| Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Micron Technology |
PSEUDO STATIC RAM |
OTHER |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
20 mA |
2097152 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-25 Cel |
Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5) |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e8 |
30 |
260 |
.00011 Amp |
8 mm |
70 ns |
||||||||||||||
|
Micron Technology |
PSEUDO STATIC RAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
20 mA |
2097152 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e0 |
.00011 Amp |
8 mm |
70 ns |
|||||||||||||||||
|
Micron Technology |
PSEUDO STATIC RAM |
OTHER |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
20 mA |
2097152 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-25 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e0 |
.00011 Amp |
8 mm |
70 ns |
|||||||||||||||||
|
Micron Technology |
PSEUDO STATIC RAM |
OTHER |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
17 mA |
2097152 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-25 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e0 |
.00011 Amp |
8 mm |
85 ns |
|||||||||||||||||
|
|
Micron Technology |
PSEUDO STATIC RAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
25 mA |
4194304 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5) |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
67108864 bit |
1.7 V |
e8 |
30 |
260 |
.00012 Amp |
8 mm |
70 ns |
||||||||||||||
|
|
Micron Technology |
PSEUDO STATIC RAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
30 mA |
2097152 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-30 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e1 |
260 |
.00009 Amp |
8 mm |
70 ns |
|||||||||||||||
|
Micron Technology |
PSEUDO STATIC RAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
30 mA |
2097152 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-30 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e0 |
.00011 Amp |
8 mm |
70 ns |
|||||||||||||||||
|
Micron Technology |
PSEUDO STATIC RAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
30 mA |
2097152 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-30 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e0 |
.00011 Amp |
8 mm |
85 ns |
|||||||||||||||||
|
|
STMicroelectronics |
NON-VOLATILE SRAM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
8192 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.5 |
SRAMs |
1.27 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
3.05 mm |
8.56 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
.003 Amp |
18.1 mm |
70 ns |
|||||||||||||||||
|
|
STMicroelectronics |
NON-VOLATILE SRAM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.5 |
SRAMs |
1.27 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
3.05 mm |
8.56 mm |
Not Qualified |
262144 bit |
4.5 V |
SNAPHAT BATTERY TO BE ORDERED SEPARATELY |
e3 |
.003 Amp |
18.1 mm |
70 ns |
||||||||||||||||
|
|
STMicroelectronics |
NON-VOLATILE SRAM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.5 |
SRAMs |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
5.5 V |
3.05 mm |
8.56 mm |
Not Qualified |
262144 bit |
4.5 V |
SNAPHAT BATTERY TO BE ORDERED SEPARATELY |
e4 |
.003 Amp |
18.1 mm |
70 ns |
|||||||||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
30 mA |
2097152 words |
COMMON |
3 |
2.5/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
1.5 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
8 mm |
Not Qualified |
16777216 bit |
2.2 V |
e0 |
220 |
.00001 Amp |
9.5 mm |
55 ns |
||||||||||||||
|
|
STMicroelectronics |
NON-VOLATILE SRAM |
COMMERCIAL |
44 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
45 mA |
32768 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE, SHRINK PITCH |
SOP44,.5,32 |
SRAMs |
.81 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G44 |
3.6 V |
3.05 mm |
8.56 mm |
Not Qualified |
262144 bit |
3 V |
e3/e4 |
NOT SPECIFIED |
NOT SPECIFIED |
.0005 Amp |
18.1 mm |
35 ns |
||||||||||||||||
|
|
STMicroelectronics |
NON-VOLATILE SRAM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOP28,.5 |
SRAMs |
1.27 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
TIN |
DUAL |
R-PDSO-G28 |
3 |
3.6 V |
3.05 mm |
8.56 mm |
Not Qualified |
262144 bit |
3 V |
SNAPHAT BATTERY TO BE ORDERED SEPARATELY |
e3 |
.003 Amp |
18.1 mm |
100 ns |
||||||||||||||||
|
|
Microchip Technology |
STANDARD SRAM |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
8192 words |
SEPARATE |
3 |
3/3.3 |
8 |
IN-LINE |
DIP8,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
8KX8 |
8K |
2.7 V |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T8 |
3.6 V |
5.334 mm |
16 MHz |
7.62 mm |
Not Qualified |
65536 bit |
2.7 V |
e3 |
NO |
.00001 Amp |
9.271 mm |
||||||||||||
|
|
Microchip Technology |
STANDARD SRAM |
AUTOMOTIVE |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
10 mA |
8192 words |
SEPARATE |
3 |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
SRAMs |
.65 mm |
125 Cel |
3-STATE |
8KX8 |
8K |
2.7 V |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G8 |
1 |
3.6 V |
1.2 mm |
16 MHz |
3 mm |
Not Qualified |
65536 bit |
2.7 V |
e3 |
40 |
260 |
NO |
.00001 Amp |
4.4 mm |
|||||||||
|
|
