TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

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Part	Manufacturer	Telecom IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Peak Reflow Temperature (C)	Length
BC57G687C-ANN-E4	Qualcomm	TELECOM CIRCUIT	BALL	105	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA105,11X11,32	.8 mm	85 Cel	-40 Cel		BOTTOM	12 Mbps	S-PBGA-B105		1.6 mm	10 mm				10 mm
AFE7903IALK	Texas Instruments	TELECOM CIRCUIT	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1			.925 V	GRID ARRAY	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz	e0	220	17 mm
AFE8092HIABJ	Texas Instruments	TELECOM CIRCUIT	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500	e1	260	17 mm
BB-485LDRC9	Advantech	TELECOM CIRCUIT	UNSPECIFIED		XMA	UNSPECIFIED	PLASTIC/EPOXY	NO	1				MICROELECTRONIC ASSEMBLY			80 Cel	-40 Cel		UNSPECIFIED	.1152 Mbps	X-PXMA-X		78.8 mm	25.1 mm				95.2 mm
ESP32-WROVER-IB	Espressif Systems (Shanghai)	TELECOM CIRCUIT	NO LEAD	38	DMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		DUAL	150 Mbps	R-XDMA-N38		3.45 mm	18 mm				31.4 mm
BG95M5LA-64-SGNS	Quectel Wireless Solutions	TELECOM CIRCUIT	NO LEAD	102	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY	LGA102(UNSPEC)		75 Cel	-35 Cel		BOTTOM	1.119 Mbps	R-XBGA-N102		2.2 mm	19.9 mm				23.6 mm
MDBT50Q-P1MV2	Raytac	TELECOM CIRCUIT	NO LEAD	61	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N61		2 mm	10.5 mm				15.5 mm
AFE7952IABJ	Texas Instruments	TELECOM CIRCUIT	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm			TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) : 0; RF frequency(Max)(MHz) : 12000	e1	260	17 mm
WT11U-A-AI4	Silicon Labs	TELECOM CIRCUIT	NO LEAD	28	DMA	RECTANGULAR	UNSPECIFIED	NO	1	CMOS		3.3 V	MICROELECTRONIC ASSEMBLY		1.5 mm	85 Cel	-40 Cel		DUAL	3 Mbps	R-XDMA-N28		2.7 mm	14.5 mm				35.75 mm
AFE8000IABJ	Texas Instruments	TELECOM CIRCUIT	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Max)(MHz) : 7000	e1	260	17 mm
XB9X-DMUS-021	Digi International	TELECOM CIRCUIT	NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
XB9X-DMUS-031	Digi International	TELECOM CIRCUIT	NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
XBP9X-DMRS-001	Digi International	TELECOM CIRCUIT	NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
XB9X-DMRS-001	Digi International	TELECOM CIRCUIT	NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
XB9X-DMUS-011	Digi International	TELECOM CIRCUIT	NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
XBP9X-DMRS-021	Digi International	TELECOM CIRCUIT	NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
XB9X-DMRS-021	Digi International	TELECOM CIRCUIT	NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
XBP9X-DMUS-011	Digi International	TELECOM CIRCUIT	NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
FC20-Q73	Quectel Wireless Solutions	TELECOM CIRCUIT	NO LEAD	52	QCCN	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER	LCC52(UNSPEC)		85 Cel	-40 Cel		QUAD	433 Mbps	R-XQCC-N52		2.1 mm	13 mm	SEATED HEIGHT NOM CONSIDERED			16.6 mm
AFE7901IALK	Texas Instruments	TELECOM CIRCUIT	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			.925 V	GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm		e0	220	17 mm
AFE7901IABJ	Texas Instruments	TELECOM CIRCUIT	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			.925 V	GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm		e1	260	17 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.