| Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.244 in (6.21 mm) |
6 in (152.4 mm) |
0.165 in (4.2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
|
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.344 in (8.75 mm) |
6 in (152.4 mm) |
0.165 in (4.2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
|
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.344 in (8.75 mm) |
6 in (152.4 mm) |
0.165 in (4.2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
|
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.444 in (11.29 mm) |
6 in (152.4 mm) |
0.165 in (4.2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
|
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.444 in (11.29 mm) |
6 in (152.4 mm) |
0.165 in (4.2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
|
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Bag |
0.26 in (6.6 mm) |
5.4 in (137.16 mm) |
Waterproof |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
10000 Cycle(s) |
1 GΩ |
0.886 in (22.5044 mm) |
9.779 in (248.387 mm) |
Epoxy |
Gold |
0.359 in (9.1186 mm) |
0.1A@50VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
50 V |
RoHS Compliant |
e4 |
||||||||||
|
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.194 in (4.93 mm) |
4.93 in (125.222 mm) |
Tape Sealed |
Gold over Nickel |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
25 mA |
Wire |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL; Low Profile |
0.169 in (4.293 mm) |
|||||||||
|
|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
Tube |
0.378 in (9.6 mm) |
7.49 in (190.246 mm) |
Gold over Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
100 mA |
Wire |
Copper Alloy |
5 V |
0.157 in (3.988 mm) |
|||||||||||||
|
|
TE Connectivity |
Surface Mount-Straight |
1000 Cycle(s) |
1 GΩ |
Tube |
0.878 in (22.3 mm) |
7.5 in (190.5 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
||||||||||||
|
|
TE Connectivity |
Through Hole-Right Angle |
2000 Cycle(s) |
1 GΩ |
Box |
0.9 in (22.86 mm) |
9.906 in (251.612 mm) |
Tin |
0.335 in (8.5 mm) |
0.025A@50VDC |
70 °C (158 °F) |
10 mA |
-25 °C (-13 °F) |
10 mA |
Wire |
Phosphor Bronze |
16 |
50 V |
0.126 in (3.2 mm) |
|||||||||||
|
|
Cts |
Through Hole-Right Angle |
10000 Cycle(s) |
Anti-Static Tube |
0.886 in (22.5 mm) |
7.24 in (183.896 mm) |
0.4 in (10.16 mm) |
0.05A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
50 mA |
Solder |
206RA |
24 V |
e4 |
||||||||||||||
|
|
Cts |
Through Hole-Right Angle |
10000 Cycle(s) |
Anti-Static Tube |
0.686 in (17.42 mm) |
7.24 in (183.896 mm) |
0.4 in (10.16 mm) |
0.05A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
50 mA |
Solder |
206RA |
24 V |
e4 |
||||||||||||||
|
|
Cts |
Through Hole-Right Angle |
10000 Cycle(s) |
Anti-Static Tube |
0.986 in (25.04 mm) |
7.24 in (183.896 mm) |
0.4 in (10.16 mm) |
0.05A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
50 mA |
Solder |
206RA |
24 V |
e4 |
||||||||||||||
|
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.579 in (14.7 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.281 in (7.14 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
||||||||||||||||
|
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.38 in (9.65 mm) |
7.1 in (180.34 mm) |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
|||||||||||||||||
|
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.78 in (19.8 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.247 in (6.27 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
||||||||||||||||
|
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.78 in (19.8 mm) |
9.65 in (245.11 mm) |
0.247 in (6.27 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
0.156 in (3.962 mm) |
||||||||||||||
|
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.382 in (9.7 mm) |
9.65 in (245.11 mm) |
0.267 in (6.78 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
150 mA |
Solder |
30 V |
e3 |
|||||||||||||||
|
Grayhill |
Through Hole-Straight |
10000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.28 in (7.1 mm) |
9.65 in (245.11 mm) |
Gold over Nickel |
0.245 in (6.22 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead |
150 mA |
Solder |
100 mΩ |
Copper Alloy |
4 |
30 V |
Tube Packaging |
e0 |
0.136 in (3.454 mm) |
|||||||||
|
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
1 GΩ |
1.08 in (27.432 mm) |
9.652 in (245.161 mm) |
Gold over Nickel |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 mΩ |
Copper Alloy |
30 V |
0.156 in (3.962 mm) |
||||||||||||||
|
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
||||||||||||||
|
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.48 in (12.2 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.245 in (6.22 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
||||||||||||||
|
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.48 in (12.2 mm) |
9.65 in (245.11 mm) |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
0.156 in (3.962 mm) |
||||||||||||||
|
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.681 in (17.3 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.245 in (6.22 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
||||||||||||||
|
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
|||||||||||||||
|
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.571 in (14.5 mm) |
7.37 in (187.198 mm) |
Top Tape Sealed |
0.165 in (4.19 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
100 mA |
Solder |
6 V |
e3 |
||||||||||||||
|
|
Grayhill |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.177 in (4.5 mm) |
3.76 in (95.504 mm) |
Top Tape Sealed |
Gold over Nickel |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Low Profile |
e4 |
|||||||||
|
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
1.079 in (27.4 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
20 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
1.079 in (27.4 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
20 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.26 in (6.6 mm) |
7.1 in (180.34 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
4 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.26 in (6.6 mm) |
7.1 in (180.34 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
4 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.382 in (9.7 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
6 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.48 in (12.2 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
8 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.579 in (14.7 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
10 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.681 in (17.3 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
12 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.681 in (17.3 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
12 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.78 in (19.8 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
14 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.882 in (22.4 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
16 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.882 in (22.4 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
16 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
Tube |
1.079 in (27.4 mm) |
8.9 in (226.06 mm) |
Dust Proof |
0.252 in (6.4 mm) |
0.1A@5VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
100 mA |
Solder |
100 mΩ |
Beryllium Copper |
20 |
5 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
0.35 in (8.9 mm) |
7.1 in (180.34 mm) |
0.252 in (6.4 mm) |
0.1A@5VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
100 mA |
Solder |
100 mΩ |
Beryllium Copper |
4 |
5 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||||
|
|
Omron |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
Tube |
0.681 in (17.3 mm) |
8.9 in (226.06 mm) |
Dust Proof |
0.252 in (6.4 mm) |
0.1A@5VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
100 mA |
Solder |
100 mΩ |
Beryllium Copper |
12 |
5 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
Tube |
0.882 in (22.4 mm) |
8.9 in (226.06 mm) |
Dust Proof |
0.252 in (6.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
16 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
1.061 in (26.96 mm) |
9.9 in (251.46 mm) |
Bottom Sealed |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6E |
200 mΩ |
20 |
24 V |
e4 |
||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
1.061 in (26.96 mm) |
9.9 in (251.46 mm) |
Bottom Sealed |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6E |
200 mΩ |
20 |
24 V |
e4 |
||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.261 in (6.64 mm) |
9.9 in (251.46 mm) |
Bottom Sealed |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6E |
200 mΩ |
4 |
24 V |
e4 |
||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.261 in (6.64 mm) |
9.9 in (251.46 mm) |
Bottom Sealed |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6E |
200 mΩ |
4 |
24 V |
e4 |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.