DIP & SIP Switches

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Part RoHS Manufacturer Mounting Feature Maximum Contact AC Rating (R Load) Electrical Life Maximum Contact DC Power Rating (R Load) Insulation Resistance Packing Method Body Length/Diameter Body Width Sealing End Contact Plating Body Height Maximum Contact DC Rating (R Load) Maximum Operating Temperature Maximum AC Contact Current Minimum Operating Temperature Terminal Finish Maximum DC Contact Current Termination Type Manufacturer Series Contact Resistance End Contact Material PCB Hole Count Maximum DC Contact Voltage Additional Features Maximum AC Contact Voltage JESD-609 Code Terminal Length Maximum Contact AC Power Rating (R Load)

EDS04SNNNTU04Q

TE Connectivity

Panel Mount

Tube

0.396 in (10.06 mm)

Gold over Nickel

0.152 in (3.85 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

EDS08SNNNTR04Q

TE Connectivity

Panel Mount

Tape and Reel

0.796 in (20.22 mm)

Gold over Nickel

0.152 in (3.85 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

EDSP02SGRFSTR04

TE Connectivity

Panel Mount

Tape and Reel

0.196 in (4.98 mm)

Tape Sealed

Gold over Nickel

0.197 in (5 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

EDSP06SGRNSTU04

TE Connectivity

Panel Mount

Tube

0.596 in (15.14 mm)

Tape Sealed

Gold over Nickel

0.197 in (5 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

EDSP10SGRFSTU04

TE Connectivity

Panel Mount

Tube

0.996 in (25.3 mm)

Tape Sealed

Gold over Nickel

0.197 in (5 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

TDS09SGNNTU04

TE Connectivity

Panel Mount

Tube

0.946 in (24.02 mm)

0.146 in (3.7 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

KAS1108E

E-switch

Through Hole-Straight

100 MΩ

0.854 in (21.6916 mm)

9.8806 in (250.967 mm)

Gold over Nickel

0.236 in (5.9944 mm)

0.1A@50VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold/Nickel

100 mA

Solder

100 mΩ

Phosphor Bronze

16

50 V

Packaging Tape

0.126 in (3.2 mm)

A6SN-8102-P

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, Embossed; Tube

0.878 in (22.3 mm)

7.5 in (190.5 mm)

IP40; Waterproof; Top Tape Sealed

0.138 in (3.5 mm)

0.025A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

25 mA

Solder

200 mΩ

24 V

A6E-2101-N

Omron

Through Hole-Straight

1000 Cycle(s)

100 MΩ

0.254 in (6.4516 mm)

9.906 in (251.612 mm)

Gold

0.23 in (5.842 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

24 V

0.126 in (3.2 mm)

CHS-02TA1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.22 in (5.6 mm)

4.1 in (104.14 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-04TB2

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.26 in (6.6 mm)

5.4 in (137.16 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-04TA2

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.26 in (6.6 mm)

5.6 in (142.24 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-04TA1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.26 in (6.6 mm)

5.6 in (142.24 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-02TA2

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.22 in (5.6 mm)

4.1 in (104.14 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

KAS1108R

E-switch

Through Hole-Straight

100 MΩ

0.854 in (21.6916 mm)

9.8806 in (250.967 mm)

Gold over Nickel

0.236 in (5.9944 mm)

0.1A@50VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold/Nickel

100 mA

Solder

100 mΩ

Phosphor Bronze

16

50 V

Packaging Tape

0.126 in (3.2 mm)

CHS-04TB1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.26 in (6.6 mm)

5.4 in (137.16 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-04A1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Bag

0.26 in (6.6 mm)

5.6 in (142.24 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

CHS-06A

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Bag

0.362 in (9.2 mm)

5.6 in (142.24 mm)

Waterproof

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

219-4LPST-P

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.68 in (169.672 mm)

Environmentally Sealed; Waterproof

Gold

0.158 in (4.02 mm)

85 °C (185 °F)

-55 °C (-67 °F)

Solder

50 mΩ

Beryllium Copper

Low Profile, Standard: UL

DIP & SIP Switches

DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.

DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.

SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.