Lattice Semiconductor Field Programmable Gate Arrays (FPGA) 652

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
ICE5LP2K-SWG36ITR50	Lattice Semiconductor	FPGA																										1					30 s		260 °C (500 °F)
ICE5LP4K-CM36ITR1K	Lattice Semiconductor	FPGA																										3					30 s		260 °C (500 °F)
ICE5LP4K-CM36ITR	Lattice Semiconductor	FPGA																										3					30 s		260 °C (500 °F)
ICE5LP4K-SWG36ITR50	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	440	CMOS		1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.35 mm	100 °C (212 °F)		440 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36	1	.491 mm	2.078 mm			30 s		260 °C (500 °F)	2.078 mm
LFE5U-12F-6BG381C	Lattice Semiconductor	FPGA		Ball	381	FBGA	Square	Plastic/Epoxy		Yes	1.155 V	1500		197	1.1		Grid Array, Fine Pitch	BGA381,20X20,32	1.045 V	.8 mm	85 °C (185 °F)		1500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B381	3	1.76 mm	17 mm				197	260 °C (500 °F)	17 mm
LFE5U-12F-6BG381I	Lattice Semiconductor	FPGA		Ball	381	FBGA	Square	Plastic/Epoxy		Yes	1.155 V	1500		197	1.1		Grid Array, Fine Pitch	BGA381,20X20,32	1.045 V	.8 mm	100 °C (212 °F)		1500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B381	3	1.76 mm	17 mm				197	260 °C (500 °F)	17 mm
LFE5U-12F-6MG285C	Lattice Semiconductor	FPGA																							Tin Silver Copper			3				e1	30 s		260 °C (500 °F)
LFE5U-12F-6MG285I	Lattice Semiconductor	FPGA																							Tin Silver Copper			3				e1	30 s		260 °C (500 °F)
LFE5U-12F-7MG285C	Lattice Semiconductor	FPGA																							Tin Silver Copper			3				e1	30 s		260 °C (500 °F)
LFE5U-12F-8MG285C	Lattice Semiconductor	FPGA	Other	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.155 V	1500		118	1.1		Grid Array, Low Profile, Fine Pitch	BGA285,18X18,20	1.045 V	.5 mm	85 °C (185 °F)		1500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm		e1	30 s	118	260 °C (500 °F)	10 mm
LFE5UM5G-25F-8MG285C	Lattice Semiconductor	FPGA	Other	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V	3000			1.2		Grid Array, Low Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		3000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm		e1	30 s		260 °C (500 °F)	10 mm
LFE5UM5G-45F-8BG554I	Lattice Semiconductor	FPGA																							Tin Silver Copper			3				e1	30 s		260 °C (500 °F)
LFE5UM5G-45F-8MG285C	Lattice Semiconductor	FPGA	Other	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V	5500			1.2		Grid Array, Low Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		5500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm		e1	30 s		260 °C (500 °F)	10 mm
LFE5UM5G-45F-8MG285I	Lattice Semiconductor	FPGA	Industrial	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V	5500			1.2		Grid Array, Low Profile, Fine Pitch		1.14 V	.5 mm	100 °C (212 °F)		5500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm		e1	30 s		260 °C (500 °F)	10 mm
LFE5UM5G-85F-8BG381C	Lattice Semiconductor	FPGA																										3							260 °C (500 °F)
LFE5UM5G-85F-8BG554I	Lattice Semiconductor	FPGA																							Tin Silver Copper			3				e1	30 s		260 °C (500 °F)
LFE5UM5G-85F-8MG285C	Lattice Semiconductor	FPGA	Other	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V	10500			1.2		Grid Array, Low Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		10500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm		e1	30 s		260 °C (500 °F)	10 mm
LCMXO3L-9400C-5BG484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	3.465 V	1175			2.5		Grid Array		2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484			19 mm	Also Operates at 3.3 V nominal supply					19 mm
LCMXO3LF-9400C-6BG484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	3.465 V	1175			2.5		Grid Array		2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484			19 mm	Also Operates at 3.3 V nominal supply					19 mm
LCMXO3LF-9400C-6BG484I	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		384	2.5		Grid Array		2.375 V	.8 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484			19 mm	Also Operates at 3.3 V nominal supply			384		19 mm
LCMXO2-256HC-6SG48C	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		256	Yes	3.6 V	32		40	2.5	Tray	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20	2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm	Also Operates at 3.3 V nominal supply			40	260 °C (500 °F)	7 mm
LCMXO2-640HC-4SG48I	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		640	Yes	3.6 V	80		40	2.5	Tray	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20	2.375 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm	Also Operates at 3.3 V nominal supply			40	260 °C (500 °F)	7 mm
LCMXO3L-9400C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	1175			2.5		Grid Array, Low Profile, Fine Pitch		2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	Also Operates at 3.3 V nominal supply	e1	30 s		260 °C (500 °F)	14 mm
LCMXO3L-9400C-5BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	1175			2.5		Grid Array, Low Profile, Fine Pitch		2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.7 mm	17 mm	Also Operates at 3.3 V nominal supply	e1	30 s		260 °C (500 °F)	17 mm
