MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 1,514

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code	No. of I/O Lines
XAZU2EG-1SBVA484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	19 mm				30	250	19 mm		CMOS	.85 V		.8 mm	S-PBGA-B484	3	e1
XAZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm				30	250	21 mm		CMOS	.85 V		.8 mm	S-PBGA-B625	3	e1
XAZU2EG-1SFVA625Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm				30	250	21 mm		CMOS	.85 V		.8 mm	S-PBGA-B625	3	e1
XAZU2EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm		CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU2EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm		CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU2EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm				30	250	21 mm		CMOS	.72 V		.8 mm	S-PBGA-B625	3	e1
XAZU2EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm		CMOS	.72 V		.8 mm	S-PBGA-B784	4	e1
XAZU3EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm				30	250	21 mm		CMOS	.85 V		.8 mm	S-PBGA-B625	3	e1
XAZU3EG-1SFVA625Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm				30	250	21 mm		CMOS	.85 V		.8 mm	S-PBGA-B625	3	e1
XAZU3EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm		CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU3EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm		CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU3EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm				30	250	21 mm		CMOS	.72 V		.8 mm	S-PBGA-B625	3	e1
XAZU3EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm		CMOS	.72 V		.8 mm	S-PBGA-B784	4	e1
XAZU4EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm		CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU4EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm		CMOS	.72 V		.8 mm	S-PBGA-B784	4	e1
XAZU5EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm		CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU5EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm		CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm		CMOS	.72 V		.8 mm	S-PBGA-B784	4	e1
TCI6636K2HDDAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm	40 mm				30	245	40 mm		CMOS	1 V		1 mm	S-PBGA-B1517	4	e1
TCI6636K2HDXAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm	40 mm				30	245	40 mm		CMOS	1 V		1 mm	S-PBGA-B1517	4	e1
TCI6636K2HDXAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm	40 mm				30	245	40 mm		CMOS	1 V		1 mm	S-PBGA-B1517	4	e1
TCI6636K2HDXAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm	40 mm				30	245	40 mm		CMOS	1 V		1 mm	S-PBGA-B1517	4	e1
TCI6636K2HDXAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm	40 mm				30	245	40 mm		CMOS	1 V		1 mm	S-PBGA-B1517	4	e1
AX-SFUS-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	1 mm	5 mm				30	260	7 mm		CMOS	3 V		.5 mm	R-XQCC-N40	1
AX-SFUS-API-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	1 mm	5 mm				30	260	7 mm		CMOS	3 V		.5 mm	R-XQCC-N40	1
DRA781BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		48	32 MHz	30	250	15 mm		CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA781BRGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		48	32 MHz	30	250	15 mm		CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA782BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		48	32 MHz	30	250	15 mm		CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA782BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		48	32 MHz	30	250	15 mm		CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA783BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		48	32 MHz	30	250	15 mm		CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA786BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		48	32 MHz	30	250	15 mm		CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA786BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		48	32 MHz	30	250	15 mm		CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA787BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		48	32 MHz	30	250	15 mm		CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA787BRGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		48	32 MHz	30	250	15 mm		CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DM505LRBABFR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm		CMOS	1.06 V	I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DM505LRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm		CMOS	1.06 V	I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DM505MRBABFR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm		CMOS	1.06 V	I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DM505MRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm		CMOS	1.06 V	I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA780BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		48	32 MHz	30	250	15 mm		CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA780BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		48	32 MHz	30	250	15 mm		CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
TCI6636K2HDSAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm	40 mm				30	245	40 mm		CMOS	1 V		1 mm	S-PBGA-B1517	4	e1
AX-SIP-SFEU-1-01-TX30	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	44	HVBCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel	-30 Cel	NICKEL GOLD PALLADIUM	BOTTOM	.996 mm	7 mm				30	260	9 mm		CMOS	3 V			R-XBCC-B44	3
AX-SIP-SFEU-API-1-01-TX30	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	44	HVBCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel	-30 Cel	NICKEL GOLD PALLADIUM	BOTTOM	.996 mm	7 mm				30	260	9 mm		CMOS	3 V			R-XBCC-B44	3
NRF52810-QFAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel		QUAD	.95 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm		CMOS	3 V		.4 mm	S-XQCC-N48
CC1312R1F3RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	7 mm	DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF			30	260	7 mm	81920	CMOS	3 V		.5 mm	S-PQCC-N48	3	e4	30
DLPC3437CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	1 mm	13 mm				30	260	13 mm		CMOS	1.1 V		.8 mm	S-PBGA-B201	3	e1
ATWINC1500-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949	MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel	-40 Cel		UNSPECIFIED	2.11 mm	14.73 mm			48 MHz	NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS	3.3 V			R-XXMA-N28
ATWINC1510-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949	MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel	-40 Cel		UNSPECIFIED	2.11 mm	14.73 mm			48 MHz			21.72 mm		CMOS	3.3 V			R-XXMA-N28

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.