Microchip Technology |
STANDARD SRAM |
AUTOMOTIVE |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
10 mA |
8192 words |
SEPARATE |
3 |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
SRAMs |
.65 mm |
125 Cel |
3-STATE |
8KX8 |
8K |
2.7 V |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G8 |
1 |
3.6 V |
1.2 mm |
16 MHz |
3 mm |
Not Qualified |
65536 bit |
2.7 V |
e3 |
40 |
260 |
NO |
.00001 Amp |
4.4 mm |
|||||||||
|
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
36 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
100 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA36,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B36 |
3 |
3.45 V |
1.2 mm |
8 mm |
Not Qualified |
1048576 bit |
3.15 V |
e1 |
10 |
260 |
.0015 Amp |
10 mm |
12 ns |
||||||||||||
|
|
Integrated Silicon Solution |
STANDARD SRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
90 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ32,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-J32 |
3.6 V |
3.56 mm |
7.62 mm |
Not Qualified |
1048576 bit |
3 V |
e3 |
10 |
260 |
.0015 Amp |
20.955 mm |
12 ns |
|||||||||||||
|
Integrated Device Technology |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
105 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-40 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
R-PDSO-J28 |
3 |
5.5 V |
3.556 mm |
7.5184 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
30 |
225 |
.0002 Amp |
17.9324 mm |
35 ns |
|||||||||||||
|
Micron Technology |
PSEUDO STATIC RAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
35 mA |
2097152 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-30 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e0 |
.00011 Amp |
8 mm |
70 ns |
|||||||||||||||||
|
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 |
R-PDSO-G32 |
3 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
10 |
260 |
YES |
.00045 Amp |
20.95 mm |
12 ns |
||||||||||
|
|
Micron Technology |
PSEUDO STATIC RAM |
INDUSTRIAL |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
35 mA |
8388608 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
8MX16 |
8M |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B54 |
1.95 V |
1 mm |
8 mm |
Not Qualified |
134217728 bit |
1.7 V |
e1 |
260 |
YES |
.0002 Amp |
10 mm |
70 ns |
||||||||||||
|
|
Onsemi |
NON-VOLATILE SRAM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
16 words |
5 |
5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
1.27 mm |
85 Cel |
16X16 |
16 |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
3.9 mm |
Not Qualified |
256 bit |
4.5 V |
e3 |
30 |
260 |
.00003 Amp |
4.9 mm |
||||||||||||||||
|
|
Integrated Device Technology |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
210 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
4.5 V |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G44 |
3 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
30 |
260 |
.01 Amp |
18.41 mm |
12 ns |
||||||||||||
|
|
Integrated Device Technology |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
210 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
4.5 V |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G44 |
3 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
30 |
260 |
.01 Amp |
18.41 mm |
12 ns |
||||||||||||
|
|
Integrated Device Technology |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
160 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-J32 |
3 |
5.5 V |
3.683 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
30 |
260 |
.01 Amp |
20.955 mm |
12 ns |
||||||||||||
|
|
Integrated Device Technology |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
160 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-J32 |
3 |
5.5 V |
3.683 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
30 |
260 |
.01 Amp |
20.955 mm |
12 ns |
||||||||||||
|
|
Integrated Device Technology |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
115 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
3 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
3.15 V |
e3 |
40 |
260 |
.01 Amp |
20.95 mm |
20 ns |
||||||||||||
|
|
Integrated Device Technology |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
115 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
3 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
3 V |
e3 |
40 |
260 |
.01 Amp |
20.95 mm |
20 ns |
||||||||||||
|
|
Integrated Device Technology |
CACHE SRAM |
COMMERCIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
100 mA |
32768 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
3 V |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-J28 |
3 |
3.6 V |
3.556 mm |
7.5184 mm |
Not Qualified |
262144 bit |
3 V |
e3 |
40 |
260 |
YES |
.002 Amp |
17.9324 mm |
10 ns |
||||||||||
|
|
Cypress Semiconductor |
ZBT SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
2097152 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
2MX18 |
2M |
3.14 V |
0 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
133 MHz |
14 mm |
Not Qualified |
37748736 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
e3 |
40 |
260 |
.12 Amp |
20 mm |
6.5 ns |
|||||||||||
|
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
110 mA |
