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1				260 °C (500 °F)	6 mm
ICE40LM2K-CM49TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	49	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	256	CMOS			1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		256 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B49		1 mm	3 mm								3 mm
LFXP2-30E-5FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	29000	Yes	1.26 V	3625	CMOS	363		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		363	250 °C (482 °F)	23 mm
LFXP2-30E-5FTN256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	29000	Yes	1.26 V	3625	CMOS	201		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LFXP2-30E-6FTN256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	29000	Yes	1.26 V	3625	CMOS	201		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz	40 s	201	260 °C (500 °F)	17 mm
LFXP2-30E-7FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	29000	Yes	1.26 V	3625	CMOS	201		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LFXP2-40E-5FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.26 V	5000	CMOS	363		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		363	250 °C (482 °F)	23 mm
LFXP2-40E-5FN484I	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.26 V	5000	CMOS	363		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		363	250 °C (482 °F)	23 mm
LFXP2-40E-5FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	40000	Yes	1.26 V	5000	CMOS	540		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	435 MHz	30 s	540	250 °C (482 °F)	27 mm
LFXP2-40E-6FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.26 V	5000	CMOS	363		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		363	250 °C (482 °F)	23 mm
LFXP2-40E-6FN484I	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.26 V	5000	CMOS	363		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		363	250 °C (482 °F)	23 mm
LFXP2-40E-7F484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.26 V		CMOS	363		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	435 MHz	30 s	363	225 °C (437 °F)	23 mm
LFXP2-5E-5FT256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5000	Yes	1.26 V		CMOS	172		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	435 MHz	30 s	172	225 °C (437 °F)	17 mm
LFXP2-5E-5FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	172		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		172	260 °C (500 °F)	17 mm
LFXP2-5E-5MN132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	86		1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	435 MHz	40 s	86	260 °C (500 °F)	8 mm
LFXP2-5E-5MN132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	86		1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	435 MHz	40 s	86	260 °C (500 °F)	8 mm
LFXP2-5E-5QN208I	Lattice Semiconductor	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	146		1.2	1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	435 MHz	40 s	146	245 °C (473 °F)	28 mm
LFXP2-5E-5TN144I	Lattice Semiconductor	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	100		1.2	1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	435 MHz	30 s	100	260 °C (500 °F)	20 mm
LFXP2-5E-6FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	172		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		172	260 °C (500 °F)	17 mm
LFXP2-5E-6FTN256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	172		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		172	260 °C (500 °F)	17 mm
LFXP2-5E-6MN132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	86		1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	435 MHz	40 s	86	260 °C (500 °F)	8 mm
LFXP2-5E-6QN208C	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	146		1.2	1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	435 MHz	40 s	146	245 °C (473 °F)	28 mm
LFXP2-5E-6QN208I	Lattice Semiconductor	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	146		1.2	1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	435 MHz	40 s	146	245 °C (473 °F)	28 mm
LFXP2-5E-7TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	100		1.2	1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	435 MHz	40 s	100	260 °C (500 °F)	20 mm
LFXP2-8E-5FT256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.26 V		CMOS	201		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	435 MHz	30 s	201	225 °C (437 °F)	17 mm
LFXP2-8E-5FTN256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	201		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LFXP2-8E-5MN132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	86		1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	435 MHz	40 s	86	260 °C (500 °F)	8 mm
LFXP2-8E-5QN208C	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	146		1.2	1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	435 MHz	40 s	146	245 °C (473 °F)	28 mm
LFXP2-8E-5QN208I	Lattice Semiconductor	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	146		1.2	1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	435 MHz	40 s	146	245 °C (473 °F)	28 mm
LFXP2-8E-5TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	100		1.2	1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	435 MHz	40 s	100	260 °C (500 °F)	20 mm
LFXP2-8E-5TN144I	Lattice Semiconductor	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	100		1.2	1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	435 MHz	40 s	100	260 °C (500 °F)	20 mm
LFXP2-8E-6FT256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.26 V		CMOS	201		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.399 ns			Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	435 MHz	30 s	201	225 °C (437 °F)	17 mm
LFXP2-8E-6FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	201		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LFXP2-8E-6FTN256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	201		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LFXP2-8E-6MN132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	86		1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	435 MHz	40 s	86	260 °C (500 °F)	8 mm
LFXP2-8E-6MN132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	86		1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	435 MHz	40 s	86	260 °C (500 °F)	8 mm
LFXP2-8E-6TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	100		1.2	1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	435 MHz	40 s	100	260 °C (500 °F)	20 mm
LFXP2-8E-6TN144I	Lattice Semiconductor	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	100		1.2	1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	435 MHz	40 s	100	260 °C (500 °F)	20 mm
LFXP2-8E-7FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	201		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LFXP2-8E-7TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	100		1.2	1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	435 MHz	40 s	100	260 °C (500 °F)	20 mm
OR4E02-1BA352C	Lattice Semiconductor	FPGA	Commercial	Ball	352	BGA	Square	Plastic/Epoxy	4992	Yes	1.575 V	624	CMOS	262	201000	1.5	1.5/3.3 V	Grid Array	BGA352,26X26,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	70 °C (158 °F)	1.1 ns	624 CLBS, 201000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B352	3	2.54 mm	35 mm	No	Maximum no of usable gates is 397000		420 MHz	30 s	262	225 °C (437 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.