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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MWCT1001AVLHR	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	3.3 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD		S-PQFP-G64	3	1.6 mm	10 mm		e3	40	260	10 mm
VSC8491YJU-13	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V	GRID ARRAY, LOW PROFILE		1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm					15 mm
ADTR1107ACCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	TFLGA	SQUARE	UNSPECIFIED	YES	1			5 V	GRID ARRAY, THIN PROFILE, FINE PITCH	LCC24,.2SQ,25	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-N24	3	1.13 mm	5 mm		e4		260	5 mm
ADL5910ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm	3 mm		e4	30	260	3 mm
ADF5901ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.8 mm	5 mm			30	260	5 mm
HMC8100LP6JETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N40	3	.95 mm	6 mm		e4	30	260	6 mm
STA8089GR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.1 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.9 mm	7 mm					7 mm
MMDS25254HT1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.23,20	.5 mm	150 Cel		TIN	QUAD		S-PQCC-N32	3	.9 mm	6 mm		e3	40	260	6 mm
MMDS09254HT1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.23,20	.5 mm	150 Cel		TIN	QUAD		S-PQCC-N32	3	.9 mm	6 mm		e3	40	260	6 mm
ADC32RF83IRRHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm		e4	30	260	10 mm
ADC32RF80IRRHT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm		e4	30	260	10 mm
ADC32RF83IRRHT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm		e4	30	260	10 mm
ADC32RF80IRRHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm		e4	30	260	10 mm
ESP8285N08	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-40 Cel	TIN	QUAD	72.2 Mbps	S-XQCC-N32	3	.9 mm	5 mm		e3	30	250	5 mm
SIM7070G	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1				MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		QUAD	1.119 Mbps	S-XQMA-N68
SIM7000E	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1			3.8 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		QUAD	.375 Mbps	S-XQMA-N68
SIM7000G	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1			3.8 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		QUAD	.375 Mbps	S-XQMA-N68
SIM7600G-HR2	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	135	XMA	SQUARE	UNSPECIFIED	YES	1			3.8 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	150 Mbps	S-XXMA-N135		2.9 mm	30 mm					30 mm
ADF5709BEZ	Analog Devices	TELECOM CIRCUIT		NO LEAD	24	QCCN	SQUARE	CERAMIC	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD		S-CQCC-N24		1.2 mm	3.9 mm					3.9 mm
ADF5709BEZ-R7	Analog Devices	TELECOM CIRCUIT		NO LEAD	24	QCCN	SQUARE	CERAMIC	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD		S-CQCC-N24		1.2 mm	3.9 mm					3.9 mm
AX5043-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	.125 Mbps	S-XQCC-N28	1	1 mm	5 mm			30	260	5 mm
WP3160W6NFEI-320B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY						BOTTOM		S-PBGA-B672
WP3161F5NFEI-320B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY						BOTTOM		S-PBGA-B672
WP3161W6NFEI-320B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY						BOTTOM		S-PBGA-B672
WP3161D4NFEI-400B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY						BOTTOM		S-PBGA-B672
AD9988BBPZRL-4D4AC	Analog Devices	TELECOM CIRCUIT		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V	GRID ARRAY, HEAT SINK/SLUG		.8 mm	120 Cel	-40 Cel		BOTTOM		S-PBGA-B324		1.72 mm	15 mm					15 mm
ADRV9002BBCZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,32	.8 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.19 mm	12 mm			30	260	12 mm
ADRV9002BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,32	.8 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.19 mm	12 mm			30	260	12 mm
ESP32-D0WDQ6-V3	Espressif Systems (Shanghai)	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	.4 mm	125 Cel	-40 Cel		QUAD	150 Mbps	S-XQCC-N48		.9 mm	6 mm					6 mm
AFE8092IABJ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) : 600, RF frequency(Max)(MHz) : 5500	e1	30	260	17 mm
ADRF5519BCPZN	Analog Devices	TELECOM CIRCUIT		NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD		S-PQCC-N40	3	1 mm	6 mm			30	260	6 mm
ADRF5519BCPZN-RL	Analog Devices	TELECOM CIRCUIT		NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD		S-PQCC-N40	3	1 mm	6 mm			30	260	6 mm
ADRV9004BBCZ-RL	Analog Devices	TELECOM CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	2			1 V	GRID ARRAY		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.25 mm	12 mm			30	260	12 mm
ADRV9004BBCZ	Analog Devices	TELECOM CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	2			1 V	GRID ARRAY		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.25 mm	12 mm			30	260	12 mm
PN7160B1HN/C100Y	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.23SQ,20	.5 mm	85 Cel	-25 Cel		QUAD	.848 Mbps	S-PQCC-N40	3	1 mm	6 mm	ALSO AVAILABLE WTH 3.3 SUPPLY			260	6 mm
AFE7903IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1			.925 V	GRID ARRAY	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz	e1		260	17 mm
ATA8710-GHQW	Microchip Technology	TELECOM CIRCUIT		NO LEAD	32		SQUARE	UNSPECIFIED	YES	1			5 V		LCC32(UNSPEC)		85 Cel	-40 Cel		QUAD	.08 Mbps	S-XQCC-N32
BC57G687C-ANN-E4	Qualcomm	TELECOM CIRCUIT		BALL	105	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA105,11X11,32	.8 mm	85 Cel	-40 Cel		BOTTOM	12 Mbps	S-PBGA-B105		1.6 mm	10 mm					10 mm
AFE7903IALK	Texas Instruments	TELECOM CIRCUIT		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1			.925 V	GRID ARRAY	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz	e0		220	17 mm
AFE8092HIABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500	e1		260	17 mm
AFE7952IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm			TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) : 0; RF frequency(Max)(MHz) : 12000	e1		260	17 mm
AFE8000IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Max)(MHz) : 7000	e1		260	17 mm
AFE7901IALK	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			.925 V	GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm		e0		220	17 mm
AFE7901IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			.925 V	GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm		e1		260	17 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.