DIP & SIP Switches

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Part RoHS Manufacturer Mounting Feature Maximum Contact AC Rating (R Load) Electrical Life Maximum Contact DC Power Rating (R Load) Insulation Resistance Packing Method Body Length/Diameter Body Width Sealing End Contact Plating Body Height Maximum Contact DC Rating (R Load) Maximum Operating Temperature Maximum AC Contact Current Minimum Operating Temperature Terminal Finish Maximum DC Contact Current Termination Type Manufacturer Series Contact Resistance End Contact Material PCB Hole Count Maximum DC Contact Voltage Additional Features Maximum AC Contact Voltage JESD-609 Code Terminal Length Maximum Contact AC Power Rating (R Load)

219-8MSTJ

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-8MSTRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-2LPSTF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-2LPSTJF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-2LPSTJRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-2LPSTJR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-2LPSTJ

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-2MSTF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-2MSTJF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-2MSTJRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-2MSTJR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-2MSTJ

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-2MSTRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-3MSTJRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.358 in (9.09 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-3MSTRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.358 in (9.09 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-4ESF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-4ESJF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-4ESJ

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-4ES

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-4LPSF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-4LPSTJRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

A6SN-0102-P

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, Embossed; Tube

1.075 in (27.3 mm)

7.5 in (190.5 mm)

IP40; Waterproof; Top Tape Sealed

0.138 in (3.5 mm)

0.025A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

25 mA

Solder

200 mΩ

24 V

A6SN-6102-P

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, Embossed; Tube

0.677 in (17.2 mm)

7.5 in (190.5 mm)

IP40; Waterproof; Top Tape Sealed

0.138 in (3.5 mm)

0.025A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

25 mA

Solder

200 mΩ

24 V

A6SN-7102-P

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, Embossed; Tube

0.776 in (19.7 mm)

7.5 in (190.5 mm)

IP40; Waterproof; Top Tape Sealed

0.138 in (3.5 mm)

0.025A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

25 mA

Solder

200 mΩ

24 V

A6E-0101-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

1.054 in (26.7716 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-0104-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.254 in (6.4516 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-2104-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.254 in (6.4516 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-3101-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.354 in (8.9916 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-3104-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.354 in (8.9916 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-4101-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.454 in (11.5316 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-5101-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.554 in (14.0716 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-5104-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.554 in (14.0716 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-6101-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.654 in (16.6116 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-6104-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.654 in (16.6116 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-7101-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.754 in (19.1516 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-7104-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.754 in (19.1516 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-8101-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.854 in (21.6916 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-8104-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.854 in (21.6916 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-9101-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.954 in (24.2316 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

A6E-9104-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.954 in (24.2316 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

418217270903A

Wurth Elektronik

Through Hole-Right Angle

2000 Cycle(s)

100 MΩ

Tube

0.351 in (8.92 mm)

9.68 in (245.872 mm)

Gold

0.39 in (9.9 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

25 mA

Solder

100 mΩ

Copper Alloy

6

24 V

0.122 in (3.099 mm)

418217270906A

Wurth Elektronik

Through Hole-Right Angle

2000 Cycle(s)

100 MΩ

Tube

0.639 in (16.24 mm)

9.68 in (245.872 mm)

Gold

0.39 in (9.9 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

25 mA

Solder

100 mΩ

Copper Alloy

12

24 V

0.122 in (3.099 mm)

CHS-01TB2

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.213 in (5.4 mm)

2.5 in (63.5 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

CHS-02B1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Bag

0.213 in (5.4 mm)

4.1 in (104.14 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-06A1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Bag

0.362 in (9.2 mm)

5.6 in (142.24 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

EDS02SNRSTR04Q

TE Connectivity

Panel Mount

Tape and Reel

0.196 in (4.98 mm)

Tape Sealed

Gold over Nickel

0.136 in (3.45 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

EDS03SGRSTU04Q

TE Connectivity

Panel Mount

Tube

0.296 in (7.52 mm)

Tape Sealed

Gold over Nickel

0.134 in (3.4 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

EDS08SNRNTR04Q

TE Connectivity

Panel Mount

Tape and Reel

0.796 in (20.22 mm)

Gold over Nickel

0.136 in (3.45 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

DIP & SIP Switches

DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.

DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.

SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.