TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BLE113-A-M256K

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

2 Mbps

R-XXMA-N36

2 mm

9.15 mm

15.73 mm

BLE121LR-A-M256K

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.9 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N36

1.8 mm

13 mm

14.7 mm

BT111-A-HCI

Silicon Labs

TELECOM CIRCUIT

OTHER

NO LEAD

21

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1.1 mm

85 Cel

-30 Cel

UNSPECIFIED

R-XXMA-N21

2.31 mm

9.3 mm

13.05 mm

BT121-A-V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

33

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N33

2.1 mm

11 mm

13.9 mm

BT121-A-V2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

33

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N33

2.1 mm

11 mm

13.9 mm

WT12-A-AI4

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2.6 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

25.6 mm

WT12-A-AI5

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2.1781 Mbps

R-XXMA-N31

2.6 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

25.6 mm

WT12-A-HCI21

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2.6 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

25.6 mm

NEO-7N-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

RECTANGULAR

UNSPECIFIED

NO

1

AEC-Q100

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

SILVER OVER NICKEL

DUAL

R-XDMA-N24

2.6 mm

12.2 mm

e4

16 mm

RN4870-V/RM118

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

MODULE,33LEAD(UNSPEC)

1.1 mm

70 Cel

-20 Cel

UNSPECIFIED

.01 Mbps

R-XXMA-N33

2.46 mm

12 mm

22 mm

HMC8100LP6JE

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N40

3

.95 mm

6 mm

e4

30

260

6 mm

CYBLE-212019-00

Cypress Semiconductor

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2 mm

14.52 mm

NOT SPECIFIED

NOT SPECIFIED

19.2 mm

EFR32BG1B232F256GM48-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

.9 mm

7 mm

7 mm

EFR32BG1V132F256GM32-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

2

.9 mm

5 mm

e3

40

260

5 mm

HMC8200LP5METR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N32

3

1 mm

5 mm

e4

260

5 mm

STA8090FGBTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

99

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B99

1.2 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

STA8090FGTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

99

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B99

1.2 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

STA8090FG

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

99

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B99

1.2 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

ADF7030-1BSTZN-RL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

e3

30

260

7 mm

ADF7030-1BSTZN

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

e3

30

260

7 mm

HMC625BLP5E

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N32

3

1 mm

5 mm

e3

30

260

5 mm

ADC32RF80IRMPR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

72

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.15 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

12500 Mbps

S-XQCC-N72

3

.9 mm

10 mm

e4

30

260

10 mm

ADC32RF80IRMPT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

72

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.15 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

12500 Mbps

S-XQCC-N72

3

.9 mm

10 mm

e4

30

260

10 mm

WT32I-A-AI6-APTX

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

50

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N50

3

2.55 mm

15.9 mm

40

260

23.9 mm

WT32I-A-AI6IAP

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

50

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N50

2.55 mm

15.9 mm

NOT SPECIFIED

NOT SPECIFIED

23.9 mm

WT32I-A-AI6

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

50

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N50

2.55 mm

15.9 mm

NOT SPECIFIED

NOT SPECIFIED

23.9 mm

WT32I-E-AI6-APTX

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

50

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N50

2.55 mm

15.9 mm

23.9 mm

WT32I-E-AI6IAP

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

50

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N50

2.55 mm

15.9 mm

23.9 mm

WT32I-E-AI6

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

50

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N50

2.55 mm

15.9 mm

23.9 mm

LBCA2HNZYZ-711

Murata Manufacturing

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

37

RECTANGULAR

UNSPECIFIED

YES

1

2.5 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N37

3

1 mm

7 mm

7.4 mm

RN4678-V/RM100

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.1 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N33

2.46 mm

12 mm

22 mm

RN4678APL-V/RM100

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

YES

1

1.9 V

MICROELECTRONIC ASSEMBLY

MODULE,33LEAD(UNSPEC)

1.1 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N33

2.46 mm

12 mm

22 mm

HMC6300BG46

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

65

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B65

1

.815 mm

4 mm

30

260

6 mm

SARA-U260-00S

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

96

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-B96

4

3 mm

16 mm

26 mm

HMC6301BG46

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

75

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.35 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B75

1

.815 mm

4 mm

30

260

6 mm

BGM121A256V1R

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N56

1.4 mm

6.5 mm

6.5 mm

BGM121A256V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N56

1.4 mm

6.5 mm

6.5 mm

BGM123N256V2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N56

3

1.4 mm

6.5 mm

40

260

6.5 mm

CC2564CRVMT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

76

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

4 Mbps

S-XQCC-N76

3

.9 mm

8 mm

e3

30

260

8 mm

HMC7891

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

4

RECTANGULAR

UNSPECIFIED

NO

1

8 V

FLANGE MOUNT

85 Cel

-40 Cel

UNSPECIFIED

R-XXFM-X4

1

HMC625BLP5ETR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N32

3

1 mm

5 mm

e3

30

260

5 mm

SARA-U270-03S

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

96

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-B96

4

3.25 mm

16 mm

26 mm

SARA-U201-03B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

96

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-B96

4

3.25 mm

16 mm

26 mm

TLE8457ASJXUMA1

Infineon Technologies

TELECOM CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

AEC-Q100

8 V

SMALL OUTLINE

1.27 mm

TIN

DUAL

R-PDSO-G8

3

1.75 mm

4 mm

e3

5 mm

ETRX2-PA

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N38

20.5 mm

37.5 mm

ETRX2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N38

20.5 mm

37.5 mm

CYBLE-214009-00

Cypress Semiconductor

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

.66 mm

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N32

1.8 mm

11 mm

NOT SPECIFIED

NOT SPECIFIED

11 mm

ADC32RF83IRMPR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

72

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.15 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

12500 Mbps

S-XQCC-N72

3

.9 mm

10 mm

e4

30

260

10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.