INDUSTRIAL Microprocessors 294

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
OMAP3530DCUSA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		26	32	1.1,1.2,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.71 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm		YES	16	59 MHz	30	260	16 mm		CMOS		1.8 V			Graphics Processors		.65 mm	FLOATING POINT	S-PBGA-B423	4	Not Qualified	600 rpm	YES	e1
OMAP3530DZCBBA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			26		1.1,1.8,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16		105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	.9 mm			12 mm		YES	16	59 MHz	30	260	12 mm		CMOS					Graphics Processors		.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	600 rpm	YES	e1
KMPC8343CVRAGDB	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel			-40 Cel	TIN SILVER	BOTTOM	2.46 mm			29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm		CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
KMPC8347ECVRAGDB	Freescale Semiconductor	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel			-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	2.46 mm			29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm		CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
DM3730CBPD100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,23X23,20	1.08 V	90 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm		16384	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm		CMOS	37 mA	1.14 V	128		Digital Signal Processors		.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	1000 rpm	YES	e1
AM3505AZCNA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	16	16	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.152 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		65536	17 mm		YES	16	26 MHz	30	260	17 mm		CMOS	1400 mA	1.2 V	32		Microprocessors		.65 mm	FLOATING POINT	S-PBGA-B491	3	Not Qualified	600 rpm	YES	e1
AM3505AZERA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm		65536	23 mm		YES	16	26 MHz	30	260	23 mm		CMOS	1400 mA	1.2 V	32		Microprocessors		1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
AM3517AZCNA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	16	16	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.152 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		65536	17 mm		YES	16	26 MHz	30	260	17 mm		CMOS	1500 mA	1.2 V	32		Microprocessors		.65 mm	FLOATING POINT	S-PBGA-B491	3	Not Qualified	600 rpm	YES	e1
AM3517AZERA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm		65536	23 mm		YES	16	26 MHz	30	260	23 mm		CMOS	1500 mA	1.2 V	32		Microprocessors		1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
CP3BT26Y98ACKX/NOPB	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	2.75 V		23	16	2.5,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	2.25 V	85 Cel	CR16C		-40 Cel	MATTE TIN	QUAD	1.6 mm	262144		20 mm		YES	16		30	260	20 mm	32768	CMOS	20 mA	2.5 V			Microcontrollers	FLASH	.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified	24 rpm	YES	e3
SPEAR310-2	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		0	32	1.2,1.8,3.3	GRID ARRAY	BGA289,17X17,32	1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm			15 mm		YES	0		30	260	15 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	333 rpm	YES	e1
MPC8308CVMAGD	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				1,1.8,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	.95 V	105 Cel			-40 Cel		BOTTOM	1.54 mm			19 mm		YES		66.67 MHz	40	260	19 mm		CMOS		1 V		2	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B473	3	Not Qualified	400 rpm	YES	e2
AM1802EZWTD3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		172032	16 mm		YES	16	30 MHz	30	260	16 mm		CMOS		1.2 V	80				.8 mm	FIXED POINT	S-PBGA-B361	3		300 rpm	YES	e1
AM1806EZCEA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		172032	13 mm		YES	16	30 MHz	30	260	13 mm		CMOS		1.2 V	80				.65 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1806EZCED4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		172032	13 mm		YES	16	30 MHz	30	260	13 mm		CMOS		1.3 V	80				.65 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1806EZWTD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		172032	16 mm		YES	16	30 MHz	30	260	16 mm		CMOS		1.3 V	80				.8 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1808EZCEA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm			13 mm		YES	16	30 MHz	30	260	13 mm		CMOS		1.2 V					.65 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1808EZCED4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm			13 mm		YES	16	30 MHz	30	260	13 mm		CMOS		1.3 V					.65 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1808EZWTA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm		YES	16	30 MHz	30	260	16 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1810EZWTA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	14	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		131072	16 mm		YES	16	50 MHz	30	260	16 mm		CMOS	.31 mA	1.2 V	64				.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM3352ZZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			15 mm		YES	16	26 MHz	30	260	15 mm		CMOS							.8 mm	FIXED POINT	S-PBGA-B324	3		600 rpm	YES	e1
DM388AAARD21	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		655360	16 mm		YES	16	30 MHz	30	260	16 mm		CMOS		1.35 V	72				.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
