Industrial Programmable Logic Devices (PLD) 315

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC9572XL-7PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS			3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells	e3	125 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XCR3064XL-10CPG56I	Xilinx	EE PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS			3.3	3/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 48 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No		e1	95 MHz	30 s		260 °C (500 °F)	6 mm	Yes	48
XCR3064XL-7CPG56I	Xilinx	EE PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS			3.3	3/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 48 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No		e1	119 MHz	30 s		260 °C (500 °F)	6 mm	Yes	48
XCR3064XL-10CSG48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS			3.3	3/3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 40 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	95 MHz	30 s		260 °C (500 °F)	7 mm	Yes	40
XCR3064XL-7CSG48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS			3.3	3/3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 40 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	119 MHz	30 s		260 °C (500 °F)	7 mm	Yes	40
XCR3256XL-10CSG280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e1	105 MHz	30 s		260 °C (500 °F)	16 mm	Yes	164
XCR3032XL-10CSG48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	32	CMOS			3.3	3/3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	95 MHz	30 s		260 °C (500 °F)	7 mm	Yes	36
XCR3032XL-7CSG48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	32	CMOS			3.3	3/3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	119 MHz	30 s		260 °C (500 °F)	7 mm	Yes	36
XCR3128XL-10CSG144I	Xilinx	EE PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	128	CMOS			3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	95 MHz	30 s		260 °C (500 °F)	12 mm	Yes	108
XCR3128XL-7CSG144I	Xilinx	EE PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128	CMOS			3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	119 MHz	30 s		260 °C (500 °F)	12 mm	Yes	108
XCR3384XL-10FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	102 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XCR3512XL-10FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	97 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XCR3512XL-12FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	512	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	77 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XCR3256XL-10FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	105 MHz	30 s		260 °C (500 °F)	17 mm	Yes	164
XCR3256XL-12FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	88 MHz	30 s		260 °C (500 °F)	17 mm	Yes	164
XCR3512XL-10FGG324I	Xilinx	EE PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS			3.3	3/3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 260 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	97 MHz	30 s		250 °C (482 °F)	23 mm	Yes	260
XCR3064XL-7VQG100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS			3.3	3/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	119 MHz	30 s		260 °C (500 °F)	14 mm	Yes	68
XCR3064XL-7VQG44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS			3.3	3/3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	119 MHz	30 s		260 °C (500 °F)	10 mm	Yes	36
XCR3032XL-7VQG44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	32	CMOS			3.3	3/3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	119 MHz	30 s		260 °C (500 °F)	10 mm	Yes	36
XCR3128XL-7VQG100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128	CMOS			3.3	3/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	119 MHz	30 s		260 °C (500 °F)	14 mm	Yes	84
XC9572-15TQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	72	CMOS			5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 72 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	55.6 MHz	30 s		260 °C (500 °F)	14 mm	Yes	72
XCR3384XL-10TQG144I	Xilinx	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS			3.3	3/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	102 MHz	30 s		260 °C (500 °F)	20 mm	Yes	118
XCR3384XL-12TQG144I	Xilinx	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	384	CMOS			3.3	3/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	83 MHz	30 s		260 °C (500 °F)	20 mm	Yes	118
XCR3256XL-10TQG144I	Xilinx	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 120 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	105 MHz	30 s		260 °C (500 °F)	20 mm	Yes	120
XCR3128XL-7TQG144I	Xilinx	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128	CMOS			3.3	3/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	119 MHz	30 s		260 °C (500 °F)	20 mm	Yes	108
XCR3384XL-10PQG208I	Xilinx	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS			3.3	3/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 172 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	102 MHz	30 s		245 °C (473 °F)	28 mm	Yes	172
XCR3384XL-12PQG208I	Xilinx	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	384	CMOS			3.3	3/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 172 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	83 MHz	30 s		245 °C (473 °F)	28 mm	Yes	172
XCR3512XL-10PQG208I	Xilinx	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS	184	PLA-TYPE	3.3	3/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 180 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	81.3 MHz	30 s	180	245 °C (473 °F)	28 mm	Yes	180
XCR3512XL-12PQG208I	Xilinx	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	512	CMOS	184	PLA-TYPE	3.3	3/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 180 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	67.56 MHz	30 s	180	245 °C (473 °F)	28 mm	Yes	180
XCR3256XL-10PQG208I	Xilinx	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	105 MHz	30 s		245 °C (473 °F)	28 mm	Yes	164
XCR3256XL-12PQG208I	Xilinx	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	88 MHz	30 s		245 °C (473 °F)	28 mm	Yes	164
EPM7064LI84-10	Altera	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic	10 ns	Yes		64	CMOS				3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No			1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84				No		e0				220 °C (428 °F)		No
ISPLSI2032VE-180LTN44I	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	32	CMOS			3.3	3.3 V	Flatpack, Thin Profile	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	118 MHz			260 °C (500 °F)	10 mm	No	32
CY37064P100-125AXI	Cypress Semiconductor	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	64	CMOS			5	3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	1 Dedicated Inputs, 69 I/O	1	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	64 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e4	83 MHz	40 s		260 °C (500 °F)	14 mm	Yes	69
CY37128P100-125AXI	Cypress Semiconductor	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	128	CMOS			5	3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	1 Dedicated Inputs, 69 I/O	1	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	83 MHz	40 s		260 °C (500 °F)	14 mm	Yes	69
M4A3-64/32-12VNI48	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	64	CMOS		PAL-TYPE	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	52.6 MHz	40 s		260 °C (500 °F)	7 mm	Yes	32
M4A5-128/64-12VNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	128	CMOS		PAL-TYPE	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	52.6 MHz	40 s		260 °C (500 °F)	14 mm	Yes	64
M4A5-192/96-12VNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	192	CMOS			5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	16 Dedicated Inputs, 96 I/O	16	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	52.6 MHz	40 s		260 °C (500 °F)	20 mm	Yes	96
M4A5-32/32-10VNI48	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	32	CMOS	34	PAL-TYPE	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	62.5 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
M4A5-32/32-12VNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	32	CMOS	34	PAL-TYPE	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	52.6 MHz	40 s	32	260 °C (500 °F)	10 mm	Yes	32
M4A5-32/32-12VNI48	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	32	CMOS	34	PAL-TYPE	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	52.6 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
M4A5-32/32-7VNI48	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V	32	CMOS	34	PAL-TYPE	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	76.9 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
M4A5-64/32-10VNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	64	CMOS	34	PAL-TYPE	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	62.5 MHz	40 s	32	260 °C (500 °F)	10 mm	Yes	32
M4A5-64/32-10VNI48	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	64	CMOS	34	PAL-TYPE	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	62.5 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
M4A5-64/32-12VNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	64	CMOS	34	PAL-TYPE	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	52.6 MHz	40 s	32	260 °C (500 °F)	10 mm	Yes	32
M4A5-64/32-12VNI48	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	64	CMOS	34	PAL-TYPE	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	52.6 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
M4A5-64/32-7VNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V	64	CMOS	34	PAL-TYPE	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	76.9 MHz	40 s	32	260 °C (500 °F)	10 mm	Yes	32
M4A5-64/32-7VNI48	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V	64	CMOS	34	PAL-TYPE	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	76.9 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.