TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

LC72720YVS-MPB-E

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

30

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN BISMUTH

DUAL

R-PDSO-G30

4

1.5 mm

5.6 mm

e6

30

260

9.75 mm

LC72720YVS-TLM-E

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

30

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN BISMUTH

DUAL

R-PDSO-G30

4

1.5 mm

5.6 mm

e6

30

260

9.75 mm

BGS110MN20E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

20

BCC

SQUARE

UNSPECIFIED

YES

1

3.5 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

S-XBCC-B20

1

.77 mm

2.3 mm

2.3 mm

HMC641ALP4ETR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

-3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N24

.95 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

LMS7002M

Lime Microsystems

TELECOM CIRCUIT

INDUSTRIAL

BALL

261

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B261

11.5 mm

11.5 mm

IP4047CX6/LF,135

Nexperia

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B6

.7 mm

.99 mm

1.44 mm

RN41XVC-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

20

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-T20

1

2 mm

24.4 mm

29.9 mm

RN41XVU-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

20

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

Nickel/Gold (Ni/Au)

DUAL

R-XDMA-T20

2 mm

24.4 mm

e4

29.9 mm

RN42XVU-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

20

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

Nickel/Gold (Ni/Au)

DUAL

R-XDMA-T20

2 mm

24.4 mm

e4

29.9 mm

ENW89823C4KF

Panasonic

TELECOM CIRCUIT

HMC745LC3TR-R5

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-CQCC-N16

3

.9 mm

2.9 mm

2.9 mm

AX-SFEU-1-01-TB05

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.27,20

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

R-PQCC-N40

1

1 mm

5 mm

e4

260

7 mm

AX5243-1-TA05

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-XQCC-N20

1

1 mm

4 mm

e3

260

4 mm

AX5243-1-TW30

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

1 mm

4 mm

e3

30

260

4 mm

BGA5M1BN6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B6

1

.4 mm

.7 mm

1.1 mm

BGSF110GN26E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

26

HQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

R-PQCC-N26

1

.77 mm

2.6 mm

e4

3.4 mm

RM024-P125-C-30

Laird Technologies

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

.5 Mbps

R-XXMA-X

ALSO AVAILABLE WITH 280kbps data rate

NOT SPECIFIED

NOT SPECIFIED

RM024-S125-C-30

Laird Technologies

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

.5 Mbps

R-XXMA-X

ALSO AVAILABLE WITH 280kbps data rate

NOT SPECIFIED

NOT SPECIFIED

ADAR1000ACCZN-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

88

HLGA

SQUARE

PLASTIC/EPOXY

YES

1

-5 V

3.3 V

GRID ARRAY, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B88

3

.8 mm

7 mm

260

7 mm

ADAR1000ACCZN

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

88

HLGA

SQUARE

PLASTIC/EPOXY

YES

1

-5 V

3.3 V

GRID ARRAY, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B88

.8 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

LEA-6T-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N28

ADRV9009BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B196

3

1.27 mm

12 mm

e1

260

12 mm

AX5042-1-TA05

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-XQCC-N28

1

1 mm

5 mm

e4

260

5 mm

MFRC63103HNE

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD SILVER

2

e4

30

260

BGAU1A10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

10

BCC

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B10

1

.65 mm

1.1 mm

1.5 mm

ST25TV16K-AP6G3

STMicroelectronics

TELECOM CIRCUIT

NO LEAD

DIE

ROUND

UNSPECIFIED

YES

1

UNCASED CHIP

DIE OR CHIP

85 Cel

-40 Cel

UNSPECIFIED

.053 Mbps

X-XUUC-N

ADRV9008BBCZ-1

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.27 mm

12 mm

260

12 mm

ADRV9008BBCZ-2

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.27 mm

12 mm

260

12 mm

ACFM-7037-TR1

Broadcom

TELECOM CIRCUIT

NO LEAD

15

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

UNSPECIFIED

R-XXMA-N15

.8 mm

2 mm

3.6 mm

ZED-F9P-00B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

54

LGA

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100

3 V

GRID ARRAY

1.1 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-N54

2.6 mm

17 mm

22 mm

XB3-24Z8PS-J

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

37

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N37

NOT SPECIFIED

NOT SPECIFIED

XB3-24Z8RM-J

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

13 mm

NOT SPECIFIED

NOT SPECIFIED

19 mm

XB3-24Z8RM

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

13 mm

19 mm

XB3-24Z8RS

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

37

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N37

XB3-24Z8US-J

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

37

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N37

NOT SPECIFIED

NOT SPECIFIED

STHVDAC-253C7

STMicroelectronics

TELECOM CIRCUIT

BALL

12

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,14

.35 mm

85 Cel

-30 Cel

BOTTOM

R-XBGA-B12

.64 mm

1.1 mm

NOT SPECIFIED

NOT SPECIFIED

1.45 mm

TC35680FSG-002(ELG

Toshiba

TELECOM CIRCUIT

NO LEAD

40

HVQCCN

SQUARE

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2SQ,16

.4 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N40

.9 mm

5 mm

5 mm

VSC8490YJU-17

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

1 mm

110 Cel

-40 Cel

BOTTOM

10000 Mbps

S-PBGA-B196

1.4 mm

15 mm

15 mm

VSC8491YJU-17

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

1 mm

110 Cel

-40 Cel

BOTTOM

10000 Mbps

S-PBGA-B196

1.4 mm

15 mm

15 mm

ADF5902WCCPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N32

3

.8 mm

5 mm

260

5 mm

SARA-G450-00C-00

U-blox Ag

TELECOM CIRCUIT

OTHER

NO LEAD

96

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

MICROELECTRONIC ASSEMBLY

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N96

2.65 mm

16 mm

26 mm

ZED-F9T-00B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

54

LGA

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100

3 V

GRID ARRAY

1.1 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B54

4

2.6 mm

17 mm

22 mm

453-00005C

Laird Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

39

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.75 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N39

4

2.33 mm

10 mm

30

260

14 mm

XB24CZ7PIS-004

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N

NOT SPECIFIED

NOT SPECIFIED

ADS58J64IRRHR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

72

HQCCN

RECTANGULAR

UNSPECIFIED

YES

1

1.15 V

CHIP CARRIER, HEAT SINK/SLUG

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

R-XQCC-N72

3

2 V

e4

30

260

MGM12P02F1024GA-V4R

Silicon Labs

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

12.9 mm

17.8 mm

MGM12P02F1024GA-V4

Silicon Labs

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

12.9 mm

17.8 mm

MGM12P02F1024GE-V4

Silicon Labs

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

12.9 mm

17.8 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.