TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

AMW037

Silicon Labs

TELECOM CIRCUIT

NO LEAD

44

QMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XQMA-N44

2.72 mm

16.51 mm

24.77 mm

TUSB214QRWBTQ1

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

AEC-Q100

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

TUSB212QRWBRQ1

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

AEC-Q100

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

SI4060-B1B-FM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

.9 mm

4 mm

e3

40

260

4 mm

ADC32RF82IRMPR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

72

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.15 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N72

3

1 mm

10 mm

e4

30

260

10 mm

ADC32RF82IRMPT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

72

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.15 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

12500 Mbps

S-PQCC-N72

3

1 mm

10 mm

e4

30

260

10 mm

ADRF5044BCCZN

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

24

HLGA

SQUARE

UNSPECIFIED

YES

1

-3.3 V

3.3 V

GRID ARRAY, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-XBGA-B24

3

.96 mm

4 mm

e4

30

260

4 mm

TUSB214IRWBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

ATSAMB11-XR2100A

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

49

HLGA

RECTANGULAR

UNSPECIFIED

YES

1

TS 16949

3.6 V

GRID ARRAY, HEAT SINK/SLUG

85 Cel

-40 Cel

BOTTOM

R-XBGA-N49

1.4 mm

4.5 mm

5.5 mm

RN4870U-V/RM118

Microchip Technology

TELECOM CIRCUIT

NO LEAD

30

XMA

RECTANGULAR

UNSPECIFIED

YES

1

TS 16949

3 V

MICROELECTRONIC ASSEMBLY

70 Cel

-20 Cel

UNSPECIFIED

.01 Mbps

R-XXMA-N30

1.6 mm

12 mm

15 mm

RN4871-V/RM118

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

16

XMA

RECTANGULAR

UNSPECIFIED

YES

1

TS 16949

3 V

MICROELECTRONIC ASSEMBLY

MODULE,16LEAD(UNSPEC)

1.2 mm

70 Cel

-20 Cel

UNSPECIFIED

.01 Mbps

R-XXMA-N16

2.16 mm

9 mm

11.5 mm

FIDO5100BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B144

1.24 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

FIDO5200BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B144

1.24 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

MAX-8Q

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

18

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N18

NOT SPECIFIED

NOT SPECIFIED

ESP32-S0WD

Espressif Systems (Shanghai)

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.35 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N48

.9 mm

5 mm

5 mm

ESP32-D2WD

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.35 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N48

.9 mm

5 mm

5 mm

CC2564BYFVR-XI

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

4 Mbps

R-XBGA-B54

1

.575 mm

2.93 mm

e1

30

260

3.26 mm

L80-M39

Quectel Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

SQUARE

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

DUAL

S-XDMA-N12

7.05 mm

16 mm

NOT SPECIFIED

NOT SPECIFIED

16 mm

EFR32BG12P432F1024GM48-C

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

2 Mbps

S-XQCC-N48

.9 mm

7 mm

7 mm

CC2560BYFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

.575 mm

2.925 mm

e1

30

260

3.265 mm

CC2560BYFVT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

.575 mm

2.925 mm

e1

30

260

3.265 mm

STA8090EXGAJTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.2 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

STA8090EXGAJ

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.2 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

STA8090EXGATR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.2 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

STA8090EXGA

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B169

3

1.2 mm

9 mm

e3

260

9 mm

TLE8457BSJXUMA1

Infineon Technologies

TELECOM CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

AEC-Q100

8 V

SMALL OUTLINE

1.27 mm

TIN

DUAL

R-PDSO-G8

3

1.75 mm

4 mm

e3

5 mm

BGS13PN10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

10

BCC

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

2.85 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

TIN

BOTTOM

R-XBCC-B10

1

.4 mm

1.1 mm

e3

1.5 mm

BGS18GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

QUAD

S-XQMA-B14

1

.65 mm

2 mm

2 mm

BGM1033N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

.77 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2.3 mm

BGM15HA12E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.8 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

GOLD NICKEL

BOTTOM

R-PBCC-N12

1

.65 mm

1.1 mm

e4

1.9 mm

BGM15MA12E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.8 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBCC-N12

1

.65 mm

1.1 mm

1.9 mm

BGS16GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBCC-N14

1

.65 mm

2 mm

2 mm

BGT24AR2E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

TIN

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

e3

5.5 mm

BGT24AT2E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

TIN

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

e3

5.5 mm

BGT24ATR12E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

TIN

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

e3

5.5 mm

ADRF5045BCCZN-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

24

HLGA

SQUARE

UNSPECIFIED

YES

1

-3.3 V

3.3 V

GRID ARRAY, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-XBGA-B24

3

.96 mm

4 mm

e4

30

260

4 mm

ADRF5045BCCZN

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

24

HLGA

SQUARE

UNSPECIFIED

YES

1

-3.3 V

3.3 V

GRID ARRAY, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-XBGA-B24

3

.96 mm

4 mm

e4

30

260

4 mm

RN4870-I/RM128

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

MODULE,33LEAD(UNSPEC)

1.1 mm

85 Cel

-40 Cel

UNSPECIFIED

.01 Mbps

R-XXMA-N33

2.46 mm

12 mm

22 mm

ADL5335ACPZN-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N16

3

.8 mm

4 mm

e4

30

260

4 mm

ADL5335ACPZN

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N16

3

.8 mm

4 mm

e4

30

260

4 mm

ADRF5044BCCZN-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

24

HLGA

SQUARE

UNSPECIFIED

YES

1

-3.3 V

3.3 V

GRID ARRAY, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-XBGA-B24

3

.96 mm

4 mm

e4

30

260

4 mm

NL3HS644FCTAG

Onsemi

TELECOM CIRCUIT

BALL

36

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

BOTTOM

S-PBGA-B36

.54 mm

2.34 mm

NOT SPECIFIED

NOT SPECIFIED

2.34 mm

LMX8410RGZR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

S-PQCC-N48

3

1 mm

7 mm

e4

30

260

7 mm

LMX8410RGZT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

S-PQCC-N48

3

1 mm

7 mm

e4

30

260

7 mm

PI3EQX1001XUAEX

Diodes Incorporated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

18

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

70 Cel

0 Cel

QUAD

S-XQCC-N18

.4 mm

2 mm

NOT SPECIFIED

NOT SPECIFIED

2 mm

AX5031-1-TA05

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-XQCC-N20

1

1 mm

4 mm

e3

260

4 mm

HMC773ALC3BTR-R5

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N12

.9 mm

2.9 mm

NOT SPECIFIED

NOT SPECIFIED

2.9 mm

LEA-6H-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

RECTANGULAR

UNSPECIFIED

NO

1

AEC-Q100

3 V

MICROELECTRONIC ASSEMBLY

1.1 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N28

2.7 mm

17 mm

NOT SPECIFIED

NOT SPECIFIED

22.4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.