AM1808BZCEA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.14 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm			13 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	13 mm		CMOS		1.2 V			Microprocessors		.65 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	375 rpm	YES	e1
AM1808BZCED4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.25 V	90 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm			13 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	13 mm		CMOS		1.3 V			Microprocessors		.65 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
AM1808BZWTD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.25 V	90 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	16 mm		CMOS		1.3 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
Z84C0006PEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V	0	16	8		IN-LINE		4.5 V	100 Cel		2	-40 Cel	MATTE TIN	DUAL	4.75 mm		0	15.24 mm	DRAM REFRESH COUNTER	NO	8	6.17 MHz			52.325 mm		CMOS	30 mA	5 V	0	0			2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	6.17 rpm	YES	e3
Z84C0008PEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V	0	16	8		IN-LINE		4.5 V	100 Cel		2	-40 Cel	MATTE TIN	DUAL	4.75 mm		0	15.24 mm	DRAM REFRESH COUNTER	NO	8	8 MHz			52.325 mm		CMOS	40 mA	5 V	0	0			2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	8 rpm	YES	e3
Z84C0010PEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V	0	16	8		IN-LINE		4.5 V	100 Cel		2	-40 Cel	MATTE TIN	DUAL	4.75 mm		0	15.24 mm	DRAM REFRESH COUNTER	NO	8	10 MHz			52.325 mm		CMOS	50 mA	5 V	0	0			2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	10 rpm	YES	e3
Z84C0006VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel		2	-40 Cel	Matte Tin (Sn)	QUAD	4.57 mm		0	16.5862 mm	DRAM MEMORY REFRESH COUNTER	NO	8	6.17 MHz	40	260	16.5862 mm		CMOS	30 mA	5 V	0	0	Microprocessors		1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	6.17 rpm	YES	e3
Z84C0008VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel		2	-40 Cel	Matte Tin (Sn)	QUAD	4.57 mm		0	16.5862 mm	DRAM MEMORY REFRESH COUNTER	NO	8	8 MHz	40	260	16.5862 mm		CMOS	40 mA	5 V	0	0	Microprocessors		1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	8 rpm	YES	e3
Z84C0010VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel		2	-40 Cel	Matte Tin (Sn)	QUAD	4.57 mm		0	16.5862 mm	DRAM MEMORY REFRESH COUNTER	NO	8	10 MHz	40	260	16.5862 mm		CMOS	50 mA	5 V	0	0	Microprocessors		1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	10 rpm	YES	e3
SVF312R3K2CKU2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		0			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.16 V	85 Cel			-40 Cel	TIN	QUAD	1.6 mm			24 mm		YES	0		40	260	24 mm		CMOS		1.23 V					.5 mm	FLOATING POINT	S-PQFP-G176	3		266 rpm	YES	e3
AM5706BCBDDA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm			17 mm	OPERATES AT 0.85V NOMINAL SUPPLY AFTER AVS ENABLE	YES	32	32 MHz	NOT SPECIFIED	260	17 mm		CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
AM5706BCBDDEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm			17 mm		YES	32	38.4 MHz	NOT SPECIFIED	260	17 mm		CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
AM5706BCBDJA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm			17 mm		YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5706BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm			17 mm		YES	32	38.4 MHz	NOT SPECIFIED	260	17 mm		CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5708BCBDJA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm			17 mm		YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5708BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm			17 mm		YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5708BCBDJAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm			17 mm		YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5708BCBDJEAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm			17 mm		YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5706BCBDDAS	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, FINE PITCH		1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM				17 mm	ALSO OPERATES AT 0.85 V TO 1.15 V AFTER AVS ENABLED	YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
ADSP-21489KCPZ-4	Analog Devices	MICROPROCESSOR	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.15 V	1	24	40		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.05 V	115 Cel		3	0 Cel		QUAD	.9 mm		5242880	12 mm		YES	16		30	260	12 mm		CMOS	500 mA	1.1 V	65				.5 mm	FLOATING POINT	S-XQCC-N88	3		400 rpm	NO
AM5708BCBDJAS	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.298 mm			17 mm	GPMC CONSISTS OF 28-BIT ADDRESS LINES AND 16-BIT DATA LINES	YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
ATSAMA5D27C-LD1G-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel			-40 Cel		BOTTOM	1.2 mm		32768	16 mm		YES	0	24 MHz			16 mm		CMOS		1.8 V	51	1			.8 mm	FIXED POINT	S-PBGA-G361			500 rpm	YES
ATSAMA5D27C-LD1G-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel			-40 Cel		BOTTOM	1.2 mm		32768	16 mm		YES	0	24 MHz			16 mm		CMOS		1.8 V	51	1			.8 mm	FIXED POINT	S-PBGA-G361			500 rpm	YES
ATSAMA5D27C-LD2G-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel			-40 Cel		BOTTOM	1.2 mm		32768	16 mm		YES	0	24 MHz			16 mm		CMOS		1.8 V	51	1			.8 mm	FIXED POINT	S-PBGA-G361			500 rpm	YES
AM5746ABZXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm			23 mm		YES	32	38.4 MHz	30	250	23 mm		CMOS		1.15 V					.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5746ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm			23 mm		YES	32	38.4 MHz	30	250	23 mm		CMOS		1.15 V					.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.