| Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
48 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3.3 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.75 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1.4 mm |
6 mm |
16777216 bit |
2.7 V |
8 mm |
10 ns |
|||||||||||||||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
36 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
DUAL |
R-PDSO-J36 |
3 |
3.6 V |
3.7592 mm |
10.16 mm |
4194304 bit |
3 V |
e3/e6 |
23.495 mm |
12 ns |
||||||||||||||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
48 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3.3 |
8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.75 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1.4 mm |
6 mm |
8388608 bit |
2.7 V |
8 mm |
10 ns |
|||||||||||||||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
8388608 bit |
2.7 V |
40 |
260 |
18.415 mm |
10 ns |
|||||||||||||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
4194304 bit |
3 V |
e3/e6 |
18.415 mm |
10 ns |
||||||||||||||||||||||||
|
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
DUAL |
R-PDSO-G44 |
5.5 V |
1.2 mm |
10.16 mm |
8388608 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
18.41 mm |
55 ns |
||||||||||||||||||||||||
|
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
1MX18 |
1M |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
18874368 bit |
3.135 V |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
3 ns |
||||||||||||||||||||||||
|
|
Integrated Device Technology |
CACHE SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
GRID ARRAY |
85 Cel |
128KX36 |
128K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3 |
3.465 V |
4718592 bit |
3.135 V |
PIPELINED |
e1 |
260 |
3.1 ns |
|||||||||||||||||||||||||
|
Integrated Device Technology |
CACHE SRAM |
TIN LEAD |
3 |
e0 |
20 |
225 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Integrated Device Technology |
CACHE SRAM |
INDUSTRIAL |
165 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
256KX18 |
256K |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
3.465 V |
1.2 mm |
13 mm |
4718592 bit |
3.135 V |
e0 |
225 |
15 mm |
7.5 ns |
|||||||||||||||||||||||
|
|
Integrated Device Technology |
STANDARD SRAM |
MATTE TIN |
3 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Integrated Device Technology |
STANDARD SRAM |
MATTE TIN |
3 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Integrated Device Technology |
STANDARD SRAM |
MATTE TIN |
3 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
780 mA |
524288 words |
COMMON |
1.5 |
1.5/1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
1.4 V |
-40 Cel |
TIN LEAD |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
1.58 V |
1.7 mm |
167 MHz |
17 mm |
Not Qualified |
18874368 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e0 |
.35 Amp |
17 mm |
4 ns |
||||||||||||
|
|
STMicroelectronics |
STANDARD SRAM |
MILITARY |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4 words |
4.5 |
2/6 |
4 |
IN-LINE |
DIP16,.3 |
Other Memory ICs |
2.54 mm |
125 Cel |
3-STATE |
4X4 |
4 |
-55 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T16 |
6 V |
5.1 mm |
7.62 mm |
Not Qualified |
16 bit |
2 V |
e3 |
NO |
280 ns |
||||||||||||||||||
|
|
STMicroelectronics |
STANDARD SRAM |
MILITARY |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4 words |
4.5 |
2/6 |
4 |
SMALL OUTLINE |
SOP16,.25 |
Other Memory ICs |
1.27 mm |
125 Cel |
3-STATE |
4X4 |
4 |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 |
R-PDSO-G16 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
16 bit |
2 V |
e4 |
NO |
9.9 mm |
280 ns |
|||||||||||||||||
|
Texas Instruments |
CACHE TAG SRAM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
180 mA |
16384 words |
5 |
5 |
4 |
CHIP CARRIER |
LDCC32,.5X.6 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
0 Cel |
QUAD |
1 |
R-PQCC-J32 |
5.25 V |
Not Qualified |
65536 bit |
4.75 V |
8K X 4 2-WAY CACHE ADDRESS COMPARATOR/DATA RAM |
NOT SPECIFIED |
NOT SPECIFIED |
NO |
.15 Amp |
17 ns |
||||||||||||||||||
|
Texas Instruments |
CACHE TAG SRAM |
COMMERCIAL |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
