RECTANGULAR Other Function Telecom Interface ICs 538

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX2510EEI	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	25 mA	3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.75 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2105CWI	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e0		245	17.9 mm
MAX2511EEI	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.045 mA	3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
L3845B	STMicroelectronics	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				20 V	20	IN-LINE	DIP8,.3	Analog Transmission Interfaces	2.54 mm	70 Cel	-40 Cel	MATTE TIN	DUAL	R-PDIP-T8		5.08 mm	7.62 mm	Not Qualified	e3
MAX3267CSA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.05 mA	3.3 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
AD803-20BR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.06 mA	5 V	5	SMALL OUTLINE	SOP20,.4	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20				Not Qualified	e0
L3845D1013TR	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm	70 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
CY7B923-SC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS	85 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28	1	2.67 mm	7.5 mm	Not Qualified	e0	30	225	17.905 mm
MAX3120CSA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3120ESA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX2472EUT-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e0			2.9 mm
MAX2473EUT-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e0			2.9 mm
LM3290TME/NOPB	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	30	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B30	1	.675 mm			e1	30	260
LM3290TMX/NOPB	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	30	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B30	1	.675 mm			e1	30	260
LM3291TME/NOPB	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B12	1	.675 mm			e1	30	260
LM3291TMX/NOPB	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B12	1	.675 mm			e1	30	260
BGS12SL6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				3 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B6		.32 mm	.7 mm			NOT SPECIFIED	NOT SPECIFIED	1.1 mm
MAX3750CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.084 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3751CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.078 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			4.89 mm
BQ51010BYFPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B28	1	.5 mm	1.88 mm		e1	30	260	3 mm
AD8015AR-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			26 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0		240	4.9 mm
AD9832BRU-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0		240	5 mm
MAX3265CUE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
ABBTM-NVC-MDCS42A	Abracon	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	R-XXMA-N32	3	2.2 mm	13.4 mm					25.8 mm
AD974AN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		BICMOS		5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.33 mm	7.62 mm	Not Qualified	e0			36.687 mm
AD974BN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		BICMOS		5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.33 mm	7.62 mm	Not Qualified	e0			36.687 mm
AD9832BRU	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0		240	5 mm
AD974AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified	e0		240	17.9 mm
AD974BRS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	2 mm	5.3 mm	Not Qualified	e0		240	10.2 mm
AD974BR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified	e0		240	17.9 mm
BQ51021YFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-XBGA-B42	1	.5 mm	2.844 mm		e1	30	260	3.556 mm
TRF8011PWP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS	350 mA	4.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6.5 mm
MAX3265EUE	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0	20	240	5 mm
MAX3750CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.084 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
V23814-U1306-M130	Infineon Technologies	TELECOM CIRCUIT		GULL WING	72		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		FIBER OPTIC							UNSPECIFIED	R-XXFO-G72				Not Qualified
V23815-U1306-M130	Infineon Technologies	TELECOM CIRCUIT		GULL WING	72		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		FIBER OPTIC							UNSPECIFIED	R-XXFO-G72				Not Qualified
ALM-1912-BLKG	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	9	QCCN	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD	R-XQCC-N9	3	1.05 mm	2 mm				260	2.9 mm
ALM-1912-TR1G	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	9	QCCN	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD	R-XQCC-N9	3	1.05 mm	2 mm				260	2.9 mm
BTM431	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	R-XXMA-X						NOT SPECIFIED	NOT SPECIFIED
TMS3705A1DRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	3	1.75 mm	3.9 mm	Not Qualified	e4	30	260	9.9 mm
HFBR-5320Z	Broadcom	TELECOM CIRCUIT	COMMERCIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1				5 V		FIBER OPTIC				70 Cel	0 Cel	MATTE TIN	UNSPECIFIED	R-XXFO-X				Not Qualified	e3		260
U2270B-MFPY	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, LOW PROFILE			1.27 mm	105 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.4 mm	3.8 mm	Not Qualified	e3		260	9.9 mm
PCM3060PW	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS		3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	2	1.2 mm	4.4 mm	Not Qualified	e4	30	260	9.7 mm
AD73360ARZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified	e3	30	260	17.9 mm
AD974BRS-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	2 mm	5.3 mm	Not Qualified	e0		240	10.2 mm
AN7580	Panasonic	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	12	SIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		BIPOLAR		12 V		IN-LINE				75 Cel	-25 Cel		SINGLE	R-PSIP-T12				Not Qualified
HT2DC20S20/F,122	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	PLASTIC/EPOXY	YES	1		HYBRID				SPECIAL SHAPE	MODULE(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel		UNSPECIFIED	R-PXSS-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
HTRC11001T/02EE,11	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.01 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1		4 mm	Not Qualified	e4	30	260	8.75 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.