RECTANGULAR Other Function Telecom Interface ICs 538

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MMG30271BT1	NXP Semiconductors	TELECOM CIRCUIT		FLAT	3	LSOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V	SMALL OUTLINE, LOW PROFILE		1.5 mm				SINGLE		R-PSSO-F3	1	1.6 mm	2.5 mm			40	260	4.5 mm
MMG30301BT1	NXP Semiconductors	TELECOM CIRCUIT		FLAT	3	LSOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V	SMALL OUTLINE, LOW PROFILE		1.5 mm				SINGLE		R-PSSO-F3	1	1.6 mm	2.5 mm			40	260	4.5 mm
SPWF04SA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.524 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N30		2.3 mm	15.24 mm			NOT SPECIFIED	NOT SPECIFIED	26.924 mm
SPWF04SC	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.524 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N30		2.3 mm	15.24 mm			NOT SPECIFIED	NOT SPECIFIED	26.924 mm
PI3USB30532ZLE	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N40		.8 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
WYSBHVGXG	Taiyo Yuden	TELECOM CIRCUIT	OTHER	NO LEAD	70		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N70		1.9 mm	8.9 mm			NOT SPECIFIED	NOT SPECIFIED	12.6 mm
EFR32BG1B232F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B43		.54 mm	3.143 mm					3.295 mm
EFR32BG1P332F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B43	1	.54 mm	3.143 mm		e1	40	260	3.295 mm
EFR32BG1V132F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B43		.54 mm	3.143 mm					3.295 mm
PI3PCIE3242ZLEX	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N30		.8 mm	2.5 mm			30	260	4.5 mm
NEO-M8Q-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100; TS 16949	3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm					16 mm
BGM111E256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BUTT	31		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B31		2.15 mm	12.9 mm					15 mm
BM71BLE01FC2-0B02AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V	MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)	1.2 mm	85 Cel	-40 Cel		QUAD	.0086 Mbps	R-XQMA-N17		1.66 mm	6 mm			30	260	8 mm
SL869GNS117T001	Telit Communications Plc	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	SMALL OUTLINE			85 Cel	-40 Cel		DUAL		R-PDSO-N24		2.4 mm	12.2 mm			NOT SPECIFIED	NOT SPECIFIED	16 mm
MGM111A256V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N31		2.1 mm	12.9 mm					15 mm
BGM111A256V21	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES				3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2.2 mm	12.9 mm					15 mm
AMW037	Silicon Labs	TELECOM CIRCUIT		NO LEAD	44	QMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XQMA-N44		2.72 mm	16.51 mm					24.77 mm
ATSAMB11-XR2100A	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	49	HLGA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.6 V	GRID ARRAY, HEAT SINK/SLUG			85 Cel	-40 Cel		BOTTOM		R-XBGA-N49		1.4 mm	4.5 mm					5.5 mm
RN4870U-V/RM118	Microchip Technology	TELECOM CIRCUIT		NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3 V	MICROELECTRONIC ASSEMBLY			70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N30		1.6 mm	12 mm					15 mm
RN4871-V/RM118	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3 V	MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)	1.2 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm					11.5 mm
MAX-8Q	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	3 V	SMALL OUTLINE			85 Cel	-40 Cel		DUAL		R-PDSO-N18						NOT SPECIFIED	NOT SPECIFIED
CC2564BYFVR-XI	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1			3.6 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 Mbps	R-XBGA-B54	1	.575 mm	2.93 mm		e1	30	260	3.26 mm
CC2560BYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1	.575 mm	2.925 mm		e1	30	260	3.265 mm
CC2560BYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1	.575 mm	2.925 mm		e1	30	260	3.265 mm
TLE8457BSJXUMA1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100	8 V	SMALL OUTLINE		1.27 mm			TIN	DUAL		R-PDSO-G8	3	1.75 mm	4 mm		e3			5 mm
BGS13PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		2.85 V	CHIP CARRIER		.4 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm		e3			1.5 mm
BGM1033N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.54 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGM15HA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V	CHIP CARRIER, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		R-PBCC-N12	1	.65 mm	1.1 mm		e4			1.9 mm
BGM15MA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V	CHIP CARRIER, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBCC-N12	1	.65 mm	1.1 mm					1.9 mm
BGT24AR2E6433XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm	4.5 mm		e3			5.5 mm
BGT24AT2E6433XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm	4.5 mm		e3			5.5 mm
BGT24ATR12E6433XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm	4.5 mm		e3			5.5 mm
RN4870-I/RM128	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	NO	1			3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm					22 mm
LEA-6H-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100	3 V	MICROELECTRONIC ASSEMBLY		1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N28		2.7 mm	17 mm			NOT SPECIFIED	NOT SPECIFIED	22.4 mm
LC72720YVS-MPB-E	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	30	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL		R-PDSO-G30	4	1.5 mm	5.6 mm		e6	30	260	9.75 mm
LC72720YVS-TLM-E	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	30	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL		R-PDSO-G30	4	1.5 mm	5.6 mm		e6	30	260	9.75 mm
IP4047CX6/LF,135	Nexperia	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6		.7 mm	.99 mm					1.44 mm
RN41XVC-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		DUAL		R-XDMA-T20	1	2 mm	24.4 mm					29.9 mm
RN41XVU-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	DUAL		R-XDMA-T20		2 mm	24.4 mm		e4			29.9 mm
RN42XVU-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	DUAL		R-XDMA-T20		2 mm	24.4 mm		e4			29.9 mm
AX-SFEU-1-01-TB05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N40	1	1 mm	5 mm		e4		260	7 mm
BGA5M1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V	CHIP CARRIER		.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
BGSF110GN26E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	26	HQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	CHIP CARRIER, HEAT SINK/SLUG			85 Cel	-30 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		R-PQCC-N26	1	.77 mm	2.6 mm		e4			3.4 mm
RM024-P125-C-30	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.5 Mbps	R-XXMA-X				ALSO AVAILABLE WITH 280kbps data rate		NOT SPECIFIED	NOT SPECIFIED
RM024-S125-C-30	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.5 Mbps	R-XXMA-X				ALSO AVAILABLE WITH 280kbps data rate		NOT SPECIFIED	NOT SPECIFIED
LEA-6T-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	3 V	SMALL OUTLINE			85 Cel	-40 Cel		DUAL		R-PDSO-N28
BGAU1A10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V	CHIP CARRIER		.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.65 mm	1.1 mm					1.5 mm
ACFM-7037-TR1	Broadcom	TELECOM CIRCUIT		NO LEAD	15		RECTANGULAR	UNSPECIFIED	YES	1				MICROELECTRONIC ASSEMBLY						UNSPECIFIED		R-XXMA-N15		.8 mm	2 mm					3.6 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.