125 mA |
2048 words |
5 |
5 |
8 |
CHIP CARRIER |
LDCC28,.5SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
QUAD |
1 |
S-PQCC-J28 |
5.5 V |
4.57 mm |
11.5062 mm |
Not Qualified |
16384 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
NO |
11.5062 mm |
20 ns |
|||||||||||||||||
|
Texas Instruments |
STANDARD SRAM |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
TTL |
MIL-PRF-38535 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
4 words |
5 |
5 |
4 |
CHIP CARRIER |
LCC20,.35SQ |
Other Memory ICs |
1.27 mm |
125 Cel |
3-STATE |
4X4 |
4 |
-55 Cel |
TIN LEAD |
QUAD |
1 |
S-CQCC-N20 |
5.25 V |
2.03 mm |
35 MHz |
8.89 mm |
Not Qualified |
16 bit |
4.75 V |
e0 |
NO |
.05 Amp |
8.89 mm |
45 ns |
|||||||||||||||
|
Xicor |
NON-VOLATILE SRAM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
16 words |
5 |
5 |
16 |
IN-LINE |
DIP8,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16X16 |
16 |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T8 |
5.5 V |
4.07 mm |
7.62 mm |
Not Qualified |
256 bit |
4.5 V |
EEPROM SOFTWARE STORE/ RECALL; RETENTION/ENDURANCE-100 YEARS/100000 CYCLES |
e0 |
NO |
.00005 Amp |
10.03 mm |
375 ns |
|||||||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T28 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
YES |
.000005 Amp |
36.322 mm |
70 ns |
||||||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.5 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G28 |
1 |
5.5 V |
2.794 mm |
7.5057 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
30 |
225 |
YES |
.00002 Amp |
17.9324 mm |
70 ns |
|||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
SRAMs |
.55 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G28 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
YES |
11.8 mm |
70 ns |
|||||||||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
170 mA |
1024 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
8192 bit |
4.5 V |
INTERRUPT FLAG |
e0 |
YES |
.015 Amp |
19.1262 mm |
25 ns |
||||||||||||
|
|
STMicroelectronics |
NON-VOLATILE SRAM |
COMMERCIAL |
36 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
140 mA |
2097152 words |
5 |
5 |
8 |
IN-LINE |
DIP36,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
DUAL |
1 |
R-PDIP-T36 |
5.5 V |
9.52 mm |
15.24 mm |
Not Qualified |
16777216 bit |
4.5 V |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
.008 Amp |
52.96 mm |
70 ns |
||||||||||||||
|
Honeywell |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
MOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
225 Cel |
3-STATE |
32KX8 |
32K |
2.5 V |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T28 |
5.5 V |
4.445 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.00033 Amp |
35.56 mm |
50 ns |
||||||||||||||||
|
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
e0 |
.005 Amp |
150 ns |
||||||||||||||||||||||
|
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
e0 |
.005 Amp |
200 ns |
||||||||||||||||||||||
|
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
e0 |
.005 Amp |
70 ns |
||||||||||||||||||||||
|
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
10 YEARS DATA RETENTION PERIOD |
e0 |
.005 Amp |
70 ns |
|||||||||||||||||||||
|
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
10 YEARS DATA RETENTION PERIOD |
e0 |
.005 Amp |
200 ns |
|||||||||||||||||||||
|
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
5.25 V |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
.005 Amp |
120 ns |
||||||||||||||||||||||
|
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.005 Amp |
70 ns |
||||||||||||||||||||||
|
Texas Instruments |
MULTI-PORT SRAM |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TTL |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
16X4 |
16 |
0 Cel |
DUAL |
2 |
R-PDSO-G24 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
64 bit |
4.5 V |
DUAL MEMORY FOR MULTIBUS ARCHITECTURE |
NO |
15.4 mm |
15 ns |
||||||||||||||||||||||
|
|
STMicroelectronics |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
105 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDMA-P32 |
1 |
5.5 V |
9.52 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
