Industrial Programmable Logic Devices (PLD) 315

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
ISPLSI2064VE-135LTN44I	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS				3.3		3.3 V	Flatpack, Low Profile	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.6 mm	10 mm	No		e3	100 MHz	30 s		260 °C (500 °F)	10 mm	No	32
XC2C32A-6CPG56I	Xilinx	Flash PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	33 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1	300 MHz	30 s		260 °C (500 °F)	6 mm	Yes	33
XC2C32A-6VQ44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	LCC32,.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	85 °C (185 °F)	33 I/O		-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e4	300 MHz				10 mm	Yes	33
XC2C64A-7CP56I	Xilinx	Flash PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 45 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0	200 MHz	30 s		240 °C (464 °F)	6 mm	Yes	45
XC2C64A-7CPG56I	Xilinx	Flash PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 45 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1	200 MHz	30 s		260 °C (500 °F)	6 mm	Yes	45
XC2C64A-7VQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e0	200 MHz	30 s		240 °C (464 °F)	14 mm	Yes	64
XC2C64A-7VQ44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 33 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e4	200 MHz				10 mm	Yes	33
GAL16V8D-25LJNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e3	37 MHz	40 s	8	250 °C (482 °F)	8.9662 mm		8
GAL16V8D-25QJNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e3	37 MHz	40 s	8	250 °C (482 °F)	8.9662 mm		8
GAL16V8D-7LJNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e3	100 MHz	40 s	8	250 °C (482 °F)	8.9662 mm		8
GAL20V8C-10LJNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e3	58.8 MHz	40 s	8	245 °C (473 °F)	11.5062 mm		8
GAL22V10D-15LPNI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e3	55.5 MHz		10		31.75 mm		10
GAL22V10D-25LPNI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e3	33.3 MHz		10		31.75 mm		10
ISPLSI1016E-80LJNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	18.5 ns	Yes	5.5 V	64	CMOS		35	PLA-TYPE	5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	3 Dedicated Inputs, 32 I/O	3	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.59 mm	No		e3	57 MHz	40 s	32	245 °C (473 °F)	16.59 mm	No	32
ISPLSI1048E-70LQNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	128	QFP	Square	Plastic/Epoxy	18.5 ns	Yes	5.5 V	192	CMOS				5		5 V	Flatpack	QFP128,1.2SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	8 Dedicated Inputs, 96 I/O	8	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G128	3	4.1 mm	28 mm	No	Use ISPLSI1048EA for new designs; Use 1048E-70 for new 1048E-50 designs	e3	56 MHz	40 s		245 °C (473 °F)	28 mm	No	96
EPM7032SLI44-7N	Altera	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	32 Macrocells; 2 Labs; Configurable I/O operation with 3.3 V or 5 V	e3	166.7 MHz				16.5862 mm	Yes	36
EPM7032STI44-7N	Altera	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V	32	CMOS				5		5 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	32 Macrocells; 2 Labs; Configurable I/O operation with 3.3 V or 5 V	e3	166.7 MHz	30 s		260 °C (500 °F)	10 mm	Yes	36
M4A5-96/48-10VNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	96	CMOS			PAL-TYPE	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 48 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	62.5 MHz	40 s		260 °C (500 °F)	14 mm	Yes	48
XA2C128-7CPG132I	Xilinx	Flash PLD	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS	AEC-Q100			1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	112 MHz	30 s		260 °C (500 °F)	8 mm	Yes	100
XA2C256-7TQG144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS	AEC-Q100			1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Real digital design technology, XILIK00255-1	e3	141 MHz	30 s		260 °C (500 °F)	20 mm	Yes	118
XA2C256-7VQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS	AEC-Q100			1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real digital design technology, XILIK00225-1	e3	141 MHz	30 s		260 °C (500 °F)	14 mm	Yes	80
XA2C256-8VQG100Q	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS	AEC-Q100			1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	105 °C (221 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3	130 MHz	30 s		260 °C (500 °F)	14 mm	Yes	80
XA2C32A-6VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS	AEC-Q100			1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 33 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	10 mm	Yes	33
XA2C384-10TQG144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	384	CMOS	AEC-Q100	118	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	166 MHz	30 s	118	260 °C (500 °F)	20 mm	Yes	118
XA2C64A-7VQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS	AEC-Q100			1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	14 mm	Yes	64
XA2C64A-7VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS	AEC-Q100			1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 33 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	10 mm	Yes	33
ATF1508ASV-15AU100-T	Microchip Technology	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	15 ns	Yes	3.6 V						3.3	Tape and Reel		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm				100 MHz				14 mm		80

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.