| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.33 mm |
7.62 mm |
Not Qualified |
e0 |
36.687 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 mA |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e0 |
240 |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e0 |
240 |
17.9 mm |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e0 |
240 |
10.2 mm |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e0 |
240 |
17.9 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
BALL |
42 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B42 |
1 |
.5 mm |
2.844 mm |
e1 |
30 |
260 |
3.556 mm |
|||||||||||||||||||||||||||||||||||||||
|
|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
.9 mm |
7 mm |
e3 |
40 |
260 |
7 mm |
|||||||||||||||||||||||||||||||||||||
|
|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
.9 mm |
7 mm |
e3 |
40 |
260 |
7 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
350 mA |
4.8 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.2 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6.5 mm |
|||||||||||||||||||||||||||||||||||||||
|
|
Psemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N20 |
1 |
.9 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.135 mA |
2.5 V |
2.5,3.3 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
1 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
|||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.45 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
4000 Mbps |
S-XQCC-N68 |
3 |
1 mm |
10 mm |
1.995 V |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
e4 |
30 |
260 |
2 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
240 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
240 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.076 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
ATM/SONET/SDH ICs |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e0 |
20 |
240 |
5 mm |
|||||||||||||||||||||||||||||||||
|
Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.084 mA |
3.3 V |
3.3 |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
SSOP16,.25 |
Other Telecom ICs |
.635 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
GULL WING |
72 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
FIBER OPTIC |
UNSPECIFIED |
R-XXFO-G72 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
GULL WING |
72 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
FIBER OPTIC |
UNSPECIFIED |
R-XXFO-G72 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
5 Mbps |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
484 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
4 |
2.48 mm |
23 mm |
Not Qualified |
e1 |
30 |
260 |
23 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
52 Mbps |
S-PQFP-G80 |
1.6 mm |
12 mm |
Not Qualified |
12 mm |
|||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
2500 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||
|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
AEC-Q100 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
AEC-Q100 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
1 mm |
4 mm |
e3 |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
1 mm |
4 mm |
e3 |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Broadcom |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
9 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N9 |
3 |
1.05 mm |
2 mm |
260 |
2.9 mm |
||||||||||||||||||||||||||||||||||||||||||
|
|
Broadcom |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
9 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N9 |
3 |
1.05 mm |
2 mm |
260 |
2.9 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
QUAD |
S-XQCC-N28 |
1 mm |
5 mm |
5 mm |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
QUAD |
S-XQCC-N28 |
1 mm |
5 mm |
5 mm |
|||||||||||||||||||||||||||||||||||||||||||||||
|
|
Laird Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
UNSPECIFIED |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-X |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Cypress Semiconductor |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.4 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e3 |
20 |
260 |
6 mm |
||||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N40 |
1 |
1 mm |
6 mm |
Not Qualified |
e3 |
40 |
260 |
6 mm |
||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
5 |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
9.9 mm |
||||||||||||||||||||||||||||||||||
|
|
Diodes Incorporated |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
1 |
.65 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
1.1,1.8,3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
7 mm |
||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
1.1,1.8,3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
7 mm |
||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.08 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
80 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-J28 |
3 |
4.572 mm |
11.506 mm |
Not Qualified |
e3 |
30 |
260 |
11.506 mm |
|||||||||||||||||||||||||||||||||
|
Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
.087 mA |
3 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N48 |
1 |
.8 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
|||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.5 Mbps |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.5 Mbps |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.5 Mbps |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.25 Mbps |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
Not Qualified |
e4 |
30 |
260 |
9 mm |
||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
Not Qualified |
e4 |
30 |
260 |
9 mm |
|||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
Not Qualified |
e4 |
30 |
260 |
9 mm |
|||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.25 Mbps |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
Not Qualified |
e4 |
30 |
260 |
9 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.