LCMXO3LF-9400C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206	2.5		Grid Array, Low Profile, Fine Pitch		2.375 V	.8 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	Also Operates at 3.3 V nominal supply	e1	30 s	206	260 °C (500 °F)	14 mm
LCMXO3LF-9400C-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206	2.5		Grid Array, Low Profile, Fine Pitch		2.375 V	.8 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	Also Operates at 3.3 V nominal supply	e1	30 s	206	260 °C (500 °F)	14 mm
LCMXO3LF-9400E-5MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	9400	Yes	1.26 V	1175		206	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm		e1		206	260 °C (500 °F)	9 mm
LCMXO3LF-9400E-6MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	9400	Yes	1.26 V	1175		206	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm		e1		206	260 °C (500 °F)	9 mm
ICE40UP3K-UWG30ITR1K	Lattice Semiconductor	FPGA		Ball	30	VFBGA	Rectangular	Plastic/Epoxy	2800	Yes	1.26 V	350	CMOS	21	1.2	Tape and Reel	Grid Array, Very Thin Profile, Fine Pitch	BGA30,5X6,16	1.14 V	.4 mm	100 °C (212 °F)	9 ns	350 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B30	1	.6 mm	2.114 mm			30 s	21	260 °C (500 °F)	2.537 mm
ICE40UP3K-UWG30ITR50	Lattice Semiconductor	FPGA		Ball	30	VFBGA	Rectangular	Plastic/Epoxy	2800	Yes	1.26 V	350	CMOS	21	1.2	Tape and Reel	Grid Array, Very Thin Profile, Fine Pitch	BGA30,5X6,16	1.14 V	.4 mm	100 °C (212 °F)	9 ns	350 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B30	1	.6 mm	2.114 mm			30 s	21	260 °C (500 °F)	2.537 mm
ICE40UP3K-UWG30ITR	Lattice Semiconductor	FPGA	Industrial	Ball	30	VFBGA	Rectangular	Plastic/Epoxy	2800	Yes	1.26 V	350	CMOS	21	1.2	Tape and Reel	Grid Array, Very Thin Profile, Fine Pitch	BGA30,5X6,16	1.14 V	.4 mm	100 °C (212 °F)	9 ns	350 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B30	1	.6 mm	2.114 mm			30 s	21	260 °C (500 °F)	2.537 mm
ICE40UP5K-SG48ITR50	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		5280	Yes	1.26 V	660	CMOS	39	1.2	Tape and Reel	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.24SQ,20	1.14 V	.5 mm	100 °C (212 °F)		660 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm			30 s	39	260 °C (500 °F)	7 mm
ICE40UP5K-UWG30ITR	Lattice Semiconductor	FPGA	Industrial	Ball	30	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	660	CMOS		1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.4 mm	100 °C (212 °F)		660 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B30	1	.6 mm	2.114 mm			30 s		260 °C (500 °F)	2.537 mm
ICE40UL1K-SWG16ITR50	Lattice Semiconductor	FPGA	Industrial	Ball	16	BGA	Square	Plastic/Epoxy		Yes	1.26 V	156	CMOS		1.2		Grid Array		1.14 V		100 °C (212 °F)		156 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B16	1							260 °C (500 °F)
LCMXO3LF-9400E-5BG256I	Lattice Semiconductor	FPGA																							Tin Silver Copper			3				e1	30 s		260 °C (500 °F)
LCMXO3LF-9400E-5BG400I	Lattice Semiconductor	FPGA																							Tin Silver Copper			3				e1	30 s		260 °C (500 °F)
LCMXO3LF-9400E-6BG256C	Lattice Semiconductor	FPGA																							Tin Silver Copper			3				e1	30 s		260 °C (500 °F)
LCMXO3LF-9400E-6BG256I	Lattice Semiconductor	FPGA																							Tin Silver Copper			3				e1	30 s		260 °C (500 °F)
ICE40HX4K-BG121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	440	CMOS		1.2		Grid Array, Thin Profile, Fine Pitch		1.14 V	.8 mm	100 °C (212 °F)		440 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm		e2			260 °C (500 °F)	9 mm
ICE40HX4K-BG121	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	93	1.2		Grid Array, Thin Profile, Fine Pitch		1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm		e2		93	260 °C (500 °F)	9 mm
ICE40HX8K-BG121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93	1.2		Grid Array, Thin Profile, Fine Pitch		1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm		e2		93	260 °C (500 °F)	9 mm
ICE40HX8K-BG121	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93	1.2		Grid Array, Thin Profile, Fine Pitch		1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm		e2		93	260 °C (500 °F)	9 mm
LFD2NX-40-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23	1		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1	30 s	23	260 °C (500 °F)	6 mm
LFD2NX-40-9BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1	30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-9BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1	30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-9BG196C	Lattice Semiconductor	FPGA	Other	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	92	1				.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B196			12 mm				92		12 mm
LFD2NX-40-8BG196I	Lattice Semiconductor	FPGA	Industrial	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	92	1				.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B196			12 mm				92		12 mm
LFD2NX-40-7BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1	30 s	111	260 °C (500 °F)	14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.