TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
OPA2380AIDGKRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2			.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm		3 mm	Not Qualified	e4	30	260	3 mm
ADL5390ACPZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N24	3	1 mm		4 mm	Not Qualified	e3	30	260	4 mm
ADL5390ACPZ-WP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N24	3	1 mm		4 mm	Not Qualified	e3	30	260	4 mm
TLK2501IRCPG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		1		2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	2500 Mbps	S-PQFP-G64	3	1 mm		10 mm	Not Qualified	e4	30	260	10 mm
ADF7012BRU-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G24		1.2 mm		4.4 mm	Not Qualified	e0			7.8 mm
MAX3964AETP	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.045 mA	3.3 V	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD		S-XQCC-N20	1	.8 mm		4 mm	Not Qualified	e0			4 mm
AD73311LARSZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified	e3	40	260	7.2 mm
AD73311LARUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	1.1 mm		4.4 mm	Not Qualified	e3		260	6.5 mm
AD9860BSTZ	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel		MATTE TIN	QUAD		R-PQFP-G128	3	1.6 mm		14 mm	Not Qualified	e3	30	260	20 mm
AD9860BSTZRL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel		MATTE TIN	QUAD		R-PQFP-G128	3	1.6 mm		14 mm	Not Qualified	e3		260	20 mm
AD9861BCPZ-50	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e3		260	9 mm
AD9861BCPZ-80	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e3		260	9 mm
AD9861BCPZRL-80	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e3		260	9 mm
AD9862BSTZ	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel		MATTE TIN	QUAD		R-PQFP-G128	3	1.6 mm		14 mm	Not Qualified	e3	30	260	20 mm
AD9878BSTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Modems	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQFP-G100	3	1.6 mm		14 mm	Not Qualified	e3		260	14 mm
ADM1041ARQZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		R-PDSO-G24	1	1.7526 mm		3.9116 mm	Not Qualified	e3	30	260	8.6614 mm
ADN2891ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.049 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm		3 mm	Not Qualified	e3	30	260	3 mm
ADN2891ACPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.049 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm		3 mm	Not Qualified	e3	30	260	3 mm
TLK2701IRCPRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm		10 mm	Not Qualified	e4	30	260	10 mm
ADN2892ACPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm		3 mm	Not Qualified	e3		260	3 mm
AD9863BCPZ-50	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e3		260	9 mm
AD73311LARSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified	e3		260	7.2 mm
AD73311LARUZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	1.1 mm		4.4 mm	Not Qualified	e3		260	6.5 mm
AD73311LARUZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	1.1 mm		4.4 mm	Not Qualified	e3		260	6.5 mm
AD73360ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified	e3	30	260	17.9 mm
AD73360ARZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified	e3	30	260	17.9 mm
AD73360LARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified	e3	30	260	17.9 mm
CYRF6936-40LTXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N40	3	1 mm		6 mm	Not Qualified	e4	20	260	6 mm
U2741B-NFBG3Y	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.0125 mA	3 V	2.2/5.5	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G16	1	1.7 mm			Not Qualified	e3		260	4.9 mm
RI-RFM-003B-00	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				50 Cel	0 Cel			UNSPECIFIED		R-XXMA-X					Not Qualified
GC4016-PBZ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM		S-PBGA-B160	3	1.75 mm		15 mm	Not Qualified	e1	30	260	15 mm
CC2500RTKG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20	3	.9 mm		4 mm	Not Qualified	e4	30	260	4 mm
CC2500RTKRG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20	3	.9 mm		4 mm	Not Qualified	e4	30	260	4 mm
CC2530F128RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm		6 mm	Not Qualified	e4	30	260	6 mm
CC2530F32RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm		6 mm	Not Qualified	e4	30	260	6 mm
CC2530F32RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm		6 mm	Not Qualified	e4	30	260	6 mm
CC2530F64RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm		6 mm	Not Qualified	e4	30	260	6 mm
CC2530F64RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm		6 mm	Not Qualified	e4	30	260	6 mm
TLK2521IPAP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V	2.5	FLATPACK, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1.2 mm		10 mm	Not Qualified	e4	30	260	10 mm
AD608ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G16	1	1.75 mm		3.9 mm	Not Qualified	e3	30	260	9.9 mm
AD73311ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	2.65 mm		7.5 mm	Not Qualified	e3	30	260	12.8 mm
AD974ARSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2 mm		5.3 mm	Not Qualified	e3	30	260	10.2 mm
AD974ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified	e3	30	260	17.9 mm
AD974BRSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2 mm		5.3 mm	Not Qualified	e3		260	10.2 mm
AD9856ASTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQFP-G48	3	1.6 mm		7 mm	Not Qualified	e3	30	260	7 mm
AD6623ASZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		R-PQFP-G128	3	3.4 mm		14 mm	Not Qualified	e3		260	20 mm
AD73311LARSZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified	e3		260	7.2 mm
AD73322LARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.031 mA	3 V	3	SMALL OUTLINE	SOP28,.4	Codecs	1.27 mm	85 Cel	-40 Cel	.75 dB	MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm	16-BIT	7.5 mm	Not Qualified	e3	30	260	17.9 mm	YES

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.