10 YEARS OF DATA RETENTION; POWER SUPPLY WRITE PROTECTION; BATTERY BACK-UP |
e3 |
YES |
.004 Amp |
42.8 mm |
70 ns |
|||||||||||||
|
|
STMicroelectronics |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
105 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDMA-P32 |
1 |
5.5 V |
9.52 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
10 YEARS OF DATA RETENTION; POWER SUPPLY WRITE PROTECTION; BATTERY BACK-UP |
e3 |
225 |
YES |
.004 Amp |
42.8 mm |
70 ns |
||||||||||||
|
|
STMicroelectronics |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
105 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDMA-P32 |
1 |
5.5 V |
9.52 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
10 YEARS OF DATA RETENTION; POWER SUPPLY WRITE PROTECTION; BATTERY BACK-UP |
e3 |
YES |
.004 Amp |
42.8 mm |
85 ns |
|||||||||||||
|
|
STMicroelectronics |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
115 mA |
524288 words |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T32 |
5.5 V |
9.52 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
10 YEARS OF DATA RETENTION; POWER SUPPLY WRITE PROTECTION; BATTERY BACK-UP |
e3 |
YES |
.005 Amp |
42.8 mm |
70 ns |
||||||||||||||
|
|
STMicroelectronics |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
115 mA |
524288 words |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T32 |
5.5 V |
9.52 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.75 V |
10 YEARS OF DATA RETENTION; POWER SUPPLY WRITE PROTECTION; BATTERY BACK-UP |
e3 |
YES |
.005 Amp |
42.8 mm |
70 ns |
||||||||||||||
|
|
STMicroelectronics |
STANDARD SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
4.75 V |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T24 |
5.5 V |
9.65 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.75 V |
e3 |
YES |
.003 Amp |
34.545 mm |
||||||||||||||
|
|
STMicroelectronics |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T24 |
5.5 V |
9.65 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.75 V |
BATTERY BACK-UP; POWER SUPPLY WRITE PROTECTION |
e3 |
YES |
.003 Amp |
34.545 mm |
200 ns |
||||||||||||||
|
|
STMicroelectronics |
STANDARD SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
4.75 V |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T24 |
5.5 V |
9.65 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.75 V |
e3 |
YES |
.003 Amp |
34.545 mm |
||||||||||||||
|
|
STMicroelectronics |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T24 |
5.5 V |
9.65 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.5 V |
BATTERY BACK-UP; POWER SUPPLY WRITE PROTECTION |
e3 |
YES |
.003 Amp |
34.545 mm |
200 ns |
||||||||||||||
|
|
STMicroelectronics |
STANDARD SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T24 |
5.5 V |
9.65 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.5 V |
e3 |
YES |
.003 Amp |
34.545 mm |
||||||||||||||
|
Integrated Device Technology |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
155 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-J32 |
3 |
5.5 V |
3.759 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
30 |
225 |
.01 Amp |
20.96 mm |
15 ns |
|||||||||||||
|
Sharp Corporation |
STANDARD SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
2 V |
-10 Cel |
DUAL |
1 |
R-PDIP-T28 |
5.5 V |
5.2 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
YES |
36 mm |
100 ns |
||||||||||||||||||||||
|
|
Integrated Device Technology |
CACHE SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
350 mA |
131072 words |
COMMON |
3.3 |
3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX36 |
128K |
3.14 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3 |
3.465 V |
2.36 mm |
183 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.035 Amp |
22 mm |
3.3 ns |
||||||||||
|
|
Integrated Device Technology |
CACHE SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
350 mA |
131072 words |
COMMON |
3.3 |
3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX36 |
128K |
3.14 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3 |
3.465 V |
2.36 mm |
183 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.035 Amp |
22 mm |
3.3 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.