524288 words |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
512KX16 |
512K |
3.14 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G44 |
3 |
3.63 V |
1.2 mm |
10.16 mm |
Not Qualified |
8388608 bit |
3.135 V |
e3 |
10 |
260 |
.025 Amp |
18.415 mm |
10 ns |
||||||||||||
|
|
Integrated Silicon Solution |
STANDARD SRAM |
COMMERCIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
22 mA |
1048576 words |
COMMON |
1.8 |
2.5/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
1.4 V |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G44 |
3 |
2.2 V |
1.2 mm |
10.16 mm |
Not Qualified |
8388608 bit |
1.65 V |
e3 |
.00004 Amp |
18.415 mm |
55 ns |
||||||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
37 mA |
1048576 words |
COMMON |
3 |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1.5 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
16777216 bit |
2.2 V |
CONFIGURABLE AS 2M X 8 ALSO |
e4 |
20 |
260 |
.00001 Amp |
18.4 mm |
45 ns |
|||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
90 mA |
65536 words |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
3 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G44 |
3 |
3.63 V |
1.194 mm |
10.16 mm |
Not Qualified |
1048576 bit |
2.97 V |
e4 |
20 |
260 |
.005 Amp |
18.415 mm |
10 ns |
||||||||||||
|
|
Cypress Semiconductor |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
240 mA |
65536 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
32 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
64KX32 |
64K |
3.14 V |
0 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
166 MHz |
14 mm |
Not Qualified |
2097152 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e3 |
40 |
260 |
.04 Amp |
20 mm |
3.5 ns |
||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
AUTOMOTIVE |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
75 mA |
262144 words |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
125 Cel |
3-STATE |
256KX16 |
256K |
3 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.194 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
e4 |
20 |
260 |
.015 Amp |
18.415 mm |
20 ns |
|||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
262144 words |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ28,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
256KX4 |
256K |
2 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-J28 |
3 |
5.5 V |
3.7592 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e4 |
30 |
260 |
.003 Amp |
18.415 mm |
10 ns |
||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
60 mA |
524288 words |
COMMON |
3 |
3/5 |
8 |
SMALL OUTLINE |
SOP32,.56 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
1.5 V |
-40 Cel |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
2.997 mm |
11.303 mm |
Not Qualified |
4194304 bit |
2.7 V |
e3/e6 |
.00003 Amp |
55 ns |
||||||||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
15 mA |
524288 words |
COMMON |
3 |
2.5/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
512KX16 |
512K |
1.5 V |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
8388608 bit |
2.2 V |
e1 |
20 |
260 |
.000004 Amp |
8 mm |
55 ns |
||||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
524288 words |
COMMON |
3 |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
512KX16 |
512K |
1.5 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.194 mm |
10.16 mm |
Not Qualified |
8388608 bit |
2.2 V |
e4 |
20 |
260 |
.000004 Amp |
18.415 mm |
55 ns |
||||||||||||
|
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
110 mA |
262144 words |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G44 |
3 |
3.63 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3.135 V |
e3 |
30 |
260 |
.015 Amp |
18.415 mm |
10 ns |
||||||||||||
|
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
36 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
95 mA |
524288 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ36,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
3.14 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-J36 |
3.63 V |
3.75 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3.135 V |
e3 |
10 |
260 |
.02 Amp |
23.495 mm |
10 ns |
|||||||||||||
|
|
Integrated Silicon Solution |
STANDARD SRAM |
COMMERCIAL |
32 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
95 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP32,.56,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3.6 V |
1.25 mm |
8 mm |
Not Qualified |
1048576 bit |
3 V |
e3 |
10 |
260 |
.0015 Amp |
11.8 mm |
10 ns |
|||||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
2 V |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e4 |
40 |
260 |
36.322 mm |
70 ns |
|||||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.5 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
2 V |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
2.794 mm |
7.5057 mm |
Not Qualified |
262144 bit |
4.5 V |
e4 |
20 |
260 |
17.9324 mm |
70 ns |
|||||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.5 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
2.794 mm |
7.5057 mm |
Not Qualified |
262144 bit |
4.5 V |
e4 |
20 |
260 |
17.9324 mm |
70 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.