RECTANGULAR Other Function Telecom Interface ICs 538

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SA639DH,512	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.01 mA	3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified			40	260	7.8 mm
SA647DH,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e4			6.5 mm
SA647DH,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified					6.5 mm
MP45DT02TR-M	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	6	LGA	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		GRID ARRAY				85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	BOTTOM		R-XBGA-N6	3	1.35 mm	3.76 mm			e4		260	4.72 mm
MRF24J40MDT-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDMA-N12		3.3528 mm	22.86 mm			e3			33.02 mm
STHVDAC-253MF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	16	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B16		.655 mm	1.6 mm				NOT SPECIFIED	NOT SPECIFIED	1.7 mm
ALM-GN001-BLKG	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6		.9 mm	1.7 mm						2.3 mm
ALM-GN001-TR1G	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6		.9 mm	1.7 mm						2.3 mm
TDA7255V	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3 V	2.5/5	CHIP CARRIER, VERY THIN PROFILE	LCC40,.22X.26,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		R-PQCC-N40		.9 mm	5.5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	6.5 mm
MCP2150-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	TS 16949		3.3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G18	2	2.64 mm	7.49 mm	Not Qualified		e3	40	260	17.87 mm
TDA5101	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				260	5 mm
MAX3277U/D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	9	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		.041 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N9				Not Qualified		e0
TSC2200IPWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified	SINGLE-ENDED	e4	30	260	9.7 mm
AD1803JRU	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Modems	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified		e0			7.8 mm
AD9832BRU-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0		240	5 mm
TDA5204	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0064 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified				235	9.7 mm
RI-TMS3705ADR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm	3.9 mm	Not Qualified		e4			9.9 mm
AD61009ARSRL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL		R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified		e0		240	7.2 mm
ADA2200ARUZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G16	1	1.2 mm	4.4 mm			e3	30	260	5 mm
ADA2200ARUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G16	1	1.2 mm	4.4 mm			e3	30	260	5 mm
ALM-GN002-BLKG	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER				85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD		R-XQCC-N8	3	1 mm	2 mm			e4	20	260	2.5 mm
ALM-GN002-TR1G	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER				85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD		R-XQCC-N8	3	1 mm	2 mm			e4	20	260	2.5 mm
ALM-GP001-BLKG	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	QCCN	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD		R-XQCC-N12		1.1 mm	2.5 mm						3 mm
ALM-GP001-TR1G	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	QCCN	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD		R-XQCC-N12	3	1.1 mm	2.5 mm					260	3 mm
BQ51025YFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm			e1	30	260	3.556 mm
HPA01195YFPR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-PBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
ISO150AU/1K	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	12	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	BICMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G12	3	2.65 mm	7.5 mm	Not Qualified		e4	30	260	17.9 mm
MCP2140-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	TS 16949		3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G18	2	2.64 mm	7.49 mm	Not Qualified		e3			11.53 mm
ADN2820ACHIPS	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR			3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-15 Cel		UPPER		R-XUUC-N14				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
T555711-TAS	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.00004 mA			SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8			3.8 mm	Not Qualified		e0			4.925 mm
MAX7044AKA-T	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0257 mA	2.7 V	2.7	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified		e0			2.9 mm
ONET9901TAY	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	18	DIE	RECTANGULAR	UNSPECIFIED	YES	1			.041 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	0 Cel		UPPER		R-XUUC-N18				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
ADM1041ARQ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24	1	1.7526 mm	3.9116 mm	Not Qualified		e0		240	8.6614 mm
MAX1470EUI-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified		e0		245	9.7 mm
MAX2511EEI-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.045 mA	3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified		e0			9.89 mm
ONET2511TAY	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1			.035 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER	2500 Mbps	R-XUUC-N10				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
CR14-MQP/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.02 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-20 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified					9.9 mm
RI-R6C-001A-03	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.2 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	6.5 mm
AD8315ACPZ-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0129 mA	2.7 V	3/5	SMALL OUTLINE	SOLCC8,.08,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	MATTE TIN	DUAL		R-XDSO-N8	1	1 mm	2 mm	Not Qualified		e3	30	260	3 mm
AD9832BRUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	5 mm
AD9832BRUZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	5 mm
ISO150AUG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	12	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	BICMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G12	3	2.65 mm	7.5 mm	Not Qualified		e4	30	260	17.9 mm
ADF7012BRU-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		e0			7.8 mm
AD73311LARSZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified		e3	40	260	7.2 mm
AD73311LARUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Modems	.65 mm	105 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3		260	6.5 mm
AD9860BSTZ	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel	MATTE TIN	QUAD		R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified		e3	30	260	20 mm
AD9860BSTZRL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel	MATTE TIN	QUAD		R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified		e3		260	20 mm
AD9862BSTZ	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel	MATTE TIN	QUAD		R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified		e3	30	260	20 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.