TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Screening Level	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MGM12P22F1024GA-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
MGM12P32F1024GA-V4R	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
MGM12P32F1024GA-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
MGM12P32F1024GE-V4R	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
MGM12P32F1024GE-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
MWCT1013VLHSTR	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	.5 mm	105 Cel	-40 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm					10 mm
MWCT1013VLHST	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	.5 mm	105 Cel	-40 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm					10 mm
MWCT1R24ZVHT	NXP Semiconductors	TELECOM CIRCUIT																NICKEL GOLD				3				e4	40	260
TEF6657HN/V102Y	NXP Semiconductors	TELECOM CIRCUIT																NICKEL PALLADIUM GOLD				3				e4	30	260
TEF6659HN/V102K	NXP Semiconductors	TELECOM CIRCUIT																NICKEL PALLADIUM GOLD				3				e4	30	260
TEF6659HN/V102Y	NXP Semiconductors	TELECOM CIRCUIT																NICKEL PALLADIUM GOLD				3				e4	30	260
MGM210P022JIA2	Silicon Labs	TELECOM CIRCUIT
EYSKDNZWB	Taiyo Yuden	TELECOM CIRCUIT																									NOT SPECIFIED	NOT SPECIFIED
PN5120A0ET/C2,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100	3 V	GRID ARRAY, THIN PROFILE, FINE PITCH		.65 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64		1.15 mm	5.5 mm					5.5 mm
PT5010A0HN/C1,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1		3 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
TEF6657HN/V101,518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100	3.3 V	CHIP CARRIER			85 Cel	-40 Cel		QUAD		S-PQCC-N32
AFE7700IABJ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			GRID ARRAY, FINE PITCH		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
ADRV9026BBCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	4		1 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	.8 mm	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B289	3	1.46 mm	14 mm	ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE	e1	30	260	14 mm
ADRV9026BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	4		1 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	.8 mm	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B289	3	1.46 mm	14 mm	ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE	e1	30	260	14 mm
ATSAMW25H18-MR210PB1952	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm					33.864 mm
ATSAMW25H18-MR210PB1954	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm					33.864 mm
ATSAMW25H18-MR210PB1961	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm					33.864 mm
BM70BLE01FC2-0B04AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3 V	MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)	1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-N30		.66 mm	12 mm					15 mm
MRF24J40ME-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED	NO	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY		2.54 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N12		3.48 mm	22.86 mm					33.02 mm
MRF24J40MET-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED	NO	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY		2.54 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N12		3.48 mm	22.86 mm					33.02 mm
MRF24WN0MA-I/RM100	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N37		2.286 mm	17.78 mm					26.67 mm
RN4677-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED	.4 Mbps	R-XXMA-N33		2.46 mm	12 mm		e4			22 mm
RN4677-V/RM112	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED	.4 Mbps	R-XXMA-N33		2.46 mm	12 mm		e4			22 mm
RN4678-V/RM111	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	1.9 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
RN42-I/RM630	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)	1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm		e4			25.8 mm
RN42APL-I/RM550	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)	1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm		e4			25.8 mm
RN41-I/RM630	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.1 mm	13.2 mm		e4			25.8 mm
RN41SM-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.1 mm	13.2 mm		e4			25.8 mm
RN42-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)	1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm		e4			25.8 mm
RN42HCI-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,35LEAD(UNSPEC)	1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	3 Mbps	R-XXMA-N35		2.4 mm	13.4 mm			NOT SPECIFIED	NOT SPECIFIED	25.6 mm
RN42HID-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)	1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm		e4			25.8 mm
RN42N-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.4 mm	13.4 mm		e4			20.5 mm
RN42SM-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.4 mm	13.4 mm		e4			25.8 mm
RN42U-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N32		2.4 mm	13.4 mm			NOT SPECIFIED	NOT SPECIFIED	25.8 mm
MRF24WG0MART-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1	TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm					31 mm
BM23SPKA1NB9-0001AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.7 V	MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)	1.2 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm					29 mm
BM23SPKA1NB9-0B02AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.7 V	MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)	1.2 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm					29 mm
BM23SPKS1NB9-0001AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.7 V	MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)	1.2 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm					29 mm
BM23SPKS1NB9-0B02AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.7 V	MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)	1.2 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm					29 mm
WFM200SS22XNA2	Silicon Labs	TELECOM CIRCUIT		NO LEAD	52	LGA	SQUARE	UNSPECIFIED	YES	1		1.8 V	GRID ARRAY	LGA52(UNSPEC)	.5 mm	105 Cel	-40 Cel		BOTTOM	72.2 Mbps	S-XLGA-N52	3	1.4 mm	6.5 mm			40	260	6.5 mm
PM5440B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1894	BGA	SQUARE	PLASTIC/EPOXY	YES	1			GRID ARRAY						BOTTOM		S-PBGA-B1894
PM5980B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1			GRID ARRAY						BOTTOM		S-PBGA-B1932
PM5981B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1			GRID ARRAY						BOTTOM		S-PBGA-B1932

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.