TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADC32RF83IRMPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm			e4	30	260	10 mm
MAX-8Q-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100	3 V	MICROELECTRONIC ASSEMBLY		1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18	4	2.7 mm	9.7 mm					245	10.1 mm
ENW89837A3KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	58		RECTANGULAR	UNSPECIFIED	YES	1				1.8 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N58		2 mm	8.7 mm				10	250	15.6 mm
LXMSAPHA08-136	Murata Manufacturing	TELECOM CIRCUIT	OTHER	NO LEAD			SQUARE	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY			70 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N		.8 mm	8.3 mm				NOT SPECIFIED	NOT SPECIFIED	8.3 mm
ATA8520E-GHPW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	.0006 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
ATBTLC1000-MR110CA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.6 V	MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)	.9 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N24		2.165 mm	12.7 mm						20.157 mm
BM70BLES1FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm			e4			22 mm
BM71BLE01FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V	MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)	1.2 mm	70 Cel	-20 Cel	Nickel/Gold (Ni/Au)	QUAD	.0086 Mbps	R-XQMA-N17		1.66 mm	6 mm			e4			8 mm
BM71BLES1FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V	MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)	1.2 mm	70 Cel	-20 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N16		2.16 mm	9 mm			e4			11.5 mm
SN65DSI85TPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1.8 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 Mbps	S-PQFP-G64	3	1.2 mm	10 mm			e4	30	260	10 mm
AD6684BCPZ-500	Analog Devices	TELECOM CIRCUIT		NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.975 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			MATTE TIN	QUAD		S-XQCC-N72	3	1 mm	10 mm			e3	30	260	10 mm
AD6684BCPZRL7-500	Analog Devices	TELECOM CIRCUIT		NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.975 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			MATTE TIN	QUAD		S-XQCC-N72	3	1 mm	10 mm			e3	30	260	10 mm
AD9363ABCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm				30	260	10 mm
AD9363ABCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm				30	260	10 mm
ADS58J64IRMPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N72	3	.9 mm	10 mm		2 V	e4	30	260	10 mm
ADS58J64IRMPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N72	3	.9 mm	10 mm		2 V	e4	30	260	10 mm
ATA8210-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
ATA8215-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
MMG30271BT1	NXP Semiconductors	TELECOM CIRCUIT		FLAT	3	LSOF	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V	SMALL OUTLINE, LOW PROFILE		1.5 mm				SINGLE		R-PSSO-F3	1	1.6 mm	2.5 mm				40	260	4.5 mm
MMG30301BT1	NXP Semiconductors	TELECOM CIRCUIT		FLAT	3	LSOF	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V	SMALL OUTLINE, LOW PROFILE		1.5 mm				SINGLE		R-PSSO-F3	1	1.6 mm	2.5 mm				40	260	4.5 mm
SPWF04SA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V	MICROELECTRONIC ASSEMBLY		1.524 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N30		2.3 mm	15.24 mm				NOT SPECIFIED	NOT SPECIFIED	26.924 mm
SPWF04SC	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V	MICROELECTRONIC ASSEMBLY		1.524 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N30		2.3 mm	15.24 mm				NOT SPECIFIED	NOT SPECIFIED	26.924 mm
PI3USB30532ZLE	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N40		.8 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
WYSBHVGXG	Taiyo Yuden	TELECOM CIRCUIT	OTHER	NO LEAD	70		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N70		1.9 mm	8.9 mm				NOT SPECIFIED	NOT SPECIFIED	12.6 mm
BCM20733A3KML1G	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	70 Cel	0 Cel		QUAD		S-XQCC-N56		1 mm	7 mm						7 mm
BCM43570KFFBG	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	BALL	242	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA242,23X23,16	.4 mm	60 Cel	0 Cel		BOTTOM	867 Mbps	S-PBGA-B242		1.05 mm	10 mm	Also has 1.2 V core supply					10 mm
EFR32BG1B232F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B43		.54 mm	3.143 mm						3.295 mm
EFR32BG1P332F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B43	1	.54 mm	3.143 mm			e1	40	260	3.295 mm
EFR32BG1V132F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B43		.54 mm	3.143 mm						3.295 mm
HMC8108LC5TR-R5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	1.12 mm	4.9 mm				30	260	4.9 mm
HMC8108LC5TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	1.12 mm	4.9 mm				30	260	4.9 mm
HMC8108LC5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	1.12 mm	4.9 mm				30	260	4.9 mm
PI3PCIE3242ZLEX	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N30		.8 mm	2.5 mm				30	260	4.5 mm
EFR32BG1B132F256GM32-C0R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N32	2	.9 mm	5 mm			e3	NOT SPECIFIED	260	5 mm
NEO-M8Q-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100; TS 16949	3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm						16 mm
BGM111E256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BUTT	31		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B31		2.15 mm	12.9 mm						15 mm
ADRF6821ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N56	3	.8 mm	8 mm			e4	30	260	8 mm
ADRF6821ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N56	3	.8 mm	8 mm			e4	30	260	8 mm
BM71BLE01FC2-0B02AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V	MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)	1.2 mm	85 Cel	-40 Cel		QUAD	.0086 Mbps	R-XQMA-N17		1.66 mm	6 mm				30	260	8 mm
HPA01211RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	2			1.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm			e4	30	260	5 mm
TC35678FSG-002	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N40		.9 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
SL869GNS117T001	Telit Communications Plc	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V	SMALL OUTLINE			85 Cel	-40 Cel		DUAL		R-PDSO-N24		2.4 mm	12.2 mm				NOT SPECIFIED	NOT SPECIFIED	16 mm
MGM111A256V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N31		2.1 mm	12.9 mm						15 mm
AD9172BBPZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V	GRID ARRAY, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.71 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
AD9172BBPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V	GRID ARRAY, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.71 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
HPA00399RHDR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N28	3	1 mm	5 mm			e4	30	260	5 mm
BGM111A256V21	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES					3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2.2 mm	12.9 mm						15 mm
HPA02243RGZR	Texas Instruments	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.