| Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Freescale Semiconductor |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.5,1.8/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
85 Cel |
-40 Cel |
TIN SILVER COPPER OVER NICKEL |
BOTTOM |
40 |
260 |
Microprocessors |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
240 rpm |
||||||||||||||||||||||||||||||||||||||||
|
|
Freescale Semiconductor |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.5,3.3 |
GRID ARRAY |
BGA196,14X14,40 |
85 Cel |
-40 Cel |
TIN SILVER COPPER OVER NICKEL |
BOTTOM |
40 |
260 |
CMOS |
Microprocessors |
1 mm |
S-PBGA-B196 |
3 |
Not Qualified |
240 rpm |
|||||||||||||||||||||||||||||||||||||||
|
|
Freescale Semiconductor |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.5,3.3 |
GRID ARRAY |
BGA196,14X14,40 |
85 Cel |
-40 Cel |
TIN SILVER COPPER OVER NICKEL |
BOTTOM |
40 |
260 |
CMOS |
Microprocessors |
1 mm |
S-PBGA-B196 |
3 |
Not Qualified |
240 rpm |
|||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
40 |
1.1,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.05 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
98304 |
24 mm |
YES |
16 |
25 MHz |
24 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
3 |
Not Qualified |
350 rpm |
NO |
e3 |
||||||||||||||||||||||||||
|
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
100 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
40 |
1.1,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.05 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
98304 |
14 mm |
YES |
16 |
25 MHz |
14 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G100 |
3 |
Not Qualified |
400 rpm |
NO |
e3 |
||||||||||||||||||||||||||
|
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
40 |
1.1,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.05 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
98304 |
24 mm |
YES |
16 |
25 MHz |
24 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
3 |
Not Qualified |
400 rpm |
NO |
e3 |
||||||||||||||||||||||||||
|
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
100 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
40 |
1.1,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.05 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
163840 |
14 mm |
YES |
16 |
25 MHz |
14 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G100 |
3 |
Not Qualified |
350 rpm |
NO |
e3 |
||||||||||||||||||||||||||
|
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
40 |
1.1,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.05 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
163840 |
24 mm |
YES |
16 |
25 MHz |
30 |
260 |
24 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
3 |
Not Qualified |
350 rpm |
NO |
e3 |
||||||||||||||||||||||||
|
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
100 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
40 |
1.1,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.05 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
163840 |
14 mm |
YES |
16 |
25 MHz |
14 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G100 |
3 |
Not Qualified |
400 rpm |
NO |
e3 |
||||||||||||||||||||||||||
|
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
40 |
1.1,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.05 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
163840 |
24 mm |
YES |
16 |
25 MHz |
24 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
3 |
Not Qualified |
400 rpm |
NO |
e3 |
||||||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
23 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA361,19X19,25 |
1.14 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
YES |
16 |
30 MHz |
30 |
260 |
16 mm |
CMOS |
1.2 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
Not Qualified |
375 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
|
Freescale Semiconductor |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
24 |
32 |
1.5,1.8/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.4 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER OVER NICKEL |
BOTTOM |
1.6 mm |
17 mm |
YES |
32 |
80 MHz |
40 |
260 |
17 mm |
CMOS |
1.5 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
240 rpm |
YES |
||||||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
26 |
32 |
1.2,3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,21X21,25 |
1.08 V |
105 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1 mm |
16384 |
14 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
14 mm |
CMOS |
37 mA |
1.14 V |
128 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PBGA-B515 |
3 |
Not Qualified |
800 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
26 |
32 |
1.2,1.8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,28X28,16 |
1.08 V |
105 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
.71 mm |
16384 |
12 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
12 mm |
CMOS |
1400 mA |
1.14 V |
128 |
Digital Signal Processors |
.4 mm |
FLOATING POINT |
S-PBGA-B515 |
3 |
Not Qualified |
800 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
26 |
32 |
1.2,3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,23X23,20 |
1.08 V |
90 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
.71 mm |
16384 |
12 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
12 mm |
CMOS |
37 mA |
1.14 V |
128 |
Digital Signal Processors |
.4 mm |
FLOATING POINT |
S-PBGA-B515 |
3 |
Not Qualified |
1000 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
423 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
26 |
32 |
1.2,1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA423,24X24,25 |
1.08 V |
105 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.4 mm |
16384 |
16 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
16 mm |
CMOS |
1400 mA |
1.14 V |
128 |
Digital Signal Processors |
.65 mm |
FLOATING POINT |
S-PBGA-B423 |
3 |
Not Qualified |
800 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
423 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
26 |
32 |
1.2,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA423,24X24,25 |
1.08 V |
90 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.4 mm |
16384 |
