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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SN65DSI86ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	5400 Mbps	S-PBGA-B64	3	1 mm	5 mm			e1	30	260	5 mm
PGA5807ARGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm			e4	30	260	9 mm
PGA5807ARGCT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm			e4	30	260	9 mm
TLK10022CTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	HBGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V		GRID ARRAY, HEAT SINK/SLUG			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10000 Mbps	S-PBGA-B144	4	3.25 mm	13.05 mm			e1	30	260	13.05 mm
TLK2711HFG/EM	Texas Instruments	TELECOM CIRCUIT		FLAT	68	GQFF	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1						2.5 V		FLATPACK, GUARD RING			.64 mm				QUAD		S-CQFP-F68		2.68 mm	13.97 mm				NOT SPECIFIED	NOT SPECIFIED	13.97 mm
BGS15AN16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	QUAD		S-PQCC-N16	1	.77 mm	2.3 mm			e3			2.3 mm
HTMS1201FUG/AM,005	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	SQUARE	UNSPECIFIED	YES	1		CMOS						UNCASED CHIP	WAFER	Other Telecom ICs		85 Cel	-40 Cel		UPPER		S-XUUC-N				Not Qualified
ADRF6820ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N40		.8 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
SKY13453-385LF	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	QCCN	SQUARE	UNSPECIFIED	YES	1						2.8 V		CHIP CARRIER				90 Cel	-40 Cel		QUAD		S-XQCC-N6	1	.5 mm	1 mm					260	1 mm
PHY2078QT-BR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	1	.8 mm	5 mm			e3	30	260	5 mm
CC2595RGTT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	3 mm			e4	30	260	3 mm
TLK2541PFPG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	3	1.2 mm	12 mm	Not Qualified		e4	30	260	12 mm
SN75FC1000PJD	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			.25 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD		S-PQFP-G64		1.2 mm	10 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	10 mm
CY7B923-JC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			85 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J28	3	4.57 mm	11.53 mm	Not Qualified		e0			11.53 mm
MAX3120CUA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
MAX3120EUA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
ADL5354ACPZ-R2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N36	1	1 mm	6 mm	Not Qualified		e3			6 mm
CC2430F64RTCRG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e4	30	260	7 mm
CC2430ZF128RTCG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e4	30	260	7 mm
CC2430ZF128RTCRG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e4	30	260	7 mm
CMX992Q3	Cml Microcircuits	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		1 mm	7 mm	Not Qualified					7 mm
ADN2917ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm			e3		260	4 mm
ADN2917ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm			e3			4 mm
P5DF081HN/T1AD2060	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32						e4
AD9816JSRL	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				5 V		FLATPACK			.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQFP-G44		2.45 mm	10 mm	Not Qualified		e0			10 mm
MAX3265CUB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR			.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0	20	240	3 mm
MAX3268CUB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR			.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0	20	240	3 mm
MAX3269CUB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR			.078 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn85Pb15)	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0	20	240	3 mm
STA8088GATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N56	3	.9 mm	7 mm			e3	40	260	7 mm
STA8088GA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N56	3	.9 mm	7 mm			e3	40	260	7 mm
PE4312MLBA-Z	Psemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N20	1	.9 mm	4 mm			e4	30	260	4 mm
TLK2500IRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1					.135 mA	2.5 V	2.5,3.3	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64		1 mm	10 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	10 mm
LM15851NKER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	VQCCN	SQUARE	UNSPECIFIED	YES	1						1.2 V		CHIP CARRIER, VERY THIN PROFILE			.45 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	4000 Mbps	S-XQCC-N68	3	1 mm	10 mm		1.995 V	e3	30	260	10 mm
TRF37A73IDSGT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N8	1	.8 mm	2 mm			e4	30	260	2 mm
AD8314ARM-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0		240	3 mm
AD8314ARM	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0		240	3 mm
CC8520RHAT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	5 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified		e4	NOT SPECIFIED	260	6 mm
GC5328IZER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	484	HBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B484	4	2.48 mm	23 mm	Not Qualified		e1	30	260	23 mm
TLV320VD30PN	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V	2.5/3.3,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	52 Mbps	S-PQFP-G80		1.6 mm	12 mm	Not Qualified					12 mm
TLK2501IRCPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1		2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2500 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
AD8285WBCPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	AEC-Q100			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N72	3	.9 mm	10 mm			e3	30	260	10 mm
AD8285WBCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	AEC-Q100			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N72	3	.9 mm	10 mm			e3	30	260	10 mm
ADN2913ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm			e3		260	4 mm
ADN2913ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm			e3		260	4 mm
ADF7024BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	3	.8 mm	5 mm			e4	30	260	5 mm
MGA-43003-BLKG	Broadcom	TELECOM CIRCUIT		NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-XQCC-N28		1 mm	5 mm						5 mm
MGA-43003-TR1G	Broadcom	TELECOM CIRCUIT		NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-XQCC-N28		1 mm	5 mm						5 mm
CYRF7936-40LFXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						2.4 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	1 mm	6 mm	Not Qualified		e3	20	260	6 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.