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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
FIDO5200CBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.24 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
EFR32BG13P532F512GM32-D	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N32	3	.9 mm	5 mm				40	260	5 mm
EFR32BG13P632F512GM32-D	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N32	3	.9 mm	5 mm				40	260	5 mm
FIDO5110BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.24 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
FIDO5110CBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.24 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
FIDO5210BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.24 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
FIDO5210CBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.24 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
AD9082BBPZ-4D2AC	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, FINE PITCH	BGA324,18X18,32		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B324	3	1.72 mm	15 mm		IT CAN ALSO OPERATE WITH 1.8 AND 2 V		30	260	15 mm
AD9082BBPZRL-4D2AC	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, FINE PITCH	BGA324,18X18,32		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B324	3	1.72 mm	15 mm		IT CAN ALSO OPERATE WITH 1.8 AND 2 V		30	260	15 mm
PN7150B0HN/C11004E	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N40		1 mm	6 mm						6 mm
PN7150B0HN/C11004Y	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N40		1 mm	6 mm						6 mm
BGS13SL9E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	9	BCC	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B9		.32 mm	1.15 mm						1.15 mm
AD6674BCPZ-1000	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	.8 mm	9 mm			e3		260	9 mm
AD6674BCPZ-500	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	.8 mm	9 mm			e3		260	9 mm
AD6674BCPZ-750	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	.8 mm	9 mm			e3		260	9 mm
AD6674BCPZRL7-1000	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	.8 mm	9 mm			e3		260	9 mm
AD6674BCPZRL7-500	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	.8 mm	9 mm			e3		260	9 mm
AD6674BCPZRL7-750	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	.8 mm	9 mm			e3		260	9 mm
NCV7428MW3R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
STA8088G	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm	7 mm						7 mm
LNBH26LSPQR	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD	S-XQCC-N24	1	1 mm	4 mm						4 mm
BGX7221HN/1,518	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD	S-PQCC-N36	3	1 mm	6 mm					260	6 mm
OL2300NHN/F,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			19 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	1	1 mm	3 mm	Not Qualified		e4	30	260	3 mm
OL2311AHN/C0B,515	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			21.5 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel		QUAD	S-PQCC-N32	2A	.85 mm	5 mm	Not Qualified				260	5 mm
OL2381AHN/C0B,515	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			.0012 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel		QUAD	S-PQCC-N32	2A	.85 mm	5 mm	Not Qualified				260	5 mm
SA616BS,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N20	1	1 mm	4 mm				30	260	4 mm
SA636BS,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE	LCC20,.16SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N20	1	1 mm	4 mm				30	260	4 mm
SL3S1001FTT,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	80 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			e4	30	260	3 mm
SL3S1202FTT,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			30	260	3 mm
TFF1007HN/N1,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24	1	1 mm	4 mm					260	4 mm
TFF1007HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24	1	1 mm	4 mm					260	4 mm
TFF11086HN/N1,111	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24	1	1 mm	4 mm					260	4 mm
TFF11086HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24	1	1 mm	4 mm					260	4 mm
TFF11092HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24	1	1 mm	4 mm			e4	30	260	4 mm
TFF11092HN/N1	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24	1	1 mm	4 mm					260	4 mm
TFF11101HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24	1	1 mm	4 mm					260	4 mm
TFF11101HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24	1	1 mm	4 mm					260	4 mm
TFF11115HN/N1,111	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24		1 mm	4 mm						4 mm
TFF11139HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24	1	1 mm	4 mm					260	4 mm
TFF11139HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24	1	1 mm	4 mm					260	4 mm
TFF11145HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24	1	1 mm	4 mm					260	4 mm
BGM781N11E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	VSON	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE				85 Cel	-40 Cel		DUAL	S-PDSO-N11		.77 mm	2.5 mm				NOT SPECIFIED	NOT SPECIFIED	2.5 mm
BGS16MN14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	Tin (Sn)	QUAD	S-PQCC-N14	1	.77 mm	2 mm			e3	NOT SPECIFIED	NOT SPECIFIED	2 mm
NRF51822-CFAC-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	62	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	75 Cel	-25 Cel		BOTTOM	S-PBGA-B62		.55 mm	3.83 mm				NOT SPECIFIED	NOT SPECIFIED	3.83 mm
NRF51822-QFAA-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	75 Cel	-25 Cel		QUAD	S-XQCC-N48		.95 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
NRF51822-QFAA-T	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	75 Cel	-25 Cel		QUAD	S-XQCC-N48		.95 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
NRF51822-QFAC-R7	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	75 Cel	-25 Cel	TIN	QUAD	S-XQCC-N48		.95 mm	6 mm			e3			6 mm
NRF51822-QFAC-T	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	75 Cel	-25 Cel	TIN	QUAD	S-XQCC-N48		.95 mm	6 mm			e3			6 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.