16 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
16 mm |
CMOS |
37 mA |
1.14 V |
128 |
Digital Signal Processors |
.65 mm |
FLOATING POINT |
S-PBGA-B423 |
3 |
Not Qualified |
1000 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.2,1.8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,26X26,20 |
1.08 V |
105 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1 mm |
16384 |
14 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
14 mm |
CMOS |
1400 mA |
1.14 V |
128 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PBGA-B515 |
3 |
Not Qualified |
800 rpm |
YES |
e1 |
|||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.2,3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,21X21,25 |
1.08 V |
90 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1 mm |
16384 |
14 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
14 mm |
CMOS |
37 mA |
1.14 V |
128 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PBGA-B515 |
3 |
Not Qualified |
1000 rpm |
YES |
e1 |
|||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.2,1.8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,28X28,16 |
1.08 V |
105 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
.71 mm |
16384 |
12 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
12 mm |
CMOS |
1400 mA |
1.14 V |
128 |
Digital Signal Processors |
.4 mm |
FLOATING POINT |
S-PBGA-B515 |
3 |
Not Qualified |
800 rpm |
YES |
e1 |
|||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
423 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.2,1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA423,24X24,25 |
1.08 V |
105 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.4 mm |
16384 |
16 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
16 mm |
CMOS |
1400 mA |
1.14 V |
128 |
Digital Signal Processors |
.65 mm |
FLOATING POINT |
S-PBGA-B423 |
3 |
Not Qualified |
800 rpm |
YES |
e1 |
|||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
423 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.2,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA423,24X24,25 |
1.08 V |
90 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.4 mm |
16384 |
16 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
16 mm |
CMOS |
37 mA |
1.14 V |
128 |
Digital Signal Processors |
.65 mm |
FLOATING POINT |
S-PBGA-B423 |
3 |
Not Qualified |
1000 rpm |
YES |
e1 |
|||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
13 |
32 |
1.2,1.8/3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.14 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
24 mm |
YES |
16 |
50 MHz |
30 |
260 |
24 mm |
CMOS |
1.2 V |
Microprocessors |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
4 |
Not Qualified |
375 rpm |
YES |
e4 |
|||||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.35 V |
13 |
32 |
1.3,1.8/3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.25 V |
90 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
24 mm |
YES |
16 |
50 MHz |
30 |
260 |
24 mm |
CMOS |
1.3 V |
Microprocessors |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
4 |
Not Qualified |
456 rpm |
YES |
e4 |
|||||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.1,1.8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,26X26,20 |
.9 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 mm |
65536 |
14 mm |
YES |
16 |
54 MHz |
30 |
260 |
14 mm |
CMOS |
800 mA |
1.1 V |
Microprocessors |
.5 mm |
FLOATING POINT |
S-PBGA-B515 |
3 |
Not Qualified |
800 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.1,1.8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,26X26,20 |
.9 V |
90 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 mm |
65536 |
14 mm |
YES |
16 |
54 MHz |
30 |
260 |
14 mm |
CMOS |
900 mA |
1.1 V |
Microprocessors |
.5 mm |
FLOATING POINT |
S-PBGA-B515 |
3 |
Not Qualified |
1000 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.1,1.8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,28X28,16 |
.9 V |
105 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
.71 mm |
65536 |
12 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
12 mm |
CMOS |
800 mA |
1.1 V |
Microprocessors |
.5 mm |
FLOATING POINT |
S-PBGA-B515 |
3 |
Not Qualified |
800 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.1,1.8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,28X28,16 |
.9 V |
90 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
.71 mm |
65536 |
12 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
12 mm |
CMOS |
900 mA |
1.1 V |
Microprocessors |
.5 mm |
FLOATING POINT |
S-PBGA-B515 |
3 |
Not Qualified |
1000 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
423 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.1,1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA423,24X24,25 |
.9 V |
105 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.4 mm |
65536 |
16 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
16 mm |
CMOS |
800 mA |
1.1 V |
Microprocessors |
.65 mm |
FLOATING POINT |
S-PBGA-B423 |
3 |
Not Qualified |
800 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
423 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.1,1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA423,24X24,25 |
.9 V |
90 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.4 mm |
65536 |
16 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
16 mm |
CMOS |
900 mA |
1.1 V |
Microprocessors |
.65 mm |
FLOATING POINT |
S-PBGA-B423 |
3 |
Not Qualified |
1000 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.1,1.8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,26X26,20 |
.9 V |
90 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 mm |
65536 |
14 mm |
YES |
16 |
54 MHz |
30 |
260 |
14 mm |
CMOS |
900 mA |
1.1 V |
Microprocessors |
.5 mm |
FLOATING POINT |
S-PBGA-B515 |
3 |
Not Qualified |
1000 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.1,1.8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,28X28,16 |
.9 V |
105 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
.71 mm |
65536 |
12 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
12 mm |
CMOS |
800 mA |
1.1 V |
Microprocessors |
.5 mm |
FLOATING POINT |
S-PBGA-B515 |
3 |
Not Qualified |
800 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.1,1.8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,28X28,16 |
