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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TPS65721RSNT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N32	2	.8 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
SN250QT	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified		e3	40	260	7 mm
SN250Q	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified		e3	40	260	7 mm
STA5620TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		.019 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
STMPE610QTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	1	1 mm	3 mm	Not Qualified		e3	30	260	3 mm
ADF7023BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	3	.8 mm	5 mm	Not Qualified		e4	30	260	5 mm
DS31256B	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B256		2.54 mm	27 mm	Not Qualified		e0			27 mm
ONET8501VRGPRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			90 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	11300 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
SN65LVCP40RGZTG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			.254 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	4000 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified		e4	NOT SPECIFIED	260	7 mm
TLK3138GDU	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	2	CMOS	2		1.2 V	1.2,1.5,2.5	GRID ARRAY	BGA484,22X22,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	3125 Mbps	S-PBGA-B484	4			Not Qualified		e0	20	220
CC1201RHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	1.25 Mbps	S-PQCC-N32	3	1 mm	5 mm	Not Qualified		e4	NOT SPECIFIED	260	5 mm
TRF3722IRGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	2	1 mm	7 mm			e4	30	260	7 mm
MGA-43024-BLKG	Broadcom	TELECOM CIRCUIT		NO LEAD	28		SQUARE	UNSPECIFIED	YES	1				5 V		MICROELECTRONIC ASSEMBLY			.5 mm				QUAD		S-XQMA-N28	3	.92 mm	5 mm					260	5 mm
MGA-43024-TR1G	Broadcom	TELECOM CIRCUIT		NO LEAD	28		SQUARE	UNSPECIFIED	YES	1				5 V		MICROELECTRONIC ASSEMBLY			.5 mm				QUAD		S-XQMA-N28	3	.92 mm	5 mm					260	5 mm
MGA-43040-BLKG	Broadcom	TELECOM CIRCUIT		BUTT	28	HVBCC	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				BOTTOM		S-XBCC-B28		.91 mm	5 mm						5 mm
MGA-43040-TR1G	Broadcom	TELECOM CIRCUIT		BUTT	28	HVBCC	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				BOTTOM		S-XBCC-B28		.91 mm	5 mm						5 mm
AMMP-6532-BLKG	Broadcom	TELECOM CIRCUIT		BUTT	8	BCC	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER						NICKEL GOLD	BOTTOM		S-XBCC-B8	3	2.25 mm	5.215 mm	Not Qualified		e4	20	260	5.215 mm
AMMP-6532-TR1G	Broadcom	TELECOM CIRCUIT		BUTT	8	BCC	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER						NICKEL GOLD	BOTTOM		S-XBCC-B8	3	2.25 mm	5.215 mm	Not Qualified		e4	20	260	5.215 mm
AMIS-49250-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	UNSPECIFIED	YES	1		1	.0008 mA	3 V	3,5	CHIP CARRIER	LCC44,.28SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	TIN	QUAD	.03125 Mbps	S-XQCC-N44	3	.9 mm	7 mm	Not Qualified		e3	30	260	7 mm
AMIS-49250-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	UNSPECIFIED	YES	1		1	.0008 mA	3 V	3,5	CHIP CARRIER	LCC44,.28SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.03125 Mbps	S-XQCC-N44	3	.9 mm	7 mm	Not Qualified		e3	30	260	7 mm
AD9993BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.4 mm	12 mm				30	260	12 mm
PN5110A0HN1/C2,157	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.1 mA	3 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4	30	260	5 mm
PN5120A0HN1/C1,157	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4		260	5 mm
AD9364BBCZREEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm			e1	30	260	10 mm
AD9364BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm			e1	30	260	10 mm
SST12LP17E-QU8E	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	3	.6 mm	2 mm			e3			2 mm
STA311B	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	90 Cel	-40 Cel		QUAD		S-XQCC-N56		1 mm	8 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm
XCC2564MODNCMOET	Texas Instruments	TELECOM CIRCUIT	OTHER	BUTT	33	BCC	SQUARE	UNSPECIFIED	YES	1				3.6 V		CHIP CARRIER				70 Cel	-20 Cel		BOTTOM		S-XBCC-B33		1.4 mm	7 mm						7 mm
SI4330-B1-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm	Not Qualified		e3	40	260	4 mm
CC2531F128RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified		e4	30	260	6 mm
CC2531F128RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified		e4	30	260	6 mm
TLK2711AIRCPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
TLK2711AIRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
TLK2711AJRZQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B80	3	1 mm	5 mm	Not Qualified		e1	30	260	5 mm
ONET8501PBRGTT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	100 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	11300 Mbps	S-PQCC-N16	2	1 mm	3 mm	Not Qualified		e4	NOT SPECIFIED	260	3 mm
SN761634RTWR	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	2	.8 mm	4 mm	Not Qualified		e4	30	260	4 mm
TDA7541W	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			8.5 V		FLATPACK				85 Cel	-40 Cel		QUAD		S-PQFP-G64				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
TDA7541	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			8.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	10 mm
ADF9010BCPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		.41 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified		e3		260	7 mm
ADF9010BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		.41 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified		e3		260	7 mm
TLK3134ZEL	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	1.2,1.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3750 Mbps	S-PBGA-B289	4	2.48 mm	19 mm	Not Qualified		e1	30	260	19 mm
STLC60845	STMicroelectronics	TELECOM CIRCUIT		BALL	292	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		GRID ARRAY							BOTTOM		S-PBGA-B292				Not Qualified
DS1852B-000	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	100 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B25	3	1.5 mm	5 mm	Not Qualified		e0			5 mm
DS2174QN	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-J44	3	4.57 mm	16.585 mm	Not Qualified		e0			16.585 mm
DS2174Q	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J44	3	4.57 mm	16.585 mm	Not Qualified		e0			16.585 mm
AD9874BST	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.0265 mA	3 V	3/3.3,3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm
MAX3953UGK	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.45SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N68	3	.9 mm	10 mm	Not Qualified		e0			10 mm
TSC2200IRHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified	SINGLE-ENDED	e4	30	260	5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.