TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PM5990B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY						BOTTOM		S-PBGA-B1932
PM5991B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY						BOTTOM		S-PBGA-B1932
A2235-H	Lantronix	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-X
BG96MA-128-SGN	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	102		RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N102		2.3 mm	22.5 mm					26.5 mm
ST25RU3992-BQFT	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	64		SQUARE	UNSPECIFIED	YES	1					LCC64(UNSPEC)					QUAD		S-XQCC-N64				Operates from 4.1V to 5.5V Supply
AX50311-1-WD1	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1	CMOS		3 V	UNCASED CHIP	DIE OR CHIP		85 Cel	-40 Cel		UPPER	2 Mbps	X-XUUC-N				DATA RATE 350 KBPS FOR FSK,MODULATION		NOT SPECIFIED	NOT SPECIFIED
AX5042-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		2.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.25 Mbps	S-XQCC-N28		1 mm	5 mm		e4			5 mm
ATSAMW25H18-MR210PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm					33.864 mm
MRF24WG0MA-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm					31 mm
MRF24WG0MB-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm					31 mm
MRF24WG0MBR-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm					31 mm
MRF24WG0MAT-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL		36		RECTANGULAR	UNSPECIFIED		1		TS 16949	3.3 V				85 Cel	-40 Cel						2.7 mm	21 mm					31 mm
MWCT1001AVLHR	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	3.3 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD		S-PQFP-G64	3	1.6 mm	10 mm		e3	40	260	10 mm
ATSAMW25H18-MR210PB1944	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm					33.864 mm
ATSAMW25H18-MR510PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm					33.864 mm
VSC8491YJU-13	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V	GRID ARRAY, LOW PROFILE		1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm					15 mm
ADCA3990AMLZ	Analog Devices	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	9		RECTANGULAR	UNSPECIFIED	NO	1				FLANGE MOUNT			100 Cel	-30 Cel		SINGLE		R-XSFM-T9						NOT SPECIFIED	NOT SPECIFIED
ADTR1107ACCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	TFLGA	SQUARE	UNSPECIFIED	YES	1			5 V	GRID ARRAY, THIN PROFILE, FINE PITCH	LCC24,.2SQ,25	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-N24	3	1.13 mm	5 mm		e4		260	5 mm
ADL5910ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm	3 mm		e4	30	260	3 mm
ADF5901ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.8 mm	5 mm			30	260	5 mm
HMC8100LP6JETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N40	3	.95 mm	6 mm		e4	30	260	6 mm
RN4871-I/RM128	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	NO	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)	1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm					11.5 mm
AX-SFAZ-1-01-TB05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.0006 Mbps	R-PQCC-N40		1 mm	5 mm		e4			7 mm
ATA5577M3330C-DDB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	2	DIE	RECTANGULAR	UNSPECIFIED		1				UNCASED CHIP	DIE OR CHIP	.524 mm	85 Cel	-40 Cel		UPPER		R-XUUC-N2		.162 mm	1 mm					1.35 mm
STA8089GR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.1 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.9 mm	7 mm					7 mm
BGM113A256V21	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		.8 mm	85 Cel	-40 Cel		UNSPECIFIED				2 mm	9.15 mm					15.73 mm
NEO-M8U-05B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	DMA	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100; TS 16949	3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm					16 mm
XM1100_1103874	Sierra Wireless	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	QMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N20		2.3 mm	9 mm					9.5 mm
MMDS25254HT1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.23,20	.5 mm	150 Cel		TIN	QUAD		S-PQCC-N32	3	.9 mm	6 mm		e3	40	260	6 mm
MMDS09254HT1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.23,20	.5 mm	150 Cel		TIN	QUAD		S-PQCC-N32	3	.9 mm	6 mm		e3	40	260	6 mm
PN5180A0ET/C4QL	NXP Semiconductors	TELECOM CIRCUIT																	TIN SILVER COPPER				1				e1	30	260
PN5180A0HN/C4E	NXP Semiconductors	TELECOM CIRCUIT																	NICKEL PALLADIUM GOLD				3				e4	30	260
WT12-A-AI3	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		3.3 V	MICROELECTRONIC ASSEMBLY		1.5 mm	85 Cel	-40 Cel		UNSPECIFIED	3 Mbps	R-XXMA-N31		2.6 mm	14 mm					25 mm
ADC32RF83IRRHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm		e4	30	260	10 mm
ADC32RF80IRRHT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm		e4	30	260	10 mm
ADC32RF83IRRHT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm		e4	30	260	10 mm
ADC32RF80IRRHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm		e4	30	260	10 mm
WLAN8101CMP	NXP Semiconductors	TELECOM CIRCUIT																	NICKEL GOLD				3				e4	30	260
RS9116N-SB00-QMS-B00	Silicon Labs	TELECOM CIRCUIT																	MATTE TIN				3				e3	40	260
MICRF009YM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V	SMALL OUTLINE	SOP16,.25	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	.002 Mbps	R-PDSO-G16	1	1.895 mm	3.9 mm	Operates from 4.75V to 5.5V	e3	30	260	9.9 mm
BLE113-A-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	XMA	RECTANGULAR	UNSPECIFIED	YES	1				MICROELECTRONIC ASSEMBLY		.8 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N36	3	2.09 mm	9.15 mm	Operates from 2V to 3.6V supply		40	260	15.725 mm
WFI32E01PE-I	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	54	QMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,54LEAD,.7	1.27 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N54		2.6 mm	20.5 mm					24.5 mm
WFI32E01PC-I	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	54	QMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,54LEAD,.7	1.27 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N54		2.6 mm	20.5 mm					24.5 mm
ESP8285N08	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-40 Cel	TIN	QUAD	72.2 Mbps	S-XQCC-N32	3	.9 mm	5 mm		e3	30	250	5 mm
SIM7070G	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1				MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		QUAD	1.119 Mbps	S-XQMA-N68
SIM7000E	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1			3.8 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		QUAD	.375 Mbps	S-XQMA-N68
SIM7000G	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1			3.8 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		QUAD	.375 Mbps	S-XQMA-N68
EC21AFA-512-STD	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		QMA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		QUAD		R-XQMA-N		2.4 mm	29 mm	SEATED HEIGHT NOM				32 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.