.9 V |
90 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
.71 mm |
65536 |
12 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
12 mm |
CMOS |
900 mA |
1.1 V |
Microprocessors |
.5 mm |
FLOATING POINT |
S-PBGA-B515 |
3 |
Not Qualified |
1000 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
423 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.1,1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA423,24X24,25 |
.9 V |
105 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.4 mm |
65536 |
16 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
16 mm |
CMOS |
800 mA |
1.1 V |
Microprocessors |
.65 mm |
FLOATING POINT |
S-PBGA-B423 |
3 |
Not Qualified |
800 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
423 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2 V |
8 |
26 |
32 |
1.1,1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA423,24X24,25 |
.9 V |
90 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.4 mm |
65536 |
16 mm |
YES |
16 |
54 MHz |
NOT SPECIFIED |
260 |
16 mm |
CMOS |
900 mA |
1.1 V |
Microprocessors |
.65 mm |
FLOATING POINT |
S-PBGA-B423 |
3 |
Not Qualified |
1000 rpm |
YES |
e1 |
||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
491 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.248 V |
8 |
16 |
16 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA491,25X25,25 |
1.152 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
65536 |
17 mm |
YES |
16 |
26 MHz |
30 |
260 |
17 mm |
CMOS |
1400 mA |
1.2 V |
32 |
Microprocessors |
.65 mm |
FLOATING POINT |
S-PBGA-B491 |
3 |
Not Qualified |
600 rpm |
YES |
e1 |
|||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
491 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.248 V |
8 |
16 |
16 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA491,25X25,25 |
1.152 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
65536 |
17 mm |
YES |
16 |
26 MHz |
30 |
260 |
17 mm |
CMOS |
1500 mA |
1.2 V |
32 |
Microprocessors |
.65 mm |
FLOATING POINT |
S-PBGA-B491 |
3 |
Not Qualified |
600 rpm |
YES |
e1 |
|||||||||||||||||||||
|
|
Freescale Semiconductor |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
24 |
32 |
1.5,1.8/3.3 |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
1.4 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER OVER NICKEL |
BOTTOM |
1.6 mm |
15 mm |
YES |
32 |
40 MHz |
40 |
260 |
15 mm |
CMOS |
1.5 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B196 |
3 |
Not Qualified |
166.67 rpm |
YES |
||||||||||||||||||||||||||
|
|
Freescale Semiconductor |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
24 |
32 |
1.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
1.4 V |
85 Cel |
COLDFIRE |
-40 Cel |
TIN SILVER COPPER OVER NICKEL |
BOTTOM |
1.6 mm |
15 mm |
YES |
32 |
40 |
260 |
15 mm |
65536 |
CMOS |
150 mA |
Microcontrollers |
1 mm |
FIXED POINT |
S-PBGA-B196 |
3 |
Not Qualified |
150 rpm |
YES |
||||||||||||||||||||||||||
|
|
Freescale Semiconductor |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
24 |
32 |
1.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
1.4 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER OVER NICKEL |
BOTTOM |
1.6 mm |
15 mm |
YES |
32 |
40 |
260 |
15 mm |
CMOS |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B196 |
3 |
Not Qualified |
100 rpm |
YES |
||||||||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
13 |
32 |
1.2,1.8/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.14 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.05 mm |
17 mm |
YES |
32 |
50 MHz |
30 |
260 |
17 mm |
CMOS |
1.2 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
375 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.35 V |
13 |
32 |
1.3,1.8/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.25 V |
90 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.05 mm |
17 mm |
YES |
32 |
50 MHz |
30 |
260 |
17 mm |
CMOS |
1.3 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
456 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1,1.2,1.8,1.8/3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,28X28,16 |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
.9 mm |
12 mm |
30 |
260 |
12 mm |
CMOS |
Graphics Processors |
.4 mm |
S-PBGA-B515 |
3 |
Not Qualified |
600 rpm |
e1 |
||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1,1.2,1.8,1.8/3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,26X26,20 |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
.95 mm |
14 mm |
30 |
260 |
14 mm |
CMOS |
Graphics Processors |
.5 mm |
S-PBGA-B515 |
3 |
Not Qualified |
e1 |
|||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
13 |
32 |
1.2,1.8/3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
24 mm |
YES |
16 |
50 MHz |
30 |
260 |
24 mm |
CMOS |
1.2 V |
Microprocessors |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
4 |
Not Qualified |
375 rpm |
YES |
e4 |
|||||||||||||||||||||||||||
|
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
100 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
40 |
1.1,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.05 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
98304 |
14 mm |
YES |
16 |
25 MHz |
14 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G100 |
3 |
Not Qualified |
350 rpm |
NO |
e3 |
||||||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
684 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
8 |
28 |
32 |
0.95/1.35 |
GRID ARRAY, FINE PITCH |
BGA684,28X28,32 |
105 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.06 mm |
786432 |
23 mm |
YES |
16 |
30 MHz |
NOT SPECIFIED |
250 |
23 mm |
CMOS |
1.35 V |
64 |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B684 |
4 |
Not Qualified |
800 rpm |
YES |
e1 |
||||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1031 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
8 |
28 |
32 |
1 |
GRID ARRAY, FINE PITCH |
BGA1031,37X37,25 |
.95 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.31 mm |
65536 |
25 mm |
YES |
16 |
27 MHz |
30 |
245 |
25 mm |
CMOS |
1 V |
72 |
Microprocessors |
.65 mm |
FLOATING POINT |
S-PBGA-B1031 |
4 |
Not Qualified |
1200 rpm |
YES |
e1 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.