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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADC32RF80IRMPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm			e4	30	260	10 mm
BGM121A256V1R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1						3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56		1.4 mm	6.5 mm						6.5 mm
BGM121A256V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1						3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56		1.4 mm	6.5 mm						6.5 mm
BGM123N256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1						3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56	3	1.4 mm	6.5 mm				40	260	6.5 mm
CC2564CRVMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.6 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	4 Mbps	S-XQCC-N76	3	.9 mm	8 mm			e3	30	260	8 mm
HMC625BLP5ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	3	1 mm	5 mm			e3	30	260	5 mm
CYBLE-214009-00	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		SQUARE	UNSPECIFIED	YES	1						3.3 V	MICROELECTRONIC ASSEMBLY		.66 mm	85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N32		1.8 mm	11 mm				NOT SPECIFIED	NOT SPECIFIED	11 mm
ADC32RF83IRMPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm			e4	30	260	10 mm
ADC32RF83IRMPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm			e4	30	260	10 mm
LXMSAPHA08-136	Murata Manufacturing	TELECOM CIRCUIT	OTHER	NO LEAD			SQUARE	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			70 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N		.8 mm	8.3 mm				NOT SPECIFIED	NOT SPECIFIED	8.3 mm
ATA8520E-GHPW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	.0006 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
SN65DSI85TPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			1.8 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 Mbps	S-PQFP-G64	3	1.2 mm	10 mm			e4	30	260	10 mm
AD6684BCPZ-500	Analog Devices	TELECOM CIRCUIT		NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1						.975 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			MATTE TIN	QUAD		S-XQCC-N72	3	1 mm	10 mm			e3	30	260	10 mm
AD6684BCPZRL7-500	Analog Devices	TELECOM CIRCUIT		NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1						.975 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			MATTE TIN	QUAD		S-XQCC-N72	3	1 mm	10 mm			e3	30	260	10 mm
AD9363ABCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm				30	260	10 mm
AD9363ABCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm				30	260	10 mm
ADS58J64IRMPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N72	3	.9 mm	10 mm		2 V	e4	30	260	10 mm
ADS58J64IRMPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N72	3	.9 mm	10 mm		2 V	e4	30	260	10 mm
ATA8210-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
ATA8215-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
BCM20733A3KML1G	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	70 Cel	0 Cel		QUAD		S-XQCC-N56		1 mm	7 mm						7 mm
BCM43570KFFBG	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	BALL	242	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA242,23X23,16	.4 mm	60 Cel	0 Cel		BOTTOM	867 Mbps	S-PBGA-B242		1.05 mm	10 mm	Also has 1.2 V core supply					10 mm
HMC8108LC5TR-R5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	1.12 mm	4.9 mm				30	260	4.9 mm
HMC8108LC5TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	1.12 mm	4.9 mm				30	260	4.9 mm
HMC8108LC5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	1.12 mm	4.9 mm				30	260	4.9 mm
EFR32BG1B132F256GM32-C0R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N32	2	.9 mm	5 mm			e3	NOT SPECIFIED	260	5 mm
ADRF6821ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N56	3	.8 mm	8 mm			e4	30	260	8 mm
ADRF6821ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N56	3	.8 mm	8 mm			e4	30	260	8 mm
HPA01211RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	2					1.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm			e4	30	260	5 mm
TC35678FSG-002	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N40		.9 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
AD9172BBPZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V	GRID ARRAY, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.71 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
AD9172BBPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V	GRID ARRAY, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.71 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
HPA00399RHDR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N28	3	1 mm	5 mm			e4	30	260	5 mm
HPA02243RGZR	Texas Instruments	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm
TUSB214QRWBTQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100		.03 mA	3.3 V	CHIP CARRIER, VERY THIN PROFILE		.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm			e4	30	260	1.6 mm
TUSB212QRWBRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100		.03 mA	3.3 V	CHIP CARRIER, VERY THIN PROFILE		.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm			e4	30	260	1.6 mm
SI4060-B1B-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm			e3	40	260	4 mm
ADC32RF82IRMPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1						1.15 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N72	3	1 mm	10 mm			e4	30	260	10 mm
ADC32RF82IRMPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1						1.15 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12500 Mbps	S-PQCC-N72	3	1 mm	10 mm			e4	30	260	10 mm
ADRF5044BCCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1				-3.3 V		3.3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-B24	3	.96 mm	4 mm			e4	30	260	4 mm
TUSB214IRWBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1				.03 mA	3.3 V	CHIP CARRIER, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm			e4	30	260	1.6 mm
FIDO5100BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
FIDO5200BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
ESP32-S0WD	Espressif Systems (Shanghai)	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.35 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	5 mm						5 mm
ESP32-D2WD	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.35 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	5 mm						5 mm
L80-M39	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		SQUARE	UNSPECIFIED	NO	1						3.3 V	MICROELECTRONIC ASSEMBLY		2.54 mm	85 Cel	-40 Cel		DUAL		S-XDMA-N12		7.05 mm	16 mm				NOT SPECIFIED	NOT SPECIFIED	16 mm
EFR32BG12P432F1024GM48-C	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	.5 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-XQCC-N48		.9 mm	7 mm						7 mm
STA8090EXGAJTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	AEC-Q100			1.1 V	GRID ARRAY, THIN PROFILE, FINE PITCH		.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.