| Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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|
TE Connectivity |
Panel Mount |
Tube |
0.396 in (10.06 mm) |
Gold over Nickel |
0.152 in (3.85 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
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|
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.796 in (20.22 mm) |
Gold over Nickel |
0.152 in (3.85 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
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|
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.196 in (4.98 mm) |
Tape Sealed |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
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|
|
TE Connectivity |
Panel Mount |
Tube |
0.596 in (15.14 mm) |
Tape Sealed |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
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|
|
TE Connectivity |
Panel Mount |
Tube |
0.996 in (25.3 mm) |
Tape Sealed |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
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|
|
TE Connectivity |
Panel Mount |
Tube |
0.946 in (24.02 mm) |
0.146 in (3.7 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
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|
|
E-switch |
Through Hole-Straight |
100 MΩ |
0.854 in (21.6916 mm) |
9.8806 in (250.967 mm) |
Gold over Nickel |
0.236 in (5.9944 mm) |
0.1A@50VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold/Nickel |
100 mA |
Solder |
100 mΩ |
Phosphor Bronze |
16 |
50 V |
Packaging Tape |
0.126 in (3.2 mm) |
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|
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed; Tube |
0.878 in (22.3 mm) |
7.5 in (190.5 mm) |
IP40; Waterproof; Top Tape Sealed |
0.138 in (3.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
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|
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.254 in (6.4516 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
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|
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.22 in (5.6 mm) |
4.1 in (104.14 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
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|
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.26 in (6.6 mm) |
5.4 in (137.16 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
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|
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.26 in (6.6 mm) |
5.6 in (142.24 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
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|
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.26 in (6.6 mm) |
5.6 in (142.24 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
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|
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.22 in (5.6 mm) |
4.1 in (104.14 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
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|
|
E-switch |
Through Hole-Straight |
100 MΩ |
0.854 in (21.6916 mm) |
9.8806 in (250.967 mm) |
Gold over Nickel |
0.236 in (5.9944 mm) |
0.1A@50VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold/Nickel |
100 mA |
Solder |
100 mΩ |
Phosphor Bronze |
16 |
50 V |
Packaging Tape |
0.126 in (3.2 mm) |
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|
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.26 in (6.6 mm) |
5.4 in (137.16 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
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|
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Bag |
0.26 in (6.6 mm) |
5.6 in (142.24 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
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|
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Bag |
0.362 in (9.2 mm) |
5.6 in (142.24 mm) |
Waterproof |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
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|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.68 in (169.672 mm) |
Environmentally Sealed; Waterproof |
Gold |
0.158 in (4.02 mm) |
85 °C (185 °F) |
-55 °C (-67 °F) |
Solder |
50 mΩ |
Beryllium Copper |
Low Profile, Standard: UL |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.