RECTANGULAR Other Function Telecom Interface ICs 538

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SA5211D/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e4

8.65 mm

SA5211D/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e4

8.65 mm

SA5212AD/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

4.9 mm

SA5212AD/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

4.9 mm

SA5217D/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

2.65 mm

7.5 mm

Not Qualified

e4

12.8 mm

SA5217D/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

2.65 mm

7.5 mm

Not Qualified

e4

12.8 mm

SA602AN/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

6 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T8

4.2 mm

7.62 mm

Not Qualified

e4

9.5 mm

SA612AN/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

6 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T8

4.2 mm

7.62 mm

Not Qualified

e4

9.5 mm

MCP2140A-I/P

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

TS 16949

3 V

IN-LINE

DIP18,.3

2.54 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDIP-T18

5.334 mm

7.62 mm

Not Qualified

e3

22.86 mm

MCP2140A-I/SO

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

3 V

SMALL OUTLINE

SOP18,.4

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G18

2

2.65 mm

7.5 mm

Not Qualified

e3

40

260

11.55 mm

SA602AD/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

SA602AD/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

SA606D/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

6.5 mm

SA606D/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

6.5 mm

SA606DK/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

SA606DK/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

SA607DK/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

6.5 mm

SA607DK/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

6.5 mm

SA612AD/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

260

4.9 mm

SA612AD/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

SA616DK/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

260

6.5 mm

SA616DK/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

260

6.5 mm

SA636DK/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

SSOP20,.25

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

SA636DK/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

SSOP20,.25

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

SA639DH/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G24

1

1.1 mm

4.4 mm

Not Qualified

e4

260

7.8 mm

HCPL-800J-500E

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.056 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-G16

1

3.632 mm

7.493 mm

Not Qualified

e3

260

10.312 mm

ONET2591TAYS

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

11

DIE

RECTANGULAR

UNSPECIFIED

YES

1

.023 mA

3.3 V

3.3

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

UPPER

R-XUUC-N11

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

PCM3060PWRG4

Texas Instruments

TELECOM CIRCUIT

OTHER

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-25 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G28

2

1.2 mm

4.4 mm

Not Qualified

e4

NOT SPECIFIED

260

9.7 mm

ONET4291TAYS

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

10

DIE

RECTANGULAR

UNSPECIFIED

YES

1

.025 mA

3.3 V

3.3

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

UPPER

R-XUUC-N10

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

DS2291/87-22291-000

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

30

RECTANGULAR

UNSPECIFIED

NO

1

5 V

MICROELECTRONIC ASSEMBLY

70 Cel

0 Cel

TIN LEAD

SINGLE

R-XSMA-N30

Not Qualified

e0

RN41-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

MATTE TIN

UNSPECIFIED

R-XXMA-N32

2.2 mm

13.2 mm

e3

25.8 mm

RN41N-I/RM477

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

35

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

MATTE TIN

QUAD

R-XQMA-N35

2.2 mm

13.2 mm

e3

20.1 mm

RN41N-I/RM615

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

35

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

MATTE TIN

QUAD

R-XQMA-N35

2.2 mm

13.2 mm

e3

20.1 mm

ONET8501TYS

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

19

DIE

RECTANGULAR

UNSPECIFIED

YES

1

44 mA

3.3 V

UNCASED CHIP

100 Cel

-40 Cel

UPPER

11300 Mbps

R-XUUC-N19

Not Qualified

Data rate is 11.3 Gbps

NOT SPECIFIED

NOT SPECIFIED

ONET8501TY

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

19

DIE

RECTANGULAR

UNSPECIFIED

YES

1

44 mA

3.3 V

UNCASED CHIP

100 Cel

-40 Cel

UPPER

11300 Mbps

R-XUUC-N19

Not Qualified

Data rate is 11.3 Gbps

NOT SPECIFIED

NOT SPECIFIED

XRT85L61IG-F

Exar

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G28

1

1.2 mm

4.4 mm

Not Qualified

e3

9.7 mm

MRF24WB0MA/RM

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

36

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

3.3

UNCASED CHIP

MODULE,36LEAD,.8

Other Telecom ICs

70 Cel

0 Cel

MATTE TIN

UPPER

R-XUUC-N36

Not Qualified

e3

MRF24WB0MB/RM

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

36

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

UNCASED CHIP

70 Cel

0 Cel

MATTE TIN

UPPER

R-XUUC-N36

Not Qualified

e3

UAA3201T/V1,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.5/6

SMALL OUTLINE

SOP16,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

Not Qualified

UAA3220TS/V1,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

2 mm

5.3 mm

8.2 mm

SA5211D,602

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.031 mA

5 V

5

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

40

260

8.65 mm

SA5212AD,602

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.033 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

40

260

4.9 mm

SA602AD,602

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

4.9 mm

SA606DK,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

40

260

6.5 mm

SA606DK,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

SA612AN,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

6 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

DUAL

R-PDIP-T8

4.2 mm

7.62 mm

Not Qualified

40

250

9.5 mm

SA636DK,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

40

260

6.5 mm

SA636DK,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.