INDUSTRIAL Microprocessors 294

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

LX2160XE71826B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

1800 rpm

YES

e1

LX2160XE72029B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2000 rpm

YES

e1

LX2080XE71826B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

1800 rpm

YES

e1

LX2120XE72029B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2000 rpm

YES

e1

LX2080XN72232B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

e1

LX2120XE71826B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

1800 rpm

YES

e1

LX2120XN72232B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

e1

LX2160XC71826B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

1800 rpm

YES

LX2160XE72232B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

LX2160XN71826B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

1800 rpm

YES

e1

LX2160XN72232B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

e1

LX2080XC72232B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

e1

LX2080XE72029B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2000 rpm

YES

e1

LX2080XN71826B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

1800 rpm

YES

e1

LX2120XC71826B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

1800 rpm

YES

LX2120XC72232B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

e1

LX2120XE72232B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

LX2160XC72029B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2000 rpm

YES

e1

LX2160XC72232B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

e1

LX2160XN72029B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2000 rpm

YES

e1

LS1012AXE7HKB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

NO LEAD

211

VFLGA

SQUARE

UNSPECIFIED

YES

YES

.93 V

16

64

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.87 V

105 Cel

-40 Cel

BOTTOM

.925 mm

9.6 mm

YES

16

25 MHz

40

260

9.6 mm

CMOS

.9 V

.5 mm

FIXED POINT

S-XBGA-N211

3

800 rpm

YES

LS1012AXN7KKB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

NO LEAD

211

VFLGA

SQUARE

UNSPECIFIED

YES

YES

.93 V

16

64

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.87 V

105 Cel

-40 Cel

BOTTOM

.925 mm

9.6 mm

YES

16

25 MHz

40

260

9.6 mm

CMOS

.9 V

.5 mm

FIXED POINT

S-XBGA-N211

3

1000 rpm

YES

LS1012AXN7EKB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

NO LEAD

211

VFLGA

SQUARE

UNSPECIFIED

YES

YES

.93 V

16

64

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.87 V

105 Cel

-40 Cel

BOTTOM

.925 mm

9.6 mm

YES

16

25 MHz

40

260

9.6 mm

CMOS

.9 V

.5 mm

FIXED POINT

S-XBGA-N211

3

600 rpm

YES

LS1012AXN7HKB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

NO LEAD

211

VFLGA

SQUARE

UNSPECIFIED

YES

YES

.93 V

16

64

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.87 V

105 Cel

-40 Cel

BOTTOM

.925 mm

9.6 mm

YES

16

25 MHz

40

260

9.6 mm

CMOS

.9 V

.5 mm

FIXED POINT

S-XBGA-N211

3

800 rpm

YES

LS1012AXE7EKB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

NO LEAD

211

VFLGA

SQUARE

UNSPECIFIED

YES

YES

.93 V

16

64

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.87 V

105 Cel

-40 Cel

BOTTOM

.925 mm

9.6 mm

YES

16

25 MHz

40

260

9.6 mm

CMOS

.9 V

.5 mm

FIXED POINT

S-XBGA-N211

3

600 rpm

YES

T1040NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

YES

64

30

250

23 mm

CMOS

1 V

8

.8 mm

FIXED POINT

S-PBGA-B780

3

1400 rpm

YES

e1

T1040NXN7MQB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

12

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

YES

64

30

250

23 mm

CMOS

1 V

8

.8 mm

FIXED POINT

S-PBGA-B780

3

1200 rpm

YES

e1

P1010NXE5FFB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

-40 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

32

40

260

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

3

667 rpm

NO

e2

P1010NXN5KHB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

-40 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

32

40

260

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

3

1000 rpm

NO

e2

P1010NXE5HFB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

-40 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

32

40

260

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

3

800 rpm

NO

e2

P1010NXE5KHB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

-40 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

32

40

260

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

3

1000 rpm

NO

e2

P1010NXN5FFB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

-40 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

32

40

260

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

3

667 rpm

NO

e2

P1010NXN5DFB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

-40 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

32

40

260

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

3

533 rpm

NO

e2

MIMXRT1024CAG4A

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

0

32

FLATPACK, LOW PROFILE, FINE PITCH

QFP144,.87SQ,20

1.15 V

105 Cel

0

-40 Cel

QUAD

1.6 mm

262144

20 mm

YES

0

24 MHz

40

260

20 mm

CMOS

90 mA

32

20

.5 mm

FLOATING-POINT

S-PQFP-G144

3

396 rpm

YES

LS1012AXE7HKA

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

NO LEAD

211

VFLGA

SQUARE

UNSPECIFIED

YES

YES

.93 V

16

64

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.87 V

105 Cel

-40 Cel

BOTTOM

.925 mm

9.6 mm

YES

16

25 MHz

40

260

9.6 mm

CMOS

.9 V

.5 mm

FIXED POINT

S-XBGA-N211

3

800 rpm

YES

LS1012AXN7EKA

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

NO LEAD

211

VFLGA

SQUARE

UNSPECIFIED

YES

YES

.93 V

16

64

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.87 V

105 Cel

-40 Cel

BOTTOM

.925 mm

9.6 mm

YES

16

25 MHz

40

260

9.6 mm

CMOS

.9 V

.5 mm

FIXED POINT

S-XBGA-N211

3

600 rpm

YES

T1023NXN7KQA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1000 rpm

YES

e1

T1023NXN7MQA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1200 rpm

YES

e1

T1023NXE7KQA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1000 rpm

YES

e1

T1023NXE7MQA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1200 rpm

YES

e1

T1023NXN7PQA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1400 rpm

YES

e1

T1013NXE7KQA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1000 rpm

YES

e1

T1013NXE7MQA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1200 rpm

YES

e1

T1013NXE7PQA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1400 rpm

YES

e1

T1013NXN7PQA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1400 rpm

YES

e1

T1013NXN7MQA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1200 rpm

YES

e1

T1013NXN7KQA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1000 rpm

YES

e1

AM6548BACDXEAF

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

8

28

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA784,28X28,32

1.05 V

105 Cel

1

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2097152

23 mm

YES

16

27 MHz

250

23 mm

CMOS

1.1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B784

3

1100 rpm

YES

e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.