| Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.358 in (9.09 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.358 in (9.09 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed; Tube |
1.075 in (27.3 mm) |
7.5 in (190.5 mm) |
IP40; Waterproof; Top Tape Sealed |
0.138 in (3.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
||||||||||||||
|
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed; Tube |
0.677 in (17.2 mm) |
7.5 in (190.5 mm) |
IP40; Waterproof; Top Tape Sealed |
0.138 in (3.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
||||||||||||||
|
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed; Tube |
0.776 in (19.7 mm) |
7.5 in (190.5 mm) |
IP40; Waterproof; Top Tape Sealed |
0.138 in (3.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
1.054 in (26.7716 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.254 in (6.4516 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.254 in (6.4516 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.354 in (8.9916 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.354 in (8.9916 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.454 in (11.5316 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.554 in (14.0716 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.554 in (14.0716 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.654 in (16.6116 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.654 in (16.6116 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.754 in (19.1516 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.754 in (19.1516 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.854 in (21.6916 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.854 in (21.6916 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.954 in (24.2316 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.954 in (24.2316 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
Wurth Elektronik |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
Tube |
0.351 in (8.92 mm) |
9.68 in (245.872 mm) |
Gold |
0.39 in (9.9 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
6 |
24 V |
0.122 in (3.099 mm) |
||||||||||||
|
Wurth Elektronik |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
Tube |
0.639 in (16.24 mm) |
9.68 in (245.872 mm) |
Gold |
0.39 in (9.9 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
12 |
24 V |
0.122 in (3.099 mm) |
||||||||||||
|
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.213 in (5.4 mm) |
2.5 in (63.5 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
||||||||||||
|
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Bag |
0.213 in (5.4 mm) |
4.1 in (104.14 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Bag |
0.362 in (9.2 mm) |
5.6 in (142.24 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.196 in (4.98 mm) |
Tape Sealed |
Gold over Nickel |
0.136 in (3.45 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
||||||||||||||||
|
|
TE Connectivity |
Panel Mount |
Tube |
0.296 in (7.52 mm) |
Tape Sealed |
Gold over Nickel |
0.134 in (3.4 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
||||||||||||||||
|
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.796 in (20.22 mm) |
Gold over Nickel |
0.136 in (3.45 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.