INDUSTRIAL Microprocessors 294

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Connectivity	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
ATSAMA5D27C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel	1	-40 Cel		BOTTOM	1.4 mm		131072	14 mm		ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32			.8 mm	FLOATING POINT	S-PBGA-B289		500 rpm	YES
ATSAMA5D27C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm		131072	14 mm		ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32			.8 mm	FLOATING POINT	S-PBGA-B289		500 rpm	YES
ATSAMA5D225C-D1M-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	16		0	16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm		65536	11 mm			YES	0	24 MHz			11 mm	CMOS		1.2 V	51	1		.75 mm	FIXED POINT	S-PBGA-B196		500 rpm	YES	e2
ATSAMA5D41B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm		131072	14 mm			YES	16	50 MHz			14 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B289		600 rpm	YES
ATSAMA5D42B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm		131072	16 mm			YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B361		600 rpm	YES
ATSAMA5D44B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm		131072	16 mm			YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B361		600 rpm	YES
MCIMX6L2EVN10AC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL		TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V					GRID ARRAY, THIN PROFILE, FINE PITCH		1.375 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm			13 mm						40	260	13 mm	CMOS						.5 mm		S-PBGA-B	3			e1
MCIMX6L3EVN10AC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL		TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V					GRID ARRAY, THIN PROFILE, FINE PITCH		1.375 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm			13 mm						40	260	13 mm	CMOS						.5 mm		S-PBGA-B	3			e1
AMIC120BZDNA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		16	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	0	524288	17 mm	0	ALSO HAVING 28-BIT ADDRESS AND 16-BIT DATA OF GPMC	YES	32		30	260	17 mm	CMOS	600 mA	1.1 V	64	4	CAN, ETHERNET, I2C, SPI(2), UART, USB	.65 mm	FIXED POINT	S-PBGA-B491	3	300 rpm	YES	e1
STA1080EOA	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		-40 Cel		BOTTOM	1.7 mm			16 mm			YES			NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS						.8 mm	FIXED POINT	S-PBGA-B361		450 rpm	NO
STA1090HOA	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		-40 Cel		BOTTOM	1.7 mm			16 mm			YES			NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS						.8 mm	FIXED POINT	S-PBGA-B361		533 rpm	NO
T2081NXE8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T2081NXE8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NXE8PTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NXE8T1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NXE8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NXN8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T2081NXN8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NXN8PTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NXN8T1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NXN8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
FS32V232BMN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel		BOTTOM	2.44 mm		4194304	17 mm			YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3	800 rpm	YES
FS32V234BJN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel	TIN SILVER	BOTTOM	2.44 mm		4194304	17 mm			YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3	800 rpm	YES	e2
FS32V234BLN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel	TIN SILVER	BOTTOM	2.44 mm		4194304	17 mm			YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3	800 rpm	YES	e2
FS32V234BMN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel	TIN SILVER	BOTTOM	2.44 mm		4194304	17 mm			YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3	800 rpm	YES	e2
FS32V234CKN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel	TIN SILVER	BOTTOM	2.44 mm		4194304	17 mm			YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3	1000 rpm	YES	e2
FS32V234CMN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel	TIN SILVER	BOTTOM	2.44 mm		4194304	17 mm			YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3	1000 rpm	YES	e2
FS32V234CON1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel	TIN SILVER	BOTTOM	2.44 mm		4194304	17 mm			YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3	1000 rpm	YES	e2
SVF311R3K2CKU2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			0		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.16 V	85 Cel		-40 Cel	TIN	QUAD	1.6 mm			24 mm			YES	0		40	260	24 mm	CMOS		1.23 V				.5 mm	FLOATING POINT	S-PQFP-G176	3	266 rpm	YES	e3
CP3CN37VVAWQX/NOPB	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.7 V			20		FLATPACK, LOW PROFILE, FINE PITCH		2.7 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm			20 mm			YES	16		30	260	20 mm	CMOS		3.3 V				.5 mm	FIXED POINT	S-PQFP-G144	3	96 rpm	YES	e3
LS1043AXE7QQB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V			16	64	GRID ARRAY, FINE PITCH		.87 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm			21 mm		ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	21 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B621	3	1600 rpm	YES	e1
SAM9X60D5M-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm		69632	14 mm		512-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16			.8 mm	FIXED POINT	R-PBGA-B233	3	600 rpm	YES	e1
AT97SC3205T-H3M4C00B	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES				0	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		85 Cel		-40 Cel		QUAD	.9 mm			4 mm			NO	0				4 mm	CMOS		3.3 V				.4 mm	FIXED POINT	S-PQCC-N32			NO
AT97SC3205T-H3M4C10B	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES				0	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		85 Cel		-40 Cel		QUAD	.9 mm			4 mm			NO	0				4 mm	CMOS		3.3 V				.4 mm	FIXED POINT	S-PQCC-N32			NO
T1023NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm			19 mm			YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T2080NXE8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES	YES					64	GRID ARRAY	BGA896(UNSPEC)		105 Cel		-40 Cel		BOTTOM							NO			30	250		CMOS							FIXED POINT	S-PBGA-B896	3	1200 rpm	NO
T2080NXN8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES	YES					64	GRID ARRAY	BGA896(UNSPEC)		105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM							NO			30	250		CMOS							FIXED POINT	S-PBGA-B896	3	1533 rpm	NO	e1
STM32MP157DAC1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm		724992	12 mm			YES	0	64 MHz			12 mm	CMOS	865 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B361		800 rpm	YES
STM32MP157DAA1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	105 Cel		-20 Cel		BOTTOM	1.32 mm		724992	18 mm			YES	0	64 MHz			18 mm	CMOS	865 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B448		800 rpm	YES
OSD3358-512M-IND	Octavo Systems	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	NO	YES		8		28		GRID ARRAY	BGA400,20X20,50		85 Cel	1	-40 Cel		BOTTOM	2.6 mm		65536	27 mm		64kbytes shared l3 ram also available	YES	16			245	27 mm	CMOS	2000 mA	1.1 V				1.27 mm	FIXED POINT	S-PBGA-B400	4	1000 rpm	NO
MC8640DTHJ1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V			32	32	GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		-40 Cel		BOTTOM	2.97 mm			33 mm			YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3	1250 rpm	NO
LX2080XC71826B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm			40 mm			YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2080XC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm			40 mm			YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2080XE72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel		BOTTOM	3.51 mm			40 mm			YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3	2200 rpm	YES
LX2080XN72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm			40 mm			YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2120XC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm			40 mm			YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2120XN71826B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm			40 mm			YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2120XN72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm			40 mm			YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.