TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SA5212AD/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
SA5212AD/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
SA5217D/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
SA5217D/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
SA58646BD,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G64	1	1.6 mm	10 mm	Not Qualified	e3			10 mm
SA602AN/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified	e4			9.5 mm
SA612AN/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified	e4			9.5 mm
MCP2140A-I/P	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS	TS 16949			3 V		IN-LINE	DIP18,.3		2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T18		5.334 mm	7.62 mm	Not Qualified	e3			22.86 mm
MCP2140A-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	TS 16949			3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G18	2	2.65 mm	7.5 mm	Not Qualified	e3	40	260	11.55 mm
SA602AD/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
SA602AD/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
SA606D/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
SA606D/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
SA606DK/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
SA606DK/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
SA607DK/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
SA607DK/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
SA612AD/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4		260	4.9 mm
SA612AD/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
SA616DK/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4		260	6.5 mm
SA616DK/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4		260	6.5 mm
SA636DK/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
SA636DK/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
SA639DH/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	1	1.1 mm	4.4 mm	Not Qualified	e4		260	7.8 mm
TPS65720YFFT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	UNSPECIFIED	YES	1						3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-XBGA-B25	1	.625 mm	2.3 mm	Not Qualified	e1	NOT SPECIFIED	260	2.3 mm
TPS65721RSNT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N32	2	.8 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
SN250QT	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	40	260	7 mm
SN250Q	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	40	260	7 mm
RF-HDT-DVBB-N1	Texas Instruments	TELECOM CIRCUIT	OTHER							1												90 Cel	-25 Cel								Not Qualified
RF-HDT-DVBE-N0	Texas Instruments	TELECOM CIRCUIT	OTHER							1												90 Cel	-25 Cel								Not Qualified
RI-TRP-DR2B-30	Texas Instruments	TELECOM CIRCUIT	OTHER							1												85 Cel	-25 Cel								Not Qualified		NOT SPECIFIED	NOT SPECIFIED
RI-TRP-DR2B	Texas Instruments	TELECOM CIRCUIT	OTHER							1												85 Cel	-25 Cel					1			Not Qualified
RI-TRP-R9QL-30	Texas Instruments	TELECOM CIRCUIT	OTHER							1												85 Cel	-25 Cel								Not Qualified		NOT SPECIFIED	NOT SPECIFIED
RI-TRP-W9QL-20	Texas Instruments	TELECOM CIRCUIT	OTHER							1												70 Cel	-25 Cel					1			Not Qualified
RI-TRP-W9QL-30	Texas Instruments	TELECOM CIRCUIT	OTHER							1												70 Cel	-25 Cel								Not Qualified		NOT SPECIFIED	NOT SPECIFIED
RI-TRP-WE2B-30	Texas Instruments	TELECOM CIRCUIT	OTHER							1												70 Cel	-25 Cel	TIN SILVER COPPER							Not Qualified	e1
RI-TRP-WEHP-30	Texas Instruments	TELECOM CIRCUIT	OTHER							1												70 Cel	-25 Cel	TIN SILVER COPPER							Not Qualified	e1
RI-TRP-WR2B-30	Texas Instruments	TELECOM CIRCUIT	OTHER							1												85 Cel	-25 Cel	TIN SILVER COPPER							Not Qualified	e1
HCPL-800J-500E	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					.056 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G16	1	3.632 mm	7.493 mm	Not Qualified	e3		260	10.312 mm
STA5620TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS			.019 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
ONET2591TAYS	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	DIE	RECTANGULAR	UNSPECIFIED	YES	1					.023 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER		R-XUUC-N11				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
STMPE610QTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	1	1 mm	3 mm	Not Qualified	e3	30	260	3 mm
ADF7023BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	3	.8 mm	5 mm	Not Qualified	e4	30	260	5 mm
PCM3060PWRG4	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G28	2	1.2 mm	4.4 mm	Not Qualified	e4	NOT SPECIFIED	260	9.7 mm
DS31256B	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B256		2.54 mm	27 mm	Not Qualified	e0			27 mm
ONET8501VRGPRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					90 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	11300 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
SN65LVCP40RGZTG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					.254 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	4000 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified	e4	NOT SPECIFIED	260	7 mm
TLK3138GDU	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	2		CMOS		2		1.2 V	1.2,1.5,2.5	GRID ARRAY	BGA484,22X22,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	3125 Mbps	S-PBGA-B484	4			Not Qualified	e